ÿþ<html><head> <title>Pressure-induced Tin Whisker Formation </title></head> <body bgcolor="#ffffff"> <center><i>Microelectronics Reliability, Vol. 48, pp. 1033 1039, 2008</i> <br><h2>Pressure-induced Tin Whisker Formation</h2> <br><br><b>Tadahiro Shibutani</b><br> <b>Qiang Yu</b><br> <b>Masaki Shiratori</b><br> Yokohama National University<br>79-5 Tokiwadai, Hodogaya, Yokohama<br>240-8501 Kanagawa, Japan<br><br> <b>Michael Pecht</b><br> Center for Advanced Life Cycle Engineering (CALCE)<br> University of Maryland<br> College Park, Maryland, USA<br><br><br> </center> <b>Abstract:</b> <p>This paper presents a fundamental assessment of pressure-induced tin whisker formation. A creep-based tin whisker model was developed to explain experimental data as well as data from industrial studies. A grain boundary diffusion model was then developed to predict a maximum whisker length. It is shown that creep properties obtained from samples can be used to screen plating finishes susceptible to tin whiskering. This enables a manufacturer to assess tin whisker risks prior to volume production.</p> <p><a href="../../fulltext/2008/ShibutaniPecht.pdf">Complete article</a> is available to CALCE Consortium Members.</p> <hr><br> <center> [<a href="http://www.calce.umd.edu">Home Page</a>] [<a href="../../">Articles Page</a>] </center> <center><font size="-1">Copyright ýÿ 2008 by CALCE and the University of Maryland, All Rights Reserved </font></center> </body></html>