Moisture Ingress Into Organic Laminates
Michael Pecht and H. Ardebili
CALCE Electronic Packaging Research Center
University of Maryland at College Park
College Park, Maryland 20742
A. Shukla
Kulicke & Soffa Industries, Inc.
2101 Blair Mill Rd. Willow Grove, PA 19090
J. Hagge and D. Jennings
Collins Commercial Avionics
Collins General Aviation Division
400 Collins Road NE, MS 124-115
Cedar Rapids, IA 52498
Abstract
The potential problems associated with moisture in laminates used in
printing wiring boards, multi-chip modules and plastic ball grid array
laminates, make characterizing laminate sorption extremely important. This
paper presents the results of experiments tailored towards modeling the
equilibrium moisture content and evaluating the diffusion coefficient of
laminates in various environmental conditions.