CALCE ALUMNI
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2009
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Ph.D.
Gu, Jie (Baker Hughes)
Ph.D. Mechanical Engineering
Prognostics of Solder Joint Reliability Under Vibration Loading Using Physics of Failure Approach
Khuu, Vinh (Schlumberger, TX)
Ph.D. Mechanical Engineering
Evaluation of Thermal Interface Materials and the Laser Flash Method
Kumar, Sachin (The DEI Group)
Ph.D. Mechanical Engineering
Prognostic and Health Management of Electronic Products
Lopez, Leoncio (Sun Microsystems, Inc., CA)
Ph.D. Mechanical Engineering
Quality and Reliability of Land Grid Array Sockets
M.S.
Askari, Alex F. (U.S. Navy)
M.S. Mechanical Engineering
Modeling and Simulation of Shock and Drop Loading for Complex Portable Electronic Systems
Brock, Garry (Graduate Student, Cornell University)
M.S. Mechanical Engineering
Reliability of Multilayer Ceramic Capacitors
Emmel, Rachel (General Dynamics - AIS)
M.S. Mechanical Engineering
Development of a Test Metohdology to Determine Dynamic Fracture Strength in Microfabricated MEMS Structures
Roettele, Shaughn M. (JHU-APL)
M.S. Mechanical Engineering
Probabilistic Physics of Failure Assessment of Thermomechanical
Fatigue of High-I/O Area-Array Interconnects
Wang, Weiqiang (Baker Hughes)
M.S. Mechanical Engineering
Solder Joint Reliability of Sn and SnBi Finished and Refinished Sn (SAC/SnPb)
SMT Packages under Temperature Cycling Test
2008
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Ph.D.
Goswami, Arindam
Ph.D. Mechanical Engineering
Quantitative Hermeticity Assessment of Packages with Micro to Nano-Liter Cavities
Moores, Kevin A. (U.S. Department of Defense)
Ph.D. Mechanical Engineering - 2002
Thermal and Hydrodynamic
Investigation of Shrouded Pin Fin Heat Sinks With Liquid Cooling
Wu, Rui
Ph.D. Mechanical Engineering
Influence of Cryogenic Temperature and Microstructure on Fatigue Failure of Indium Solder Joint
M.S.
Pike, Leah
M.S. Mechanical Engineering
Plaza, Gustavo Alberto (Schlumberger, TX)
M.S. Mechanical Engineering
Impact of Board Pad Finish on the SNPB and Lead-Free Solder Interconnect Reliability for Leadless Chip Resistors Under Random Vibration Loading
Sanapala, Ravikumar
(Perfint Healthcare Pvt. Ltd. - India)
M.S. Mechanical Engineering
Characterization of FR-4 Printed
Circuit Board Laminates Before and After Exposure to Lead-Free Soldering Conditions
2007
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Ph.D.
Choubey, Anupam (Vicor, Corp., MA)
Ph.D. Mechanical Engineering
Elerath, Jon
Ph.D. Mechanical Engineering
Reliability Model and Assessment of Redundant Arrays of Inexpensive
Disks (RAID) Incorporating Latent Defects and Non-Homogenous Poisson Process Events
M.S.
Feng, Dan (Booz Allen Hamilton)
M.S. Mechanical Engineering
Optimizing Lifetime Buy Quantities To Minimize Lifecycle Costs
Myers, Jessica (U.S. PTO)
M.S. Mechanical Engineering
Integration of Technology
Roadmapping Information into DMSMS-Driven Design Refresh Planning of
the V-22 Advanced Mission Computer
Tuchband, Brian (Boeing, PA)
M.S. Mechanical Engineering
Implementation of Prognostics and Health Management for Electronic Systems
2006
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Ph.D.
