For next-generation electronic products, it is no longer practical to design the product for an unspecified environment, and then measure and improve the reliability of the product by a series of test and fix steps at the latter stages of development. Fast and cost-effective product development requires that reliability be assessed for the application environment of interest in the earliest stages of conceptual design, with prototype testing used only to confirm that the designed-in level of reliability has been achieved. Any reliability assessment methodology for next-generation electronic products must be fast and cost-effective to permit the development of products with more features and higher quality at lower cost in a time frame commensurate with today's shorter design cycles and faster times to market and profit. Furthermore, it must permit for the rapid qualification of components making optimal use of the manufacturer's test procedures and requiring a minimum of additional testing. Finally, it must be application-specific and based on the fundamental mechanisms by which electronics fail.

This course broken into two sections, (Component level and PCB level) will provide the attendees with the knowledge necessary to apply such a methodology to the qualification of components and the reliability assessment of electronic systems. Each section provides introduction to physics-of-failure based virtual qualification and application specific reliability assessment. The course will demonstrate how to use manufacturer's test data together with failure modeling to qualify a component for use in a particular application. The course will also demonstrate the application of this virtual qualification technique to the insertion of commercial components into high-temperature, high-power, automotive, and avionic applications. The use of virtual qualification for building reliability into power modules will also be discussed. The course will conclude with a discussion of the probabilistic nature of reliability assessment and with a demonstration of computer-aided tools for virtual qualification and application-specific reliability assessment.

For planning your training course, please click here. You can also contact the calce training team led by Prof. Michael Pecht for more information.

• Introduction  
  
• Failure Mechanisms and Models
• Board Level   
• Component Level  
  
• Life Cycle Loads and Load Transformation
• Life Cycle Loads   
• Thermal    
• Vibration 
  
• Virtual Qualification 
  
• VQ Examples
• Board Level   
• Component Level   

Books and Material

• Electronic Packaging: Materials and Their Properties
• High Performance Printed Circuit Boards
• Handbook of Electronic Package Design
• Calce PWA Software