|
| Faculty,
Research Scientists | Research
Assistant | Visiting
Scholars | Support Staff
| Former Students | Current Student [Member View] |
Faculty
and Research Scientists
|
Prof.
Michael
Pecht |
Reliability
&
Supply Chain Policies |
301-405-5323
pecht@calce.umd.edu |
|
Dr.
Michael Osterman |
Testing and Simulation
Based Failure Assessment |
301-405-8023
osterman@calce.umd.edu |
|
Dr.
Moustafa Al-Bassyiouni |
Shock and Vibration, Opto-Electronics,
Smart Composites |
301-405-1364
moustafa@umd.edu
|
|
Dr.
Michael Azarian |
Materials Science, Photonic Devices, Tribology,
and Reliability |
301-405-7555
mazarian@calce.umd.edu |
|
Prof. Avram Bar-Cohen |
Photo Optics and Thermal |
301-405-3173
abc@umd.edu
|
|
Prof.
Donald Barker |
Shock
& Vibration,
Connection, Opto-electronic |
301-405-5264
dbarker@calce.umd.edu
|
|
Prof. David Bigio |
Polymers |
301-405-5258
bigio@eng.umd.edu |
|
Prof. Abhijit Dasgupta |
Interconnect
Reliability,
Accelerated Testing |
301-405-5251
dasgupta@calce.umd.edu |
|
Dr.
Diganta
Das |
Parts
Selection
& Management
Uprating |
301-405-5323
digudas@calce.umd.edu |
| Dr. Ravi Doraiswami |
MEMS, Flip Chip technology, NanoBio sensors, Sensors network, Systems reliability and Failure Analysis |
301-405-7334
ravidsw@calce.umd.edu |
Prof.
Bongtae Han |
Quantitative
Damage Characterization and Portable Electronics |
301-405-5255
bthan@calce.umd.edu |
| Dr. Changsoo Jang |
Numerical
Assessment on Design and Reliability |
301-405-5281
csjang@calce.umd.edu |
| Andrew
Kluger |
Visiting Senior Research Scientist |
(415) 302-7691
kluger001@aol.com |
|
Prof. Patrick McCluskey |
Power
Electronics, Component Reliability |
301-405-0279
mcclupa@calce.umd.edu |
|
Prof. Michael
Ohadi |
Thermal
Management |
301-405-5263
ohadi@eng.umd.edu |
|
Prof.
Peter Sandborn |
Technology
Tradeoff Analysis
Life Cycle Cost, MEMs |
301-405-3167
sandborn@calce.umd.edu |
| Ahmed Amin |
Materials |
301-405-5316
aminan@calce.umd.edu |
|
Peter
Hansen |
Power
Electronics, Component Reliability |
301-405-4563
phansen@calce.umd.edu |
Sony Mathew |
Reliability
& Prognostics |
301-405-5331
sonym@calce.umd.edu |
| Anshul
Shrivastava |
Materials |
301-405-7334
ashrivas@calce.umd.edu |
Bhanu Sood |
Failure
Analysis, Materials Characterization and Accelerated Testing |
301-405-3498
bpsood@calce.umd.edu |
| Gerald Seidel |
Faculty Research Advisor |
301-405-5331
gseidel@calce.umd.edu |
Back to top
Research
Assistants
| Name |
Research
Area |
Ph Ext
301-40xxxxx |
Email |
| Alam, Mohammed |
Embedded Passives |
55288 |
malam@calce.umd.edu |
| Bi, HongBo |
Electronics Reliability |
55269 |
hbbi@calce.umd.edu |
| Challa, Vidyu |
Failure Analysis |
50954 |
vchalla@calce.umd.edu |
| Chang, Moon-Hwan |
Light Emitting Diodes |
