Risk-Informed Technology Insertion Methodologies

Objective:

Develop and document a methodology for parts selection and management. The methodology includes application-independent and application-specific processes. Throughout the research, portions of the methodology are verified with case studies.

Projects: (Links are for Members only)

• C03-27 Uprateability Assessment via Technology Characteristics
• C03-28 High Temperature Solder Selection for Surface Mount Applications
• C03-30 Investigation of Tin Whiskers in Tin Finished Surfaces
• C02-03 Embedded Passive Reliability and Tradeoff Analysis
• C02-24 Selection of Compounds for Molding Flip-Chipped Devices
• C01-11 Integral and Integrated Passives Web Book Update
• C01-12 Investigation of Electrical Parameter Aging due to Environmental Stresses
• C01-13 Development of an Uprating Web Book
• C01-15 Development and Validation of Electronic Distributor Assessment Methodology
• C00-44 Parts Selection and Management: A Life Cycle Perspective to Supply Chain Management and Technology Trend Analyses
• C00-30 Discrete Passive Parts Selection and Management
• C00-29 Parts Selection and Management Methodology Update: Manufacturer Quality and Part Quality and Integrity
• C00-35 Contract Assembly Assessment
• C99-03 Stress Balancing: A Method for Use of Electronic Parts Outside the Manufacturer's Specified Temperature Range
• C99-04 Processes for Using Electronic Parts at Extended Temperature Ranges as an Industry Standard
• C99-05 Risk Assessment of Using Parts Outside Manufacturer Specified Temperature Range
• C99-06 Application Specific Reliability Assessment for Electronic Parts
• C99-07 Life Cycle Management and Economic Assessment
• C99-08 Assembly Requirements and Constraints Assessment
• C98-30 Technology Specific Protocols for Uprating
• C98-28 Performance Derating as an Alternative to Uprating
• C98-29 The Legal Implications of Part Use beyond the Manufacturers Specified Temperature Range
• C98-26 Parts Quality and Integrity Assessment
• C98-65 Life Cycle Prediction and Mismatch Assessment
• C98-64 Obsolescence Management Guidelines
• C97-05 Uprating of Parts for Use Outside their Specification Limits
• C97-06 Criteria For Manufacturer Parts Assessment

Reports: (Links are for Members only)

• Electronic Parts Selection and Management Guidebook (2000)
• CALCE Part Selection and Management Benchmarking Services (2000)
• Elimination of Condensation in Tektronix Test Fixtures (1999)
• Electrical Performance Comparison of the Military and Commercial Versions of a TI Octal Buffer (1999)
• Tipping the Scales in Your Favor when Uprating (1999)
• Equipment Supplier Intervention Techniques (1999)
• Stress Balancing: A Method for Use of Electronic Parts Outside the Manufacturer Specified Temperature Range (1999)
• Terminology for Use of Parts Outside Manufacturer-Specified Temperature Ranges (1999)
• Assessing and Mitigating Risks in Uprating Electronic Parts (1999)
• Part Manufacturer Assessment Process (1999)
• A Risk-Informed Methodology for Parts Selection and Management (1999)
• Application Specific Reliability Assessment of Electronic Parts (1999)
• Parameter Re-characterization: A Method of Thermal Uprating (1999)
• Technology Trends Driving Electronic Component Obsolescence (1998)
• Minutes of the Workshop on Uprating Parts for Use Outside Their Temperature Specification Limits (1998)
• Parts Selection and Management Workshop Electronic Part Quality, Integrity and Application-Specific Reliability (1998)
• Thermal Derating -- A Factor of Safety or Ignorance (1997)
• Uprating Electronic Components for Use Outside Teir Temperature Specification Limits (1997)
• Criteria for the Assessment of A Manufacturer Parts Family (1997)
• Electronic Components Obsolescence (1997)
• How Burn-in can Reduce Quality and Reliability (1995)

Software:

• Software Product Information

Education:

• Overview of EPSC Graduate Program
• Parts Selection and Management
• CADMP-II v2.1 Information Guide
• Plastic Encapsulated Microelectronics
• Plastic Encapsulated Microcircuits (PEM) --Bibliograpgy

Point of Contact:

• Dr. M. Pecht

Copyright © 2003 by CALCE and the University of Maryland, All Rights Reserved