Lead-Free Readinees

Driven by market pressures and government regulation, a significant portion of the electronics industry has converted to lead-free electronic hardware. Whether or not a company is exempt from legislative requirements to convert to lead-free materials and process, virtually all companies involved in the development, acquisition and sustainment of electronic are being impacted by the lead-free conversion.  This short course is intended to provide the audience with the current status of lead-free reliability and consideration of issues arising from the transition to lead-free assembled electronic hardware.  The course provides up to date information on what companies should understand about lead-free materials, the reliability of lead-free assemblies, the risk posed by tin whiskers, as well as mixed solder reliability and rework and repair lead-based and lead-free assemblies.

For planning your training course, please click here. You can also contact the calce training team led by Prof. Michael Pecht for more information.

Course Outline

  • Introduction
  • Lead-free Materials and Assemblies
    • Lead-free Solders
  • Lead-free Assembly Reliability
    • PWB Reliability
    • Part Reliability
    • Solder Interconnect Reliability
  • Mixed Solder and Rework and related issues
  • Tin Whiskers and Failure Risk
  • Summary
    The course has been presented to:
    L3 Electronic Systems Toronto
    Lockheed Martin Dallas, Texas, Marietta, Georgia and Palmdale, CA
    Emerson Divisions St. Louis and China
    Emerson Materials and Manufacturing Forum Coronado Springs, FL.
    CEPREI Guangzhou, China, ; CTTL, Beijing, China, ; CQC, Beijing, China..
    Lead-free Business Discussion Arbitron, Columbia, MD.
    Lead Free Soldering Schlumberger, TX.
    Lead-Free Development for the Oil Industry Halliburton, Houston, TX.
    Lead-Free IP Issues Emerson Electronics, MO.

    Books