| Created: 3/20/96 | Updated: 06/23/00 |
Credits : 3
Grade Method : REG
This course presents the physics-of-failure issues in connectors and interconnects in various levels of electronic assemblies. Examples of such interconnects at the first level include wire-bonds, TAB, flip-chip, and flip-tab. Examples at the second level include surface-mount and insertion-mount, leaded and leadless interconnect architectures in peripheral or area-array format, such as PGA, BGA, micro-BGA, TBGA, CGA, fine-pitch J or gull-wing lead formats, and other micro-SMT formats. Interconnects at the third level include conventional separable connectors, ZIF connectors and flex cables. Special topics to be covered include solder-less interconnects (such as conductive epoxies, fuzz-buttons and graphite connectors), optical interconnects, fiber-optics, etc. Issues to be examined include performance criteria and failure mechanisms in all relevant materials, under variety of stresses such as thermal, electrical, mechanical, and chemical stresses. Design guidelines, manufacturing practices and accelerated test guidelines will be presented, for robust product development.