Prof. Peter Sandborn (Electrical Engineering, Ph.D. University of Michigan) is an associate professor with research experiences and interests in the areas of electronic packaging tradeoff analysis, multichip module design, design for manufacturability and assembly of multichip systems, design to cost, and design for environment. He is currently involved in several research projects dealing with the physics of failure and reliability of electronic components assemblies and interconnects, parts selection and management, MEMs reliability, and detailed cost modeling of electronic packaging. Previously, Dr. Sandborn was a senior member of technical staff at MCC, a founder and the chief technical officer of Savantage, Inc. and a technical contributor at Nu Thena Systems, Inc. He has written one book on the conceptual design of multichip modules and systems and is the author of over 70 technical papers on electronic packaging and semiconductor device simulation. Click here to go to his web site.