Donald B. Barker

Education

Ph.D. in Engineering, 1976 University of California, Los Angeles
M.S. Mech. Engineering, 1971 University of Washington, Seattle
B.S. Mech. Engineering, 1969 University of Washington, Seattle

Faculty Service

Professor: August 1993 - Present

Department of Mechanical Engineering
University of Maryland, College Park, MD

Associate Professor: August 1981 - July 1993

Department of Mechanical Engineering
University of Maryland, College Park, MD

Assistant Professor: August 1976 - July 1981

Department of Mechanical Engineering
University of Maryland, College Park, MD

Profesional Memberships:

American Academy of Mechanics
American Society of Mechanical Engineers
American Society of Testing and Materials
Institute of Environmental Sciences
Institute for Interconnecting and Packaging Electronic Circuits
International Society for Hybrid Microelectronics
Society for Experimental Mechanics

Selected Recent Publications:

Gupta, V and D. B. Barker, "Modeling Solder Joint Fatigue Life for Gullwing Leaded Packages: Part 1 - Elastic Plastic Stress Model," Journal of Electronic Packaging, Vol. 117, No.2, pp 123-129, June 1995.

Pecht, M., D. Barker, and P. Lall "Development of an Alternative Wire Bond Test Technique," IEEE Transactions on Components, Packaging, and Manufacturing Technology, Vol. 17, No. 4, pp 610-615, December 1994

Hu J.M., D. Barker, R. Goshtagore, and M. Pecht, "Investigation of Thermomechanical Properties of Low Temperature Cofired Ceramic," Journal of Electronic Packaging, Vol. 116, No.2, pp 148-153, June 1994

Barker, Donald B. and Sidharth, "Local PWB and Component Bowing of an Assembly Subjected to a Bending Moment," ASME Winter Annual Meeting paper number 92-WA/EEP-4, New Orleans, Louisiana, Nov. 28 - Dec. 3, 1993 also Journal of Electronic Packaging, Vol. 116, No.2, pp 92-97, June 1994.

Barker, Donald B. and Abhijit Dasgupta, "Thermal Stress Issues in Plated-Through-Hole Reliability", Thermal Stress and Strain in Microelectronics Packaging, edited by John Lau, Van Nostrand Reinhold, 1993.

Verma, S., A. Dasgupta, D. Barker, "A Numerical Study of Fatigue Life of J-Leaded Solder Joints Using the Energy Partitioning Approach," Journal of Electronic Packaging, Vol. 115, No. 4, pp 416-423, December 1993.

Christou, A., A. Dasgupta, M. Pecht and D. Barker, "Reliability Considerations for MMIC Packages," Reliability of Gallium Arsenide MMICs, Edited by Aris Christou, John Wiley and Sons, 1992.

Condra, Lloyd, Steve O'Rear, Time Freedman, Leo Flancia, Michael Pecht, and Donald Barker, "Comparison of Plastic and Hermetic Microcircuits Under Temperature Cycling and Temperature Humidity Bias," IEEE Transactions on Componnets, Hybrids, and Manufacturing Technology, Vol. 15, No. 5, October 1992.

Barker, D.B., I. Sharif, A. Dasgupta, M.G. Pecht, "Effect of SMC Lead Dimensional Variabilities on Lead Compliance and Solder Joint Fatigue Life," ASME Winter Annual Meeting paper number 91-WA-EEP-25, Atlanta, GA, Dec. 2-6, 1991, also Journal of Electronic Packaging, Vol. 114, No. 2, pp. 177-84, June 1992.

Dasgupta, A., C. Oyan, D. Barker, M. Pecht, "Solder Creep-Fatigue Analysis by an Energy-Partioning Approach," ASME Winter Annual Meeting paper number 91-WA-EEP-19, Atlanta, GA, Dec. 2-6, 1991, also Journal of Electronic Packaging, Vol. 114, No. 2, pp 152-60, June 1992.

Barker, Donald B., Abhijit Dasgupta, Michael G. Pecht, "PWB Solder Joint Fatigue Life Calculations Under Thermal and Vibrational Loading," Journal of the IES, Vol. 35, no. 1, pp 17-25, January 1992.

Argarwal, R.K., A. Dasgupta, M. Pecht, and D. Barker, "Prediction of PWB/PCB Thermal Conductivity," International Journal for Hybrid Microelectronics, Vol. 14, no. 3, pp 83-95, September 1991.