JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, VOL. 18, NO. 3, JUNE 2009

Hermeticity Evaluation of Polymer-Sealed MEMS Packages by Gas Diffusion Analysis

Changsoo Jang, Arindam Goswami, and Bongtae Han, Fellow, ASME

Abstract:

A gas transport mechanism is studied to characterize the hermetic behavior of polymer-sealed microelectromechanical systems packages. Diffusion-based governing equations, which are fundamentally different from the conduction-based governing equations used for metallic seals, are proposed to predict a change in cavity pressure. An effective numerical scheme is developed to implement the governing equations. The validity of the governing equations is corroborated by the optical leak test. The verified gas diffusion model is utilized to investigate the effect of the diffusion properties and geometries of polymeric seals on the gas leak behavior.

Index Terms—Gas diffusion, gas leakage, hermeticity, microelectromechanical systems (MEMS) package, polymer seals.

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