The Mixed Flowing Gas (MFG) Chamber exposes connectors, contact surfaces, and other electronic equipment to a mixture of pollutant gases in a controlled temperature and humidity environment

Mixed Flowing Gas Chamber

The Mixed Flowing Gas (MFG) Chamber exposes connectors, contact surfaces, and other electronic equipment to a mixture of pollutant gases in a controlled temperature and humidity environment. It's purpose is to accelerate failure mechanisms seen during a product's long-term use in an office, light industrial, moderate industrial, or heavy industrial setting.
The ESPEC Highly Accelerated Stress Test (HAST) chamber, High Altitude Simulation (HAS) chamber, QUALMARK Highly Accelerated Life Testing (HALT) chamber, ESPEC Liquid-to-Liquid Thermal Shock chamber, and other temperature/humidity chambers are also available.

Equipment

Temperature Range (^oC)

Humidity Range (%RH)

Pollutant Gas* Conc. (ppb)

Interior Dimensions

NO_x

SO₂

H₂S

Cl₂

MFG Chamber

~25 to 50

20 to 95

10 to 1000

10 to 1000

10 to 1000

10 to 500

29" x 30" x 38"

*The system is adaptable to using other pollutant gases, i.e., ozone.