As the components and structures involved in high-end electronic packages are made smaller, the thermal gradient increases and the strain concentrations become more serious. Numerical analyses have been used extensively to estimate stresses and strains in packaging structures. Although one can model almost any kind of electronic packaging product for complex loading and boundary conditions, the models and results usually require verification by other means. Accordingly, advanced experimental techniques are in high demand to provide accurate solutions for deformation studies of electronic packages. In the past decades, numerous optical methods for deformation measurements have been matured and emerged as important tools for microelectronics product development. The methods provide whole-field displacement information with various sensitivities and resolutions. They include moiré interferometry, microscopic moiré interferometry, Twyman/Green interferometry, far infrared Fizeau interferometry, and shadow moiré The unique capabilities provided by the methods made them ideally suited for the broad range of problems encountered in electronic packaging product development.

This course teaches the basic concepts of optical methods as applied to microelectronics product development. It reviews numerous applications, which treat a great diversity of mechanics and materials studies in electronic packaging. Practical aspects of the technology are discussed in the final section. For more information,

For planning your training course, please click here. You can also contact the calce training team led by Prof. Michael Pecht for more information.

1. Introduction
2. Basic concepts 
3. Geometrical interference 
4. Optical interference 
5. Interferometry
6. Application I: Characterization of thermo-mechanical behavior
7. Application II: Verification of numerical model
8. Application III: Determination of effective properties
9. Instrumentation and practical aspects

Books

• High Sensitivity Moire