Prof. Bongtae Han

Dr. Han received his BS and MS degrees from Seoul National University in 1981 and 1983, respectively, and his Ph.D. degree in Engineering Mechanics from Virginia Tech in 1991.  He is currently a Professor of the Mechanical Engineering Department of the University of Maryland at College Park and is directing the LOMSS (Laboratory for Optomechanics and Micro/nano Semiconductor/Photonics Systems), which is one of the CALCE (Center for Advanced Life Cycle Engineering) research laboratories.

Dr. Han’s research interests include: (1) mechanical design and reliability prediction of microelectronic, photonic and MEMS devices; (2) experimental micro and nanomechanics, specifically development of optical methodologies for characterization of micro and nano structures and mechanical properties.  He serves critical industrial needs through measurement and interpretation of thermo-mechanical deformations of microelectronic, photonic and MEMS devices.  His contributions center around experimental analyses by optical techniques.  He developed, extended and utilized special measurement means, including Moiré Interferometry, Micro-Moiré Interferometry, Far Infrared Fizeau Interferometry and Advanced Shadow Moiré, thereby providing instrumentation for, and analyses of, device behavior; instrumentation that he developed is widely used in industry today.  These experimental analyses provide critical guidance and verification for extensive computational analyses. 

Dr. Han has co-authored a text book entitled "High Sensitivity Moiré: Experimental Analysis for Mechanics and Materials", Springer-Verlag, 1994.  He edited two books and has published 8 book chapters and over 120 journal and conference papers in the field of microelectronics and experimental mechanics.  He holds 2 US patents and 2 invention disclosures. 

Dr. Han served as an Executive Board Member and the Chairman of the Electronic Packaging Division of the SEM.  He served as an Associate Technical Editor for the major international journal of the SEM, Experimental Mechanics, from 1999 to 2001, and has been serving as an Associate Technical Editor for Journal of Electronic Packaging, Transaction of the ASME since 2003.  He organized and served as a general chair for the 1st International Symposium on Experimental/Numerical Mechanics in Electronic Packaging in 1996.  He also served as a general chair for numerous internal symposia including the International Symposium on Recent Developments of Experimental Mechanics, ASME Summer Annual Meeting, in 1999 and the 1st International Symposium on Optical Methodologies and Metrologies for Microelectronics and Photonics in 2004.  He made a Keynote Lecture at the 5th International Congress on Thermal Stresses and Related Topics in 2003 and his lecture was published in Journal of Thermal Stresses.

Dr. Han received the IBM Excellence Award for Outstanding Technical Achievements in 1994.  He was a recipient of the 2002 Brewer Award, presented at the Annual Conference of the SEM in Emerging Technologies, for his contributions to experimental characterization of microelectronics devices.  He also received the 2005 Associate Editor of the Year Award from the ASME.  His publication awards include the Year 2004 Best Paper Award of the IEEE Transactions on Components and Packaging Technologies, and the Gold Award (best paper in the Analysis and Simulation session) at the 1st Samsung Technical Conference in 2004. 

Dr. Han was elected a Fellow of the SEM (Society for Experimental Mechanics) and the ASME (American Society for Mechanical Engineers) in 2006 and 2007, respectively.

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