An Approach to the Development of Package Design Guidelines
M. Pecht, D. Barker, and A. Dasgupta
ISHM, November/December 1992
Abstract:
This paper presents an approach to the development of design guidelines
for integrated circuits, hybrid, and multi-chip packages. The approach
is based on the physics of failure principles. The paper discusses
key design constraints and design goals is to develop a packaging architecture
which incorporates information ranging from the dies to be packaged to
the package-mounting platform (i.e, circuit card), using the compatible
materials, interfaces and geometric configurations based on tradeoffs between
competing goals tolerances, and constraints.
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