Environment and Operational Assessment of Products

Objective:  

Develop methodologies and models for assessing the location and magnitude of stresses resulting from environmental and operational loads. Investigate and provide techniques for managing and mitigating these stresses. Provide guidelines, reports and software. 

Outline:

  Temperature

• Passive Cooling
• Active Cooling
• Combined Passive and Active Cooling
• Thermal Characterization and Modeling

  Vibration/Shock/Static Loads

• Fixtures, supports, and stiffeners
• Circuit card curvatures
• Circuit card motion (in-plane)

  Electromagnetic interference and compatibility

  Moisture and contamination

  Combined Stresses

Projects: (Links are for Members only)

• C03-14 Thermal Management Solutions for Low Volume Complex Electronic Systems
• C03-15 High Performance Cold Plates With Porous Foams and other Micro Structures
• C03-16 Optimization and Reliability of Power Modules with Advanced Cooling Systems
• C03-17 Electrical Analysis and Characterization of Flex Circuits and Interconnects
• C03-18 Dynamic Behavior of Plastics under Impact Loading
• C02-13 Quantitative Damage Characterization of Portable Electronics Under Impact Loading
• C02-16 Thermal Management Solutions for Low Volume Complex Electronic Systems LVCES
• C01-24 Advanced Cooling Concepts for 100 W/cm² and Higher Heat Removal
• C01-25 Thermal Management of Power Electronics Modules
• C01-26 Electromagnetic Compatibility and Interference Testing Facility
• C01-30 Quantitative Damage Characterization of Portable Electronics Under Impact Loading
• C00-14 CCA Handling Guidelines to Prevent Damage due to Excessive Bowing and Warping
• C00-15 Micro-fabricated Forced Flow Heat Sinks
• C00-17 Smart Thermal Management Based on PCMs
• C00-16 Metal Matrix Composite Spreaders for High Power Thermal Management
• C00-19 Shielding Degradation of EMI Shielding Enclosures
• C00-20 Approaches and Tools for Solving EMC Problems in Industry
• C00-21 Compact Mechanical Models for CCA Analysis
• C00-42 Experimental Validation of CALCE Interconnect Stress Model for Thermo Mechanical Cycling
• C00-43 Influence of Shock and Vibration Loading on Electronic Assemblies: An Experimental Study
• C99-18 Micro-fabricated Compact Two-Phase Heat Strikes
• C99-19 Metal Matrix Composite Spreaders for High Power Thermal Management
• C99-46 Compact Mechanical Models for CCA Analysis
• C99-10 Guidelines for Assembly Design of Flip-Chip/BGA
• C98-52 Assessment of Reliability of CSP Assemblies of 0.5 mm Pitch
• C98-11 Effect of Temperature and Moisture on Solder Joint Reliability of Flip-Chip Assemblies
• C98-09 Interconnect Vibration Fatigue Models: Multi Domain Rayleigh Ritz; Hierarchical Finite Element and Energy Partitioning
• C97-18 Passive Cooling for High Heat Fluxes using Thermosyphones
• C97-19 Performance and Reliability Assessment of Thermo-Electric Cooling
• C97-14 Curvature Related Overstress Failure Models
• C96-02 Vibration Analysis Tools - Component Mass and Stiffness
• C96-03 New Shock and High G Loading Analysis
• C96-16 Passive Cooling Technology for Thermal Management of High Power Electronics
• C96-14 Integrated Thermal Analysis of Air Cooled Systems: Modeling and Measurement
• C96-17 The Rationale and Requirements for Thermal Management and Analysis
• C95-15 Experimental and Computational Evaluation of Passive Thermal Control using PCMs
• C95-16 Thermal Management of Sealed and Vented Compact Electronic Enclosure
• C95-17 Modeling of Natural Convection form Horizontal Printed Circuit Boards
• C95-14 Combined System and Board Level Thermal Modeling of Electronic Enclosures
• C95-18 The Use of Electronic Hardware at Elevated Temperature
• C95-21 Increasing Electro-Optic Reliability Using Computer Modeling and Simulation (Structural Analysis of MEMS)
• C94-05 PWB In-Plane Motion Under Vibrational Loading
• C94-12 Application of Phase Change Materials to Thermal Control of Electronic Modules
• C94-19 Flow-Through Cooling with Phase Change Slurry
• C94-10 Forced Convection Air Cooling of Commercial Electronics
• C93-11 Flow- Through Cooling of SEM-E Modules
• C93-17 PWB In-Plane Motion Under Vibrational Loading
• C93-10 Direct Forced Air-Thermal Modeling of Commercial Electronics
• C93-15 Temperature Dependence of Microelectronic Device Failures

Reports: (Links are for Members only)

• Compact Models for CCA Designs. (1999)
• BGA Case Studies: Vendor A, Vendor B, Vendor C (1999)
• Internal Report Thermo Electronics (1998)
• Compact Models for BGA/Flip-Chip (1998)
• HFEM Algorithm for Area-Array Interconnect (1998)
• Stress Analysis of Area-Array Interconnects due to Vibrational Loading (1998)
• Internal Report on Silicon Microfabrication (1998)
• MDRR Thermo-Mechanical with Compact Model (1998)
• Internal Report on Integrated Modeling (1997)
• ASME Paper (1997)
• High-Temperature Electronics Textbook (1997)
• Overstress Model (1997)
• Board Model (1997)
• Lead Model (1997)
• LCC Solder Model (1997)
• Internal Reports on Thermosyphons (1996)
• Component/ Lead/ Board/ Smear Model (1996)
• Advanced Vibration Tool (1996)
• Book : Temperature Influence on Reliability (1994)

