Dr. Changsoo Jang is an assistant research scientist at the Center for Advanced Life Cycle Engineering. He received his Ph.D. degree in Mechanical Engineering from Korea Institute of Science and Technology. His research interests include physics-of-failure based reliability assessment and design optimization for enhanced reliability of microelectronics components and flexible electronics and mass transport through composite media.

He has published over 30 journal and conference papers in the field of electronic system optimization and microelectronics reliability assessment. He holds one U. S. patent on the design criteria of memory package.