<html><head>
<title>Assessing the Reliability of Elastomer Sockets
in Temperature Environments</title></head>
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<center><i>IEEE Transactions on Device and Materials Reliability, Vol. 9, Issue 1, pp. 80-86, March 2009</i>

<br><h2>Assessing the Reliability of Elastomer Sockets
in Temperature Environments</h2>
<br><br><b>Leoncio D. Lopez</b>
<br><b>Vidyu Challa</b>
<br><b>Michael G. Pecht, <i>Fellow, IEEE</i></b>
<br>Center for Advanced Life Cycle Engineering (CALCE)<br>
Electronic Products and Systems Center<br>
Department of Mechanical Engineering<br>
University of Maryland<br>
College Park, MD 20742<br>
 

</center>

<b>Abstract:</b>

<p>This paper presents a study on the contact resistance
behavior of elastomer sockets used to interconnect microprocessors
and printed circuit boards in enterprise servers. The
integrated circuit sockets, installed in production representative
assemblies, were evaluated at 25 ◦C, 55 ◦C, and 75 ◦C for 2000 h.
A sample subset was evaluated up to 16 500 h at 25 ◦C and up
to 4500 h at 55 ◦C. The test results show that contact resistance
decreases over time for all test conditions, as much as 50% from
their initial values. Elastomer contact behavior is strongly dependent
on temperature and time. The resistance behavior over
temperature is modeled with multiple statistical distributions. The
mean contact resistance is represented with a physics-of-failure
model, and the elastomer contact reliability is estimated using a
log-normal distribution.
</p>

<p><b>Index Terms:</b> Accelerated testing, contact resistance, elastomer
socket, physics of failure (PoF).</p>


<p><a href="../../fulltext/2009/LopezChallaPechtElastomerSocket.pdf">Complete article</a> is available to CALCE Consortium Members.</p>

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