Softwares: (Links are for Members only)

• calcePWA Release 3.0
• PWA Software Workshop 1999
• calcePWA Release 2.1
• PWA Software Workshop 1998
• Advanced Random Vibration Analysis Algorithm
• calcePWA Release 2.0
• PWA Software Workshop 1997
• Shock Interconnection Failure Model
• calcePWA Software 1.3
• calcePWA Software 1.2
• Software Vibration Analysis
• Spin-off TI Commercial CALCE
• calcePWA Software 1.0

Articles: (Links are for Members only)

• Thermal Response of a Compact Two-Phase Thermosyphon: Effect of Evaporator Confinement and Transient Loads
• Performance of a Compact Two-Chamber Two-Phase Thermosyphon: Effect of Evaporator Inclination, Liquid Fill Volume and Contact Resistance
• Combined Effects of Sub-Cooling and Operating Pressure on the Performance of a Two-Chamber Thermosyphon
• Passive Thermal Control of Electronic Equipment
• Transient Thermal Management of an Avionics Module Using Solid-Liquid Phase Change Materials (PCMs)
• Application of Phase Change Materials to Thermal Control of Electronic Modules: A Computational Study
• Effects of Orthotropic Thermal Conductivity of Substrates in Natural Convention Cooling of Discrete Heat Sources
• Issues in Validating Package Compact Thermal Models for Natural Convection Cooled Electronic Systems
• Liquid Cooling of Electronic Equipment: Where does it Offer Viable Solutions?
• A New Educational Program in Electronic Packaging and Reliability (EPAR)
• Procedure for Evaluation of Thermal Management Requirement in a Laser Diode Structure
• Application of Phase Change Materials for Passive Thermal Control of Plastic Quad Flat Packages: A Computational Study
• Conjugate Heat Transfer from a Single Surface-Mounted Block of Forced Convective Air Flow in a Channel
• Forced Convection Air Cooling of a Commercial Electronic Chassis: An Experimental and Computational Case Study
• Heat Transfer from an Array of Strips to Fluorinert Coolant in Mixed Impinging-Jet/Channel-Flow Configuration
• Heat Transfer from Grooved Surfaces to Flow of Fluorient Coolant in Reduced-Size Channels
• Packaging Reliability for High Temperature Electronics: A Materials Focus
• The Role of Heat Transfer Analysis in Avionics Equipment Development
• Thermal Management of Electronic Equipment: Research Needs in the Mid 1900s and Beyond
• Application of Phase Change Materials to Thermal Control of Electronic Modules: A Computational Study
• Characterization of Functional Relationship Between Temperature and Microelectronic Reliability
• Computations of Solid/Liquid Phase Change in a Three-Dimensional Enclosure by a Uniformly Dissipating Heat Source
• Computations for a Three-by-three Array of Protusions Cooled by Liquid Immersion: Effect of Substrate Thermal Conductivity
• Does the Cooling of Electronics Increase Reliability?
• Heat Transfer Engineering in Systems Integration: Outlook for a Closer Coupling of Thermal and Electrical Designs of Computers
• A Numerical Study of Three Dimensional Laminar Natural Convection in a Vented Enclosure
• Temperature as a Reliability Factor
• Natural Convection Heat Transfer from an Array of Rectangular Protrusions in an Enclosure Filled with Dielectric Liquid
• Tutorial: How Radiation Affects Polymeric Materials
• Dynamic Investigation of Thermal and Sorptive Effects on Electronic Packages
• Thermal Derating Guidelines for Temperature-tolerant Design of Micro electronic Devices
• Cooling of Electronic Boards Using Internal Fluid Flows
• Evaluation of Manufacturing Variables in the Reliability of Surface Mount Capacitors
• Natural Convection Liquid Cooling of a Substrate-Mounted Protrusion in a Square Enclosure: A Parametric Study
• Transient Natural Convection from a Leadless Chip Carrier in a Liquid Filled Enclosure: A Numerical Study
• Two-Dimensional Thermal Modeling of Power Monolithic Microwave Integrated Circuits
• Natural Convection Arising from a Heat Generating Substrate-Mounted Protrusion in a Liquid-Filled Two-Dimensional Enclosure
• Natural Convection Cooling of a Ceramic Substrate Mounted Leadless Chip Carrier in Dielectric Liquids
• Transient Thermal Stress Analysis of Plated Through Hole Subjected to Wave Soldering
• Verification of Thermal Analysis of PWBs for RAMCAD
• PCB Design for Thermal Reliability

Publications: (Links are for Members only)

• Other CALCE Publications

Education (Links are for Members only)

• Education

Point of Contact:

• Dr. A. Dasgupta
Copyright © 2003 by CALCE and the University of Maryland, All Rights Reserved