Failure Identification and Reliability Modeling

Objective:

Analyze, characterize and model the reliability of permanent connections (solder or conductive adhesive) between components and substrates via the identification of failure modes, sites and mechanisms, and the effects of design and environment. Resulting models documented and inserted into Web-based handbook and calcePWA software.

Outline:

  Stress drivers

• temperature
• vibration / shock / static loads
• moisture

  Failure mechanism

• fatigue
• fracture
• diffusion
• corrosion

  Failure sites

• leadless
• J and gull leaded
• pin grid arrays / Insertion mount
• ball grid arrays / CSP
• flip chip

  Attach characterization

• solders
• conductive adhesives
• underfills

Projects: (Links are for Members only)

• C03-03 Mechanical Fatigue Testing of Lead-Free Solder Interface
• C03-05 Risk Assessment & Accelerated Qualification of Lead Free Electronics
• C03-06 Characterization of Anisotropic Conductive Adhesives
• C03-07 Durability Characterization of Lead-Free Solders continuation
• C03-08 Corrosion of Eutectic and Lead-Free Solder
• C03-21 Enhancements in Virtual Qualification of Area Array Packages
• C03-28 High Temperature Solder Selection for Surface Mount Applications
• C02-06 Influence of Intermetallic on the Durability of Lead-Free Solder Interconnects
• C02-07 Constitutive Relationships of Binary Lead-Free Solders
• C02-09 Durability Characterization of Lead-Free Solders continued
• C02-29 Effect of Fatigue Induced Grain Growth and Corrosion on Life of Solder Interconnects
• C02-31 Characterization of Anisotropic Conductive Adhesives
• C01-01 Constitutive Relationships of Lead-Free Solders Materials
• C01-02 Durability of Lead-Free Solders
• C01-03 Influence of Intermetallics on Durability of Lead-Free Solder Interconnects
• C01-04 Characterization of Conductive Adhesives
• C00-08 Characterization of Advanced Solders
• C00-06 Effect of Bending and Moisture on Durability of Chip Scale Packages
• C00-07 CSP and Flip Chip Durability under Environmental Loading
• C00-51 Modeling Strategies for High I/O Area Array Packages
• C00-55 Thermal Fatigue Model for High Power RF Transistor Interconnect
• C99-28 2^nd Order Semi-Analytic Thermo-Mechanical Induced Fatigue Failure Model: CSPs (mBGA)
• C99-29 2^nd Order Semi-Analytic Thermo-Mechanical Induced Fatigue Failure Model: BGAs
• C99-30 Durability of Solders and Conductive Adhesives
• C99-31 Effect of Bending on CSP Assemblies (continuation)
• C99-32 Effect of Temperature and Moisture Stresses on Reliability of Flip Chip on Board (FCOB) Assemblies. (continuation)
• C98-05 2^nd Order Semi-Analytic Thermo-Mechanical Induced Fatigue Failure Models for J and Gull Leaded Packages
• C98-06 2^nd Order Analytic Vibration Induced Fatigue Failure Model
• C98-09 Interconnect Vibration Fatigue Models: Multi-Domain Rayleigh Ritz; Hierarchical Finite Element and Energy
• C98-11 Effect of Temperature and Moisture on Reliability of Flip Chip Assemblies
• C98-52 Assessment of reliability of CSP assemblies of 0.5 mm pitch
• C98-66 Connector Wear and Fretting Degradation Testing Device
• C97-09 Reliability Assessment of Low-Cost Flip Chip Assemblies
• C97-12 Generic Solder Joint Reliability Model
• C97-15 PWA Failure Mechanism Model Handbook: Thermal Fatigue
• C97-24 Assessment of High-Temperature, Fatigue-Resistant Solders

Reports: (Links are for Members only)

• Test results for three solders (1999)
• Effect of High Temperature Aging on Solder Joint Degradation in FCOB Assemblies (1999)
• Chip Scale Packaging (CSP) (1999)
• BGA Technology (1999)
• Compact Models for Flipchip and Ball-Grid Array Architectures (1998)
• Effect of underfill on the durability of Flipchip Solder interconnects (1998)
• Impact of Underfill Filler Particles on Reliability of Flip Chip Interconnects (1997)
• Thermomechanical Durability Analysis of Filp Chip Solder Interconnects without Underfill (1997)
• Thermomechanical Fatigue of Component Attaches (1997)
• Thermomechanical Stress Analysis of BGA Interconnects Using the Mdrr Technique (1997)
• Miscellaneous Modeling Issues in Thermomechanical Stress Analysis of Surface-Mount Interconnects (1997)
• Life Prediction Model Development for Lead-Free Solder Alloys (1997)
• Special Report on Generic Solder Joint Interconnect Reliability Model (1996)
• A Nonlinear Multi-domain Thermomechanical Stress Analysis method for Surface-Mount Solder Joints: Part II:Viscoplastic Analysis (1996)

Resource: (Links are for Members only)

• CCA Failure Mechanism Model Handbook for Practicing Engineers
• calceFAST (Web Based) Software
• Multiple Domain Rayleigh Ritz (Web Based) Software
• Energy Partitioning Damage Model

Software: (Links are for Members only)

• CalceFAST On-line Failure Analysis Software

Workshops: (Links are for Members only)

• 2001 CALCE Software Workshop
• 2000 CALCE Software Workshop
• 1999 CALCE Software Workshop
• 1998 CALCE Software Workshop

Point of Contact:

• Dr. D. Barker
• Dr. A. Dasgupta

Copyright © 2003 by CALCE and the University of Maryland, All Rights Reserved