Reliability Evaluation of Plastic Encapsulated Parts
L. Weil, M. Pecht and E. Hakim
Abstract:
This paper compares the failure rates of several families of plastic
encapsulated microcircuits (PEMs) using both field & test data (test
data are converted to device failure rates for field conditions using common
acceleration equations) and Mil-Hdbk-217 calculations. Calculated failure
rates are obtained from the Mil-Hdbk-217F for both plastic encapsulated
and ceramic hermetic class-B microcircuits. Comparisons show that the results
from Mil-Hdbk-217 are misleading and that the US military and Government
part-selection methods should not be burdened by this -217 methodology.
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