Abstract:

Increasing demands for electronic components that are higher performing, smaller, lighter, and less expensive, has led to rapid technological advances in consumer electronics, personal communications, and information technology markets. As a consequence, semiconductor manufacturers have been more rapidly discontinuing older technology product lines, and introducing improved and /or new versions of the older devices.

This paper discusses technological advancements, such as IC fabrication, feature size, packaging styles, and supply voltages that lead to device obsolescence. Life cycle curves of various IC package styles and device supply voltages and their trends are presented.

Complete article is available to CALCE Consortium Members.