Plastic Packages Microcircuits: Quality, Reliability, Realibility and Cost Issues
M. Pecht, R. Agarwal, and D. Quearry
Abstract:
Plastic encapsulated microcircuits (PEMs) find their main application
in commercial and telecommunication electronics. The advantages of
PEMs in cost, size, weight, performance, and market lead time, have attracted
97% of the market share of worldwide microcircuit sales. However,
PEMs have always been resisted in US Government and military applications
due to the perception that PEM reliability is low. This paper surveys
plastic packaging with respect to the issues of reliability, market lead-time,
performance, cost, and weight as a means to guide part-selection and system-design.
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