<html><head>
<title>Advanced Thermal-Moisture
Analogy Scheme for
Anisothermal Moisture Diffusion
Problem</title></head>
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<center><i>Journal of Electronic Packaging, Vol. 130, 2008 pp. 011004-1 - 011004-8</i>

<br><h2>Advanced Thermal-Moisture
Analogy Scheme for
Anisothermal Moisture Diffusion
Problem
</h2><br><br><b>Changsoo Jang</b><br><b>Seungbae Park</b><br>Mechanical Engineering,<br>
State University of New York at Binghamton,<br>
Binghamton, NY 13902-6000<br><br>
<b>Bongtae Han <i>Fellow, ASME</i></b><br>
<b>Samson Yoon</b><br>
Mechanical Engineering<br>
University of Maryland<br>
College Park, MD 20742<br>
 

</center>

<b>Abstract:</b>

<p>We propose an advanced thermal-moisture analogy scheme to cope with the inherent
limitations of the existing analogy schemes. The new scheme is based on the experimentally
observed unique hygroscopic behavior of polymeric materials used in microelectronics;
i.e., the saturated concentration is only a function of relative humidity regardless
of temperature. A new analogy formulation based on the modified solubility is presented
and the scheme is implemented to investigate its accuracy and applicability. The results
from a simple case study corroborate that the advanced scheme can be used effectively
for package assemblies subjected to general anisothermal loading conditions.
</p>

<p><a href="../../fulltext/2008/2008jep-Advanced thermal-moisture analogy scheme.pdf">Complete article</a> is available to CALCE Consortium Members.</p>


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