Parameter Re-characterization: A Method of Thermal Uprating

Diganta Das, Neeraj Pendsé and Michael G. Pecht
CALCE Electronic Products and Systems Center
University of Maryland, College Park, MD

Chris Wilkinson
Smiths Industries
Gloucestershire, United Kingdom, GL52 4SF

Abstract:

The availability of electronic parts rated for operating temperature ranges wider than -40 to 85oC is decreasing as semiconductor manufacturers are driven by commercial applications such as computers and communications. The need for parts rated for higher temperature is growing for applications such as avionics, military, and automotive electronics, although their market share is insignificant. Efforts are therefore underway to devise methods for using electronic parts outside the part manufacturers' specified temperature range. This paper presents the "parameter re-characterization" method for part use outside part manufacturers specified temperature range. Step-by-step approach for parameter re-characterization has been presented along with the cautions that need to be undertaken for successful parameter re-characterization.

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