IEEE Transactions on Components, Packaging, and Manufacturing Technology,
Part A, Vol. 20, No. 2, pp. 252-256, June 1997

Uprating Electronic Components for Use Outside Teir Temperature Specification Limits

M. Wright, D. Humphrey, and P. McCluskey

ABSTRACT:

Uprating is the process to reduce the risk involved in using components and/or systems outside the manufacturer's environmental specifications. These risks can be segregated into three categories:

  1. die reliability: the capability of the die to operate in the desired environment without physical degradation by mechanisms such as electromigration or oxide breakdown.
  2. package reliability: the capability of the packaged component to withstand exposure to the desired environment without failing.

    3. electrical performance: the capability of the component to perform its electronic function in the desired environment...

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