Junhui Li
University of Maryland, College Park

Abhijit Dasgupta
University of Maryland, College Park

Key Words - Failure mechanism, Interdiffusion, Mechanica1 reliability assessment

Reader Aids -

General purpose: Tutorial

Special math needed for explanations: None

Special math needed to use results: None

Results useful to: Designers and reliability engineers

Abstract - This tutorial illustrates design situations material aging due to interdiffusion in some components can compromise system performance over time, thereby acting as a wearout failure mechanism. Microstructural diffusion mechanisms, continuum diffusion models, and interdiffusion analysis techniques are presented to design against such failures. An example illustrates the application of the mechanisms, models, and techniques in electronic packaging.