57557 |
mhchang@calce.umd.edu |
| Chauhan, Preeti |
Solder durability modeling |
55288 |
pchauhan@calce.umd.edu |
| Cheng, Shunfeng |
PHM |
58038 |
chengsf@calce.umd.edu |
| Choi Cholmin |
Microvia Non-destructive Inspection
& Qualification |
54571 |
cchoi@calce.umd.edu |
| Cuddalorepatta, Gayatri |
Solder properties |
58126 |
gayatric@calce.umd.edu |
| Dai, Jun |
Telecom Systems Qualification |
58038 |
jundavid@calce.umd.edu |
| Farley, Daniel |
Reliability Assessment |
58126 |
dmf@calce.umd.edu |
| George, Elviz |
High temperature use solders |
55346 |
egeorge@calce.umd.edu |
| Gregory, Patrice |
Mechanical Testings of PWAs |
50765 |
pgregory@calce.umd.edu |
| Han, Sungwon |
Tin Whiskers |
57334 |
swhans@umd.edu |
| Hasin, Saifa |
MEMs Testing |
50765 |
shasin@calce.umd.edu |
| He, Xiaofei |
Electrochemical Migration |
57557 |
xhe@calce.umd.edu |
| Jaai, Rubyca |
PHM |
55288 |
rubycajj@calce.umd.edu |
| Kwon, Daeil |
RF Impedance of Interconnects |
55329 |
dkwon@calce.umd.edu |
| Majeed, Yasir |
Electronics Reliability |
55231 |
ymajeed@calce.umd.edu |
| Munday, Lynn |
Electronics Reliability |
55231 |
lmunday@calce.umd.edu |
| Oberc, Tim |
High Temperature Solders |
55346 |
toberc@calce.umd.edu |
| Oh, Hyunseok |
PHM |
55324 |
hsoh@calce.umd.edu |
| Panashchenko , Lyudmyla |
Tin Whiskers |
50954 |
lyudmyla@calce.umd.edu |
| Paquette, Beth |
Vibration Testing of Solder Joints |
50767 |
bmp@umd.edu |
| Park, Mamkyu |
Electronics Reliability |
55471 |
namkyu@calce.umd.edu |
| Patil, Nishad |
Reliability for FPGA and IGBTs |
57557 |
nishad@calce.umd.edu |
| Sharon, Gil |
Cracking of Ceramic Chip Capacitors |
50767 |
gsharon@umd.edu |
| Sotiris, Vasilis |
PHM |
55331 |
vsotiris@calce.umd.edu |
| Srinivas, Vikram |
Mechanical Testings of PWAs |
55346 |
vikram@calce.umd.edu |
| Sinha, Kaustav |
Interconnect durability |
55231 |
ksinha@calce.umd.edu |
| Wang, Peng |
Electronics Reliability |
50724 |
wangp@calce.umd.edu |
| Wang, Yong |
Electronics Reliability |
53190 |
yongwang@calce.umd.edu |
Back to top
Visiting Scholars - 2008-2009
| Ying Tung Chan |
Hong Kong |
| W.
Chen |
China |
| Frederic Porta |
France |
| T.
Fung |
Hong Kong,
China |
| K.
Holdermann |
Germany |
| Thomas
Kahnert |
Germany |
| P.
Lam |
Hong Kong,
China |
| Lee Lee Law |
Hong Kong |
| E.
Layoun |
Lebanon |
| Chrisian
Lenakakis |
Germany |
| David
Levi |
Israel |
| L.
Ling |
Hong Kong,
China |
| C.
Man |
Hong Kong,
China |
| P.
Mueller |
Germany |
| M.
Poesl |
Germany |
| Chrisslea
Sommerfeld |
Germany |
| Sven
Stiller |
Germany |
| Po K. Tam |
Hong Kong |
| Ryuichi Teramoto |
Japan |
| Axel
Theis |
Germany |
| O.
Weis |
Germany |
| Hoi C. Wu |
Hong Kong |
| H.
Zhang |
China |
Back to top
Support Staff
|
