Environment and Operational Assessment of Products

Virtual Qualification Research Program

Objective:

Develop software for assessing the location and magnitude of failures in electronic product due to stresses resulting from environmental and operational loads. Provide validation, documentation and a support structure for its acceptance into industrial use.

Projects: (Links are for Members only)

• C03-04 Calibration of Virtual Qualification Model for Leaded Packages with Lead-free Solder Materials
• C03-11 Virtual Qualification of Advanced Power Converters and Modules
• C03-12 Virtual Qualification of Components at High Temperatures
• C03-13 Development of PoF Based Virtual Qualification Methodology for COF Packages
• C03-19 Virtual Qualification of Components Under High G Loads
• C03-20 Improved Simulation of Vibration Induced Failures
• C03-21 Enhancements in Virtual Qualification of Area Array Packages
• C03-22 Enhancements for Conducting Virtual Qualification for Circuit Card Assemblies
• C03-23 Software and Failure Models for New Commercial Components
• C02-11 Guidelines and Improvements for Conducting Virtual Qualification CADMP-II/calcePWA
• C02-12 Virtual Qualification of Power Components and Modules
• C02-15 Virtual Qualification of Components Under High G Loads
• C02-30 Interconnect Durability Models for Novel Interconnects and Update of Failure Assessment Software
• C02-32 Guidelines for Assembly and Reliability Assessment of BGAs
• C01-20 Design for Reliability of a High Temperature Automotive Electronic Module
• C01-21 Reliability Models for Insertion Mount Interconnects in Printed Wiring Board Assemblies
• C01-22 Vibration Fatigue Model for BGAs
• C01-23 Thermo-Mechanical Fatigue Model for Surface Mount Connectors
• C01-35 CALCE Website Information Dissemination Effectiveness Study
• C00-23 CCA Failure Mechanism Webbook Update and NFEM Software
• C00-51 Modeling Strategies for High I/O Area Array Packages
• C00-25 Software and Guidelines for Accelerated Testing
• C99-45 for calcePWA
• C99-10 Guidelines for Assembly Design of Flip-Chip/BGA
• C99-23 Web-based PoF Guidelines for Accelerated Testing and Screening of Electronic Assemblies
• C98-09 Interconnect Vibration Fatigue Models: Multi Domain Rayleigh Ritz, Hierarchical Finite Elements and Energy Partitioning
• C98-05/06 2nd Order Semi-Analytic Fatigue Models for J and Gullwing Leaded Packages
• C98-39 Web-based Guidelines for Accelerated Test
• C98-51 calcPWA Software Validation
• C97-12 Generic Solder Joint Reliability Model
• C97-15/17 PWA Failure Mechanism Model Handbook
• C97-14 PWA Curvature Related Overstress Failure Model
• C96-02 New Vibration Analysis Tools- Component Mass and Stiffness
• C96-14 Integrated Thermal Analysis of Air cooled Systems: Modeling and Measurement
• C96-03 New Shock and High G Loading Analysis
• C96-19 Software Enhancements CALCE V2.0 Release
• C95-14 Combined System and Board Level Thermal Modeling and Electronic Enclosures
• C95-19 Mentor Integration Study
• C94-02 Multiple Environment Fatigue Software
• C94-05 PWB In-Plane Motion Under Vibrational Loading
• C94-03 Import/Export Data
• C93-01 Fatigue Software Enhancements
• C93-11 Flow-Through Cooling of SEM-E Modules
• C93-10 Direct Forced-Air Thermal Modeling of Commercial Electronics
• C93-17 PWB In-Plane Motion under Vibrational Loading
• C93-02 Software Enhancements

Reports: (Links are for Members only)

• calcePWA Interface Guide
• Updated CCA Handbook
• calcePWA Data Reference Guide
• calcPWA Software Overview
• FMP Framework
• Reliability and Distributions Resource
• MDRR Thermo-mechanical with Compact Model
• Accelerated Test Web Book
• UT Insertion Pin Solder Fatigue
• Vibration Induce Failure of Interconnects
• Interconnects Failure due to Thermal Mechanical Loading
• Semi-Analytic Durability Model for SMT Solder Joints
• Outline For CCA Failure Mechanism Handbook
• Overstress Model
• Board Model
• Lead Model
• LCC Solder Model
• Component/Lead/Board Smear Model
• Advanced Vibration Tool
• GRCI Evaluation
• CALCE/PADS Integration
• CALCE Mentor Integration
• CALCE Interface (1.0)
• Algorithm for Estimating the In-Plane Response of PWB
• Software Vibrational Analysis
• CALCE Explanation and Validation Guide

Softwares: (Links are for Members only)

• calceFAST 1.0 Failure Assessment Software
• Online Statistical Tools
• Online Multi Environment Failure Assessment Software
• calcePWA Release 3.0
• Online Cycle Counting Tool
• calcePWA Release 2.1
• Online 2nd Order Thermal Fatigue of Solder Joints of an Insertion Pin
• calcePWA Release 2.0
• Advanced Random Vibration Analysis Algorithm
• Shock Interconnect Failure Model
• Shock Analysis Algorithm
• calcePWA Software 1.3
• Zulien-Recal Import
• In-Plane Motion Analysis
• Multi- Environment Fatigue Evaluation
• PSD Data Manager
• calcePWA Software 1.2
• Environment Data Manager
• Lead Data Manager
• Liquid Flow-Thru Cold Plate Software
• Spin Off TI Commercial CALCE
• calcePWA Software 1.0

Case Studies: (Links are for Members only)

• Vendor A
• Vendor B
• Vendor C
• Flip-Chip with underfill Case Study
• calcePWA Software Case Study
• Avionics Case Study

Education Program: (Links are for Members only)

    Workshop

• PWA Software Workshop 2002
• PWA Software Workshop 2000
• PWA Software Workshop 1999
• PWA Software Workshop 1998
• PWA Software Workshop 1997

Point of Contact:

• Dr. M. Osterman

Copyright © 2003 by CALCE and the University of Maryland, All Rights Reserved