In Press
Published in 2009
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Environmental Regulations in Lead-free and Halogen-free Electronics, L. Nie, J. Cai, M. Pecht, and R. Ciocci, Electronics & Packaging (Chinese), Vol. 9, No. 6, pp. 42-47, June, 2009.
Solder Ball Attachment Assessment of Reballed Plastic Ball Grid Array Packages, L. Nie, M. Osterman, M. Pecht, F. Song, J. Lo and S.K. Lee, Equipment for Electronic Products Manufacturing (Chinese), pp. 1-5, February 2009.
