Publications on Educational Approaches
Progress on Internet-Based Educational Material Development for
Electronic Products and Systems Cost Analysis, P. Sandborn and C. Murphy,
Proceedings of the Electronic Components and Technology
Conference (ECTC), pp. 1261-1266, Lake Buena Vista, FL, June 1, 2001.
Web-Based Graduate Course on the Mechanical Design of High Temperature and
High Power Electronics,
P. McCluskey, Proceedings of the Electronic Component and Technology
Conference (ECTC), pp. 397-400, Lake Buena Vista, FL, May 30, 2001.
Focus Group Results on Student Project Team Performance Issues,
Natishan, M. E., Schmidt, L., Mead, P.F., ASEE Journal of Engineering
Education, vol. 89, no. 3, July 2000, p. 269.
Engineering Project Team Training System (EPTTS)
for Effective Engineering Project Team Management, Mead, P.F.,
Natishan, M., Schmidt, L, Greenberg, J., Bigio, D., Gupte, A. American
Society for Engineering Educators Annual Conference, St.Louis, MO, June
New Course Development in Products and Systems Cost Analysis,
P. Sandborn, D. T. Allen, and C. F. Murphy, Proc.
of the Electronic Components and Technology Conference, Las Vegas, NV, May
2000, pp. 1021-1026.
Distance Learning in Thermal Design of Electronic Systems
the IEEE/NSF Project, Y. Joshi, A. Bar-Cohen, S.
Bhavnani, Electronic Components and Technology Conference, 2000.
Electronic Products and Systems Research and Education for the 21st
Century, Y. Joshi and P. Sandborn, Future Circuits International.,
Vol. 6, p.88-91, 2000.
A Multi-University Web-based Undergraduate Course in Electronics
Packaging, J. Morris and P. McCluskey, Proc. of 49th Electronic
Components & Technology Conf., San Diego, CA, June 1-4,
1999, pp. 899-903.
A Multidisciplinary Sophomore Course in
Electronics Packaging, J. Morris and P. McCluskey, Proc. of
48th Electronic Components and Technology Conference, Seattle, WA, May
25-28, 1998. pp. 535-540.
EPS Program, Y. Joshi, M. Pecht, and W.
Nakayama. Presented at the Electronic Components and Technology Conference,
San Jose, CA, May 1997.
A New Educational Program in Electronic
Packaging and System Center (EPS), Y. Joshi, D.B. Barker and M. Ojalvo,
Journal of Engineering Education, Vol. 86, pp. 83-187, 1997.
Moire Interferometry as a Tool for
Engineering Education, B. Han, Y. Guo and C. K. Lim, Proceedings of the
1995 ASME International, Intersociety Electronic Packaging Conference, ASME,
Lahaina, HI, March 1995.
For more information on CALCE Education Program, please
contact Dr. Diganta Das