Dash, Manas
(Philips Healthcare, PA)
Ph.D. Mechanical Engineering
Thermo-Mechanical Durability Assessment and Microstructural Characterization
Study of 95.5Pb2Sn2.5Ag High Temperature Solder
Deng, Yuliang (De Amertek Corporation, IL)
Ph.D. Mechanical Engineering
Carbon Fiber Electronic Interconnect
Jannesari Ladani, Leila (Utah State University)
Ph.D. Mechanical Engineering
Damage Initiation and Evolution in Voided and Unvoided Lead Free Solder Joints Under Cyclic Thermo-Mechanical Loading
Keimasi, Mohammedreza (Skyline Solar, CA)
Ph.D. Mechanical Engineering
Flex cracking and temperature-humidity-bias effects on reliability of multilayer ceramic capacitors
Liu, Yan (Medtronic, Inc. - MN)
Ph.D. Mechanical Engineering
Reduction of Skin Stretch Induced Motion Artifacts in Electrocardiogram Monitoring Using Adaptive Filtering
Qi, Haiyu (Cameron International)
Ph.D. Mechanical Engineering
Plastic Ball Grid Array Solder Joint Reliability Assessment Under Combined Thermal Cycling and Vibration Loading Conditions
Varghese, Joseph (Apple, CA)
Ph.D. Mechanical Engineering
Drop Testing of Portable Electronic Devices
Vichare, Nikhil (Dell, TX)
Ph.D. Mechanical Engineering
Prognostics and Health management of Electronics by Utilizing Environmental and Usage Loads
Wu, Mei-Ling (National Cheng Kung University, Taiwan)
Ph.D. Mechanical Engineering
Dissertation: Rapid Assessment Methodology of BGA Fatigue Life under Vibration Loading
Zhan, Sheng, (Baker Hughes, TX)
Ph.D. Mechanical Engineering
Surface Insulation Resistance Degradation and Electrochemical Migration on Printed Circuit Boards
M.S.
Jinka, Krishna Kumar
M.S. Mechanical Engineering
Thermo-mechanical Analysis of Encapsulated Ball-Wedge Wire Bonds in Microelectronics, using Raleigh-Ritz Modeling
Sengupta, Shirsho (AMD, CA)
M.S. Mechanical Engineering
Effects of Solder-Dipping as A Termination Re-Finishing Technique
Song, Bo (Vicor Corporation, MA)
M.S. Mechanical Engineering
Reliability Evaluation of Stacked Die BGA Assemblies under
Mechanical Bending Loads
Wang, Zhixiang
M.S. Mechanical Engineering
2005
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Ph.D.
Cho, Seungmin
Ph.D. Mechanical Engineering
Development of Moiré Interferometry for Real-time Observation of Nonlinear Thermal Deformations of Solder and Solder Assembly
Etienne, Bevin
Ph.D. Reliability Engineering
The Development
of Cost and Size Analysis for the Assessment of Embedded Passives
in Printed Circuit Boards
Fang, Tong (Vitesse, CA)
PH.D. Mechanical Engineering
Tin Whisker Risk Assessment Studies
Fukuda, Yuki (Professional Testing (EMI) Inc., TX)
PH.D. Mechanical Engineering
Experimental Investigations of Whisker Formation on Tin Platings
Han, Changwoon (KETI, Korea)
Ph.D. Mechanical Engineering
Shadow Moir¨¦ Using Non-zero Talbot Distance and Application of Diffraction Theory to Moir¨¦ Interferometry
Hwang, Yu-Chul (SamSung, Korea)
Ph.D. Materials and Nuclear Engineering
Electrostatic Discharge and Electrical Overstress Failures of Non-Silicon Devices
Tiku, Sanjay (Microsoft Inc., WA)
Ph.D. Mechanical Engineering
Reliability Capability Evaluation for Electronics Manufacturers
Zhao, Ping (Medtronic, Inc. - MN)
Ph.D. Mechanical Engineering
Creep Corrosion over Plastic Encapsulated Microcircuit Packages with Noble Metal Pre-plated Leadframes
Zheng, Yunqi (General Motors Technical Center, MI)
Ph.D. Mechanical Engineering
Effect of Surface Finishes and
imtermetallics on power Cycling Reliability of Snagcu Die Attach
M.S.
Mishra, Rajeev (Apple, CA)
M.S. Mechanical Engineering
An Uprateability Risk Assessment Methodology
2004
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Ph.D.
Blattau, Nathan J. (Entrepeneur)
Ph.D. Mechanical Engineering
Models For Rapid Assessment of Surface Mount Component FailuresDuring Printed Wiring Board Bending
Cho, Sungyeol (Intel)
Ph.D. Mechanical Engineering
Development of Optical Measurement Technique for Nano-Mechanics
Donahoe, Daniel (Exponent, Inc. CA)
Ph.D. Mechanical Engineering
Moisture in Multilayer Ceramic Capacitors
Li, Lin
Ph.D. Mechanical Engineering
Analysis and Mitigation of Electromagnetic Noise in Resonant Cavities and Apertures
Meyyappan, Karumbu Nathan (Intel Corp., OR)
Ph.D. Mechanical Engineering
Failure Prediction of Wire Bonds due to Flexure
Rogers, Keith (U.S. Department of Defense, MD)
Ph.D. Mechanical Engineering
An Analytical and Experimental Investigation of Filament Formation in Glass/Epoxy Composites
Singh, Pameet (CALCE EPSC)
Ph.D. Mechanical Engineering
Forecasting Technology Insertion
Concurrent with Design Refresh Planning for COTS-Based Obsolescence
Sensitive Sustainment-Dominated Systems
M.S. Mechanical Engineering - 2001
Design Refresh Planning Optimization
Driven by Electronic Part Obsolescence
Zhang, Qian (Dell, TX)
Ph.D. Mechanical Engineering
Isothermal Mechanical and Thermo-Mechancial Durability Characterizaton of Selected Pb-free Solders
M.S.
