Neeraj Pendsé, Diganta Das, Chris Wilkinson and Michael Pecht
CALCE Electronic Products and Systems Center
University of Maryland, College Park, MD 20742
http://www.calce.umd.edu/
Joel Heebink and John Fink
Honeywell, Inc. Commercial Avionic Systems
Coon Rapids, MN
http://www.honeywell.com/
Lloyd Condra
Boeing Commercial Airplane Group
Seattle, Washington.
http://www.boeing.com/
Abstract:
The availability of electronic parts rated for operating temperature ranges wider than 0-70oC (commercial temperature range) is decreasing, as semiconductor manufacturers are driven by commercial?applications (e.g. computers). The need for parts for higher temperature applications is growing, for applications such as avionics, military and automotive electronics, although their market size is insignificant.Efforts are therefore underway to devise methods for using electronic parts outside the manufacturer specified temperature ranges. This paper presents the stress balancing method for part use outside manufacturer specified temperature range. A step-by-step approach for stress balancing has been presented, and an example of a digital logic part is used to demonstrate these steps.
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