Failure Identification and Reliability Modeling

Objective:

Analyze, characterize and model the reliability of circuit card assemblies via the identification of failure modes, sites and mechanisms, and the effects of design and environment. Resulting models documented and inserted into Web-based handbook and calcePWA software.

Outline:

  Stress drivers

• temperature
• vibration / shock / static loads
• voltage
• moisture

  Failure mechanism and models

• fatigue
• fracture
• electro-migration
• corrosion

  Failure sites

• vias
• compliant pins
• conformal coating
• embedded passives
• laminates
• metallization

Projects: (Links are for Members only)

• C03-09 The Effects of No-Clean Flux and Alternative Finishes on Electrochemical Migration
• C03-24 Embedded Passives Demonstrator - Embedded Capacitor Reliability
• C02-17 Degradation of High-Frequency Signals through Traces Plated with Alternative Finishes and Lead-Free Solder
• C02-23 Evaluation of Conformal Coatings on Advanced PEM Device and Package Technologies
• C02-25 Electrical Leakage in Printed Wiring Assemblies
• C02-28 PTH and Microvia Accelerated Life Testing - IST Versus Oven
• C02-33 Failure Modeling in Direct Bonded Copper Substrates
• C01-08 Reliability Issues with Microvias in HDI and Build-up Substrates (Continued)
• C01-09 Development of Advanced Polymer Interface Adhesion Test
• C00-21 Thermo-mechanical Behavior of BGA Package Assemblies
• C00-25 Software and Guidelines for Accelerated Qualification and Quality Assurance of Electronic Assemblies
• C00-30 Discrete Passive Parts Selection and Management
• C00-35 Contract Assembly Assessment
• C00-37 Contract Printed Wiring Board PWB Fabrication Assessment
• C00-53 MicroVias and Build-up Technologies for Printed Wire Boards
• C99-33 Effect of Moisture on Corrosion Rates and Reliability of PWB Metallization Systems
• C99-44 Thermo-mechanical Issues in Conformal Coating Selection
• C99-45 Failure Model "Plug-ins" for calcePWA
• C99-46 Compact Mechanical Models for CCA Analysis
• C98-15 Evaluation of PWB Defects which can Accelerate Conductive Filament Formation
• C98-17 Effect of Moisture on Corrosion Rates and Reliability of PWB Metallization Systems
• C98-18 Moisture Related Growth Failure Mechanisms of Assemblies - Development of Highly Accelerated or Fault Potential Tests and Product/Process Design for Reliability Methods
• C98-44 Design Guidelines for Solder Joint Reliability on Insulated Metal Substrate Boards
• C98-51 calcePWA Software in a Design Environment: Evaluation of Mars PathFinder CCAs
• C98-63 An Introduction to Integral, Buried and Embedded Passive Technologies
• C97-08 Maximizing Yield and Reliability for Surface Mount Manufacturing
• C97-10 Hollow Fibers in Laminate Printed Wiring Boards
• C97-11 Characterization of Properties of Thin Films and Laminates
• C97-15 PWA Failure Mechanism Model Handbook: Thermal Fatigue
• C96-10 Moisture Absorption in Printed Wiring Boards
• C96-19 Software Enhancements CALCE V2.0 Release
• C95-09 Characterization of Non-Woven-Fiber Printed Wiring Boards
• C95-08 Effect of Compliant PINs on Reliability of PTHs
• C95-19 Commercial Integration Study
• C94-07 Debonding at the Fiber/Resin Interface in Printed Wiring Boards
• C94-03 Import/Export Data
• C94-06 Damage Due to Lead Insertion in Through-Hole Connectors
• C94-14 Failure Models for PWBs and CCAs
• C94-18 Finite Element Modeling of Advanced Interconnections
• C93-02 Software Enhancements
• C93-08 Failure Models for PWBs and CCAs
• C93-09 Flexible Printed Circuit Design Guidelines
• C93-12 Conductive Filament Formation in Printed Wiring Boards
• C93-14 Finite Element Modeling of Advanced Interconnections

Reports: (Links are for Members only)

• Moisture Diffusion and Corrosion in Electronics (1999)
• Task 1: Thermomechanical Characterization of Conformal Coating Materials (1999)
• Task II: Modeling Strategies for Quantitative Assessment of Conformal Coating Materials (1999)
• Failure Model "Plug-ins" (1999)
• Compact Mechanical Models for CCA Analysis (1999)
• CFF Failure Mechanism Investigation (1998)
• Web-based IntegralPassives Tutorial (1998)
• An Introduction to Integral, Embedded, and Buried Passive Technologies (1998)
• CalcePWA Analysis of Mars Pathfinder CCAs (1998)
• Conductive Filament Formation: A Potential Reliability Issue in Laminated Printed Circuit Cards with Hollow Fibers (1997)
• Hollow Fibers in Woven Laminates (1997)
• Hollow Fibers in PCB, MCM-L, and PBGA Laminates May Induce Reliability Degradation (1997)
• Data: Temperature and moisture dependent measurements of laminate materials (1997)
• Maximizing Yield and Reliability in Surface Mount Manufacturing - Thermal Adhesive Applications (1997)
• Thermomechanical Fatigue of Component Attaches (1997)
• Vibration Fatigue of Component Attach (1997)
• Moisture Ingress Into Organic Laminates (1996)
• Printed Wire Assembly Toolbox (1996)
• calcePWA Explanations and Validations (1996)
• Characterization of a Non-Woven Randomly Dispersed Short Fiber Laminate (1995)
• Simulation of the Influence of Manufacturing Quality on Reliability of Vias (1995)
• Modeling PTH Damage Caused by Insertion Mount Connectors (1995)
• Interfacial Debonding in PWBs (1994)
• Environmental Scanning Electron Microscopic Investigation on Interface Debonding of Thermal Cycled FR-4 Board (1994)
• Dynamic Investigation of Thermal and Sorptive Effects on Electronic Packages (1994)
• Effect of Temperature and Humidity Cycling on FR-4, Bis-Maleimide Triazing, and Cyanate Ester Printed Wiring Boards (1994)
• The Effect Of Manufacturing And Design Process Variabilities On The Fatigue Life Of The High Density Interconnect Vias (1994)
• Orthotropic Thermal Conductivity of Plain-Weave Fabric Composites Using a Homogenization Technique (1994)
• Simulation of the Influence of Manufacturing Quality on Reliability of Vias (1994)
• calcePWA Interface Guide (1994)
• Failure Mechanism Models for Material Aging due to Interdiffusion (1993)
• Conductive Filament Formation in Printed Wiring Boards (1993)
• Electrochemical Migration in Multichip Modules (1993)
• Conductive Filament Formation: A Focus on MCS-L Sustrates (1993)
• Assessing Time-to-Failure Due to Conductive Filament Formation in Multi-Layer Organic Laminates (1993)
• Tutorial - Failure-Mechanism Models for Conductive-Filament Formation (1993)
• Characterization of Polymides Used in High Density Interconnects (1993)
• Experimental and Analytical Investigation of in Aramid Pwbs-Part II (1993)

Resources: (Links are for Members only)

• PWB Manufacturing and Assembly Encyclopedia

Point of Contact:

• K. Rogers

Copyright © 2003 by CALCE and the University of Maryland, All Rights Reserved