Chandrasekaran, Arvind (Qualcomm, CA)
M.S. Mechanical Engineering
Effect of mold compound on Au-Al wirebond-bondpad intermetallic formation
Ganesan, Sathyanarayan (Intel, AZ)
M.S. Mechanical Engineering
Virtual Design and Improved System Level Approach for Life Consumption Monitoring of Electronics
Mathew, Sony (CALCE-UMD, MD)
M.S. Mechanical Engineering
Remaining life assessment Methodology for electronic hardware under vibration and shock Loads
Shi, Zhen
M.S. Mechanical Engineering
Test of Electronic Systems Assembly
Shrivastava, Anshul (CALCE-UMD, MD)
M.S. Mechanical Engineering
2003
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Ph.D.
Lantz, Leon (LPS, MD)
Ph.D. Mechanical Engineering
The Measurement of Ion Diffusion in Epoxy Molding Compounds Used to Encapsulate Microelectronic Devices
Stadterman, Thomas (U.S. AMSAA, MD)
Ph.D. Mechanical Engineering
Practical Assessment Methodologies for Circuit Cards Under Mechanical Shock Loading
Valentin, Ricky (University of Puerto Rico, Mayaguz, Puerto Rico)
Ph.D. Mechanical Engineering
A Rapid Failure Assessment Approach for Insertion Mounted Solder Interconnects Under Thermomechanical Cycling
Wang, Zhaoyang (The Catholic University of America, DC)
Ph.D. Mechanical Engineering
Development and Application of Computer-aided Fringe Analysis
Wu, Ji (Intel, AZ)
Ph.D. Mechanical Engineering
Electrical Characterizaton and Reliability Assessment of Lead-Free Solder Separable Contact Interfaces
Wu, Xin
Ph.D. Mechanical Engineering
Developing Highly Accurate and Stable Open-region Electromagnetic Simulations
Yang, Yubing
Ph.D. Mechanical Engineering
Reliability Assessment of Optical Fibers Under Tension and Bending Loads
M.S.
Bumiller, Elissa (NSWC, MD)
M.S. Mechanical Engineering
Electrochemical Migration on FR-4 Printed Wiring Board Surface
Calhan, Derya
M.S. Mechanical Engineering
An Application of the 3-Parameter Weibull Distribution to the Estimation of the Failure Free Operating Period of Electronic Systems
Casey, Paul (Electrolux Home Products Corporation N.V., Belgium)
M.S. Mechanical Engineering
Managementof Lead-Free Solder Alloy Intellectual Property for Lead-Free Electronics
Gupta, Shirish (Dell, TX)
M.S. Mechanical Engineer
Temperature and Rate Dependent Partitioned Constitutive Relationships for 95.5PB2SN2.5AG Solder Alloy
Mishra, Satchidananda (Dell Computer Crop., TX)
M.S. Mechanical Engineering
Life Consumption Monitoring for Electronics
Pollack, Deborah (NIST)
M.S. Mechanical Engineering
Validity of Constitutive Properties of Mechanical Deformation Analysis of Eutectic Solder
Rajagopal, Subramanian (Capital One, VA)
M.S. Mechanical Engineering
Transition of Low-Volume Complex Electronics System Industries to Lead-free Electronics
Rawat, Anoop (Freightliner, OR)
M.S. Mechanical Engineering
Thermomechanical Characterization and Evaluation of Conformal Coatings
Shetty, Vidyasagar
M.S. Mechanical Engineering
Remaining Life Assessme
nt Process of Electronic Systems
Stellrecht, Eric (Sierra Research)
M.S. Mechanical Engineering
Hygroscopic Swelling in Plastic Encapsulated Microelectronics: An Experimental Study Using Moiré Interferometry
Vijayaragavan, Niranjan
(Microsoft)
M.S. Mechanical Engineering
Physics of Failure Based Reliability Assessment of Printed Circuit Boards Used Permanent Downhole Monitoring Sensor Gauges
2002
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Ph.D.
