Failure analysis is an important tool in the effort to ensure reliability of electronic products and systems throughout the product lifecycle. Process optimization often requires failure analysis to identify the results of parameter changes. Thorough failure analysis is required during accelerated testing to ensure wearout mechanisms are being generated. And continuous product improvement is dependent upon failure analysis of field returns. Unfortunately, failure analysis is often performed incorrectly or insufficiently, which can lead to a poor understanding of failure mechanisms or absolute frustration.

This course will present a methodology for identifying potential failure mechanisms based on the failure history. Appropriate failure analysis techniques for various failure mechanisms will be discussed, with step-by-step details provided. Example pictures and case studies will be presented. The course will conclude with corrective and preventative actions, the most crucial part of a failure analysis report.

For planning your training course, please click here. You can also contact the calce training team led by Prof. Michael Pecht for more information.

1. Failure Mode Identification

2. Failure Mechanism Identification

• Component Packaging
• Boards and Substrates
• Interconnects (Solder Joints)
• Contacts and Connectors

3. Failure Analysis Techniques

• Non-destructive Analysis (NDA)
• Destructive Analysis
• Materials Characterization
• Accelerated Testing

4. Corrective and Preventative Actions

Books

• Contamination of Electronic Assemblies
• Electronic Packaging: Materials and Their Properties
• Quality Conformance and Qualification of Microelectronic Packages and Interconnects