Microelectronics Reliability, Volume 63, August 2016, Pages 320324, DOI:10.1016/j.microrel.2016.04.002

A fusion prognostics-based qualification test methodology for microelectronic products


Michael Pechta, b, 1, Tadahiro Shibutanic, Myeongsu Kangb, Melinda Hodkiewiczd, Edward Crippse
a IEEE, USA
b CALCE, Center for Advanced Life Cycle Engineering, Department of Mechanical Engineering, University of Maryland, College Park, Maryland 20740, USA
c National University, Yokohama 240-8501, Japan
d School of Mechanical and Chemical Engineering, University of Western Australia, Crawley, WA, Australia
e School of Mathematics and Statistics, University of Western Australia, Crawley, WA, Australia

Abstract:

The global market for microelectronic products is projected to reach US$2.4 trillion per year by 2020. This growth has led to intense competition between manufacturers to minimize the time-to-market for their products. Unfortunately, however, qualification testing, which is time-consuming and resource-intensive, is a major bottleneck for the quick release of microelectronic products to the market. Hence, for both researchers and engineers considering the time with reliability issues during qualification testing, this paper provides a review of conventional methodologies in qualification testing and presents a fusion prognostics-based qualification test methodology that combines the advantages of physics-of-failure and data-driven methods.

Keywords: Microelectronics, Physics-of-failure, Prognostics, Qualification testing, Reliability

This article is available through the publisher or to CALCE Consortium Members for personal review.



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