Dr. Michael Osterman (Ph.D. Mechanical Engineering, University of Maryland, College Park) is a Senior Research Scientist and the CALCE Electron ic Products and System Consortium Director at the University of Maryland. He heads the development of simulation assisted reliability assessment software for CALCE and simulation approaches for estimating time to failure of electronic hardware under test and field conditions. Dr. Osterman is one of the principle researchers in the CALCE effort to develop simulation models for temperature cycling fatigue of Pb-free solder. He has been involved in the study of tin whiskers since 2002 and has authored several articles related to the tin whisker phenomenon. He has written various book chapters and numerous articles in the area of electronic packaging. In addition, he heads the development of simulation based failure assessment software at CALCE. He is a member of ASME, IEEE, SMTA, and TMS.