Commercial electronics have traditionally been designed to operate at temperatures below 70°C, with a few special military applications being designed to operate at temperatures to 125°C.  This has become a severe constraint in the development of next-generation electronic products, which will increasingly rely on distributed electronic control systems. Significant cost, size, and weight savings can be achieved by replacing traditional centralized control systems with a more distributed architecture, where the sensors, processors, and actuators are all housed in a single, remotely-placed, unit. The factor limiting the widespread acceptance of distributed control systems, however, is the need to operate the electronics at the ambient temperature of the application, which typically exceeds the traditional maximum allowable operating temperatures.  Development of electronic systems that can operate at local ambient temperatures up to 200°C without cooling is therefore seen as a critical technology for the 21^st century.

This course details the performance and reliability issues involved in designing electronic systems for use at temperatures above 125°C.  It will provide the attendee with the tools and information needed to design electronic systems that will perform reliably in extreme temperature environments, such as are found in defense, avionic and automobiles applications.

For planning your training course, please click here. You can also contact the calce training team led by Prof. Michael Pecht for more information.

1. Extreme temperature electronics: technology for the 21^stCentury
2. Active component selection for extreme temperature environments
3. Passive component selection for extreme temperature environments
4. Module level packaging of extreme temperature environments
5. Board assembly and process compatibility issues
6. Power electronics in extreme temperature environments
7. MEMs + Sensors for extreme temperature environments
8. Thermal management for extreme temperature power electronics
9. Applications of high temperature electronics
10. Silicon carbide devices and packaging above 250°C
11. Design for reliability tools for extreme temperature electronics

Books

• Influence of Temperature on Microelectronics and System Reliability: A Physics of Failure Approach
• High Temperature Electronics
• Electronic Packaging: Materials and Their Properties