Abstract:

As integrated circuit geometries become smaller and package sizes and E/O counts increase, there is an increased potential of failures resulting from moisture ingress and corrosion.  To aid in reliability prediction, design for reliability, and assessing reliability tradeoffs, a methodology for coupling the mechanisms of moisture ingress and corrosion in microelectronic packages into a first-order failure rate model is presented.  The model focuses on aluminum metallization corrosion resulting from chlorine-based contaminants, but is general enough to be applied to other cases.
 

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