Abstract:

Two general approaches are available for assessing reliability of electronics during design: Device failure-rate prediction, and physics-of-failure.  This article broadly compares these two approaches in a way that is readily understandable by the wide range of readers concerned with the design, manufacture, and support of electronic equipment.  The most prominent device failure-rate prediction methodology, US Mil-Hdbk-217, does not provide the designer or manufacturer with any insight into, or control over, the actual causes of failure since the cause-and-effect relationships impacting reliability; this problem results in an inability to tailor a Mil-Hdbk-217 prediction using these key parameters.  Physics-of-failure methodology is an approach to design, reliability assessment, testing, screening, and stress margins that uses knowledge of root-cause failure mechanisms to prevent product failures through robust design & manufacturing practices.  This approach proactively incorporates reliability into the design process by establishing a scientific basis for evaluating new materials, structures, and electronic technologies.  This approach encourages innovative, cost-effective design through realistic reliability assessment.
 

Complete article is available to CALCE Consortium Members.