O'Connor, Casey (Sensors for Medicine and Science, Inc. MD)
Ph.D. Mechanical Engineering
Influence of Rapid Altitude Cycling on the Reliability of Plastic Encapsulated Microcircuits
M.S.
Becker, Daniel V. (Northrop, MD)
M.S. Mechanical Engineering
Development and Application of
Yielded Cost in Electronic Manufacturing Process Improvement
Bhaskaran, Harish (IBM Research GmbH)
M.S. Mechanical Engineering
Die Shear Experimental and Modeling Verification of Chip-to-Chip Bonded Microelectromechanical Systems
Chebolu, Vijaya B. (PhD Student, Texas A&M University, TX)
Frequency-Domain Simulation of Open-Region Radiation and Scattering Problems Using the Complementary Operators Method
Cunningham, Jeremy (Honeywell, AZ)
M.S. Mechanical Engineering
Demonstration of Physics-of-Failure Assessment of an Avionic Controller
Mager, Brent M. (Systems Engineering Group, MD)
M.S. Mechanical Engineering
Analytic Characterization of
Interconnect Shear Force Behavior
Subramanian, Vinay
(Sloan School of Management, MIT, MA)
M.S. Mechanical Engineering
Modeling and Predictions of Switching Noise in High Speed Circuts and Packages
Topolosky, Zeke
M.S. Mechanical Engineer
Reliability Analysis of Springs Used as Interconnects in Press-Pack Power Electronic Modules
2001
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Ph.D.
Ardebili, Haleh (University of Houston, TX )
Ph.D. Mechanical Engineering
Moisture Diffusion and Reliability
Issues Associated with Moisture in Plastic Encapsulated
Microelectronics
Broadwater, Keita (HP, OR)
Ph.D. Mechanical Engineering
Characterization and Health Monitoring of Epoxy-Cured Fiber Optic Connectors Via Fiber Optic Sensing
Ciocci, Richard (Pennsylvania State University, PA)
Ph.D. Mechanical Engineering
Assessing the Migration to Lead-free
Electronic Products
Haswell, Peter L. (Hamilton Sunstrand, CT)
Ph.D. Mechanical Engineering - 2001
Durability Assessment and Microstructural Observations of Selected Solder Alloys
Liu, Weifeng, (Hewlett-Packard, CA)
Ph.D. Mechanical Engineering
Reliability Assessment of IC Component
Sockets
Sangalli, Nicoletta
Ph.D. Mechanical Engineering
Development of Creep-Fatigue Crack
Propagation Models for Solder Joint
M.S.
Bardhan, Samuel
(PD-LD Inc., NJ, 08534)
M.S. Mechanical Engineering
Electronics Technology Insertion
into Low Volume Complex Electronic Systems (LVCES)
Davuluri, Pavan (Microsoft, WA)
M.S. Mechanical Engineering
A multi- scale
modeling approach for stress analysis of electronic interconnects
Gopinath, Deepak (GE, MI)
M.S. Mechanical Engineering
Multi-Objective Placement
Optimization of Power Electronic Modules on Liquid Cooled Heat Sinks
Goray, Kunal (GE, Bangalore, India)
M.S. Mechanical Engineering
Durability of Surface mount components under flexural loads
Kalchuri, Shantanu (Qualcomm, CA)
M.S. Mechanical Engineering
Effects of Low Temperature Power
Cycling on Reliability of Power Electronic Devices
Majeed, Majed
M.S. Mechanical Engineering
Multifunctional Dual-Stiffness
Sensor for Insitu Real-time Stiffness and Energy-Density
Murray, Steve (Northrop Grumman, MD)
M.S. Mechanical Engineering
Aging and Qualification of Polyimide
Dielectric Film
Radhakrishnan, Jagadeesh (Intel, CA)
M.S. Mechanical Engineering
A Process-Based Cost of
Ownership Model for Inclusion of High-Frequency Micromachined Structures
in a Conventional
Raghavan, Ravi (Hughes Network Systems, MD)
M.S. Mechanical Engineering
Analysis of Test/Diagnosis/Rework
Operation Placement in the Technical Cost Modeling of Advanced Electrical
Power System Modules
Ramakrishnan, Arun (MBA Student at IIM - Bangalore)
M.S. Mechanical Engineering
Healthand Life Consumption
Monitoring Using Sensor Technologies
Ragan, Daniel (Price WaterHouse Cooper, VA)
M.S. Mechanical Engineering
Detail Cost Modeling for use with
Hardware/Software Co-Design of a System on a Chip
