High Temperature Chambers

High-temperature storage test accelerates temperature-induced failures such as interdiffusion, Kirkendall voiding, and depolymerization. In electrically programmable read only memory (EPROM) devices, the test accelerates charge loss from floating gates in the device which is limited by gate oxide layer defects. Devices are stored in a controlled elevated temperature (typically around 150°C) for extended times (of more than 1000 hr) without electrical bias. Interim electrical parametric measurements and final measurements are conducted at the conclusion of the test. The electrical measurements include contact test, parametric shifts, and at-speed functional tests. Damage, such as package cracking, junction thermal resistance increase, or depolymerization, may also be considered a failure. The ESPEC Highly Accelerated Stress Test (HAST) chambers, CALCE High Altitude Simulation (HAS) chamber, CALCE Mixed Flowing Gas (MFG) chamber, ESPEC Liquid-to-Liquid Thermal Shock chamber and QUALMARK Highly Accelerated Life Test (HALT) chambers are also available.