Non-Destructive Evaluation

 | Electrical Testing| Non-Destructive Evaluation| Destructive Evaluation| Contact Us|
- Scanning Acoustic Microscopy (SAM) -

Scanning acoustic microscopy (SAM) uses acoustic impedance to produce high resolution images of a sample’s interior structure to detect “difficult-to-find” defects, such as interfacial separation (PEMs and PWBs), solderball delamination (BGAs), and die attach voiding (PEMs). Both delamination/cracking and die attach voiding are manufacturing and assembly related defects that can increase the susceptibility of components to failure in storage or use, although they do not constitute failures by themselves. Delamination and cracking can result in sheared or lifted wirebonds, passivation cracking, metallization shifting, intermittent electrical failures and metallization/bond pad corrosion. Die attach voiding can lead to die cracking, die attach fracture, or thermal runaway due to poor heat dissipation through the die attach.

CALCE uses a SONIX Scanning Acoustic Microscope to conduct acoustic microscopy. A close relationship with SONIX, a member of the CALCE, allows CALCE to stay constantly updated on the latest techniques and technologies available in acoustic microscopy. A wide range of transducer frequencies, from 2.25 to 230 MHz, also provides CALCE the capability to conduct SAM on a number of electronic products and components, regardless of the sample thickness or resolution required.

 

Acoustic image of solder bumps in a ceramic ball grid array (CBGA) package. Comparing this image with the results of x-ray microscopy indicated that some of the solder bumps had separated from the die surface

Introduction

Electrical Testing

Destructive Evaluation