| Faculty, Research Scientists | Research Assistant | Visiting Scholars | Support Staff |

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Research Assistants

Name Research Area Ph Ext 301-40xxxxx Email
Alam, Mohammed Embedded Passives 55288 malam{@}calce.umd.edu
Bi, HongBo    55269 hbbi{@}calce.umd.edu
Brock, Garry  Capacitor Reliability 57557 gbrock{@}calce.umd.edu
Charooseh, Navid  PHM 55324 navidc{@}calce.umd.edu
Chatterjee, Kaushik  Supply chain management 55901 kaushikc{@}calce.umd.edu
Chauhan, Preeti  Solder durability modeling 55288 pchauhan{@}calce.umd.edu
Cheng, Shunfeng  PHM 58038 chengsf{@}calce.umd.edu
Choi Cholmin  Microvia Non-destructive Inspection & Qualification 54571 cchoi{@}calce.umd.edu
Cuddalorepatta, Gayatri  Solder properties 55231 gayatric{@}calce.umd.edu
Emmel, Rachel  Shock loading 50765 remmei{@}calce.umd.edu
Farley, Daniel  Reliability Assessment 55231 dmf{@}calce.umd.edu
George, Elviz  High temperature use solders 55901 egeorge{@}calce.umd.edu
Goswami, Arindam  Optomechanics 55471 agoswami{@}calce.umd.edu
Gregory, Patrice  Mechanical Testings of PWAs 50765 pgregory{@}calce.umd.edu
Gu, Jie  PHM 55324 jiegu{@}calce.umd.edu
Gupta, Sumit    53498 gsumit{@}calce.umd.edu
Hasin, Saifa  MEMs Testing 50765 shasin{@}calce.umd.edu
He, XiaofeiElectrochemical Migration57557xhe{@}calce.umd.edu
Jaai, Rubyca  PHM 55288 rubycajj{@}calce.umd.edu
Jafreen, Rifat    55338 rjafreen{@}calce.umd.edu
Khuu, Vinh  Thermal interface materials 55901 vkhuu{@}calce.umd.edu
Kumar, Sachin  PHM 55324 skumar{@}calce.umd.edu
Kwon, Daeil  RF Impedance of Interconnects 55329 dkwon{@}calce.umd.edu
Lee, Yuri    55231 yrlee{@}calce.umd.edu
Lopez, Leon  Sockets reliability xxxxx Leon.Lopez{@}Sun.COM
Majeed, Yasir    55231 ymajeed{@}calce.umd.edu
Munday, Lynn    55231 lmunday{@}calce.umd.edu
Nie, Lei  BGA Reprocessiong and Rework 58038 leinie{@}calce.umd.edu
Oberc, Tim   High Temperature Solders 55346 toberc{@}calce.umd.edu
OH, Hyunseok  PHM 55324 hsoh{@}calce.umd.edu
Panashchenko , Lyudmyla Tin Whiskers 50954 lyudmyla{@}calce.umd.edu
Park, Mamkyu    55471 namkyu{@}calce.umd.edu
Patil, Nishad  Reliability for FPGA and IGBTs 57557 nishad{@}calce.umd.edu
Pike, Leah   High Temperature Substrates 55916 lpike{@}calce.umd.edu
Plaza, Gustavo  Vibration Induced Fatigue 55329 gplaza{@}calce.umd.edu
Quintero, Pedro  High temperature attach materials 55916 pquinter{@}calce.umd.edu
Roettele, Shaughn High IO BGA Reliability 55231 sroettel{@}calce.umd.edu
Sanapala, Ravikumar  Printed circuit board reliablity 55901 ravikumr{@}calce.umd.edu
Sotiris, Vasilis  PHM 55331 vsotiris{@}calce.umd.edu
Srinivas, Vikram  Mechanical Testings of PWAs 55901 vikram{@}calce.umd.edu
Sinha, Kaustav  Interconnect durability 55231 ksinha{@}calce.umd.edu
Tomy, Micheal Abraham  PHM 55288 atomy{@}calce.umd.edu
Vickey, Nathan  Optomechanics 57417 nvickey{@}calce.umd.edu
Wang, Peng    50724 wangp{@}calce.umd.edu
Wang, WeiQiang  Quality and Reliability of Solder Dipped Parts 58038 wangwq{@}calce.umd.edu
Wang, Yong    53190 yongwang{@}calce.umd.edu
Watkins, James R.  Extreme shock loading 50765 jrwatkin{@}wam.umd.edu
Wu, Rui   Low Temperature Electronics 55916 rwu{@}calce.umd.edu
Yu, Alan  Optomechanics 55280 alanyu{@}calce.umd.edu
Zhou, Yuxun  Vibration Induced Fatigue 50296 yzhou{@}calce.umd.edu

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 Visiting Scholars

2007

Andre Bideaux Germany
W. Chen China
Abdouramane Diallo Germany
V. Ehret German
T. Fung HongKong, China
K. Holdermann Germany
R. Hammad Lebanon
Thomas Kahnert Germany
P. Lam HongKong, China
E. Layoun Lebanon
Chrisian Lenakakis Germany
David Levi Israel
L. Ling HongKong, China
C. Man HongKong, China
P. Mueller Germany
Takhiro Omori Japan
M. Poesl Germany
T. Shibutahi Japan
Chrisslea Sommerfeld Germany
Sven Stiller Germany
Axel Theis Germany
O. Weis Germany
H. Zhang China
Yuxun Zhou China

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 Support Staff