Sahasrabudhe, Shubhada (Intel, AZ)
M.S. Mechanical Engineering
Implementation and
interpretation of Failure Free Operating Periods and Associated
Confidence Limits in Electronic Systems Using 3-Parameter Weibull
Distribution
Sexton, Kontay V. (U.S. Department of Defense, MD)
M.S. Mechanical Engineering
Formulation of Simple Model to
Assess Microvia Thermal Cycle Fatigue Life
Sidhu, Jaspreet
M.S. Mechanical Engineering
Reliability Assessment of Thinpak
Power Module for Thermal Cycling Environments
Swaminathan, Rajesh (Lucent Technologies, Bell
Labs, NJ)
M.S. Mechanical Engineering
Experimental and Theoretical
Methods for Estimating the Delamination of MEMS Chip-to-Chip Bonded
Devices in a LIGA-Based Safety and Arming System
Syrus, Tobias (Schlumberger, TX)
M.S. Mechanical Engineering
Refinement of Part and Manufacturer
Assessment and Update to Include Discrete Passive Parts
Yoo, Dong-won (LGA, S. Korea)
M.S. Mechanical Engineering
Smart Thermal Management Systems Based
on Solid Liquid Phase Change Materials (PCM)
Yuan, Lang (Fujitsu Network Communications, NY)
M.S. Mechanical Engineering
The Effect of Orientation and Imposed
Circulation on the Performance of A Compact Two-Phase Thermosyphon
2000
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Ph.D.
Okura, Juscelino Hozumi (Microsoft, WA)
Ph.D. Mechanical Engineering
Assessment of Reliability of Low-cost
Flip Chip Assembiles
Sealing, C. Scott (General Electric, Corp.)
Ph.D. Mechanical Engineering
Accelerated Testing and Health Monitoring Methods for Electronic
Circuit Cards and Electronic Box Assemblies
Sharma, Pradeep (University of Houston, TX)
Ph.D. Mechanical Engineering
Micro-Structural Modeling of Cyclic
Creep Damage in Tin-lead Eutectic Solder
Shekhar, P. S. R. (IBM Corp.)
Ph.D. Mechanical Engineering
Enhancement of Test-Time Compression for Thermal Cycling Based
Accelerated Testing of Surface Mount electronics
Xie, Jingsong (Beihang University, China)
Ph.D. Mechanical Engineering
Characterization of Conductive
Elastomer Button Style Integrated Circuit Component Sockets
M.S.
Cho, James (Quantum Photonics, MD)
M.S. Mechanical Engineering
Accelerated Thermomechancial Qualification of an Automotive Electronic Module
Green, Andrew (NSWC, VA)
M.S. Mechanical Engineering
Development of Edge-Card Connector Vibration Testing Device
Huang, Zhenya (Lenovo Lean Six Sigma)
M.S. Mechanical Engineering
Parts Selection and Management - ASICs: A Life Cycle Perspective to Supply
Chain Management and Technology Trend Analyses
Iyengar, Raghuram (Ph.D. Student at Columbia University, NY)
M.S. Mechanical Engineering
Investigation into New Attach Materials for Power Devices
Narayan, Raj
M.S. Mechanical Engineering
Management and Decision Support for the Contract Manufacturing of Electronic Products
Natarajan, Rajesh (Comcast, MD)
M.S. Mechanical Engineering
Screening of Electronic Assemblies
Parthasarathy, Srinivasan (Advanced Micro Devices, CA)
M.S. Mechanical Engineering
Reliability of Die Attach Materials
Pends, Neeraj
(Management Consulting firm, A.T. Kearney, CA)
M.S. Mechanical Engineering
Stress Balancing: A Method of
uprating and Uprating Case Studies
Ramakrishnan, Bharatwaj (AMD, CA)
M.S. Mechanical Engineering
Interval Estimation and Qualification for Failure Free Operating Periods in Electronic Systems
Sharma, Rajdeep (General Electric, Corp.)
M.S. Mechanical Engineering
A Probabilistic Methodology for Virtual QUalification
Shetty, Santosh (Dell Computer Inc., TX)
M.S. Mechanical Engineering
Effect of Cyclic Bending on Chip Scale Package Assemblies
Subramanian, Gowrishankar (AMD, CA)
M.S. Mechanical Engineering
Analysis Methods for Size/Cost Tradeoffs for PWBs with Embedded Passives
Subrahmanyam, Rajiv (Netapps, AZ)
M.S. Mechanical Engineering
The Economic Impact of Component
Replacement in Electronic Systems
Trichy, Thiagarajan (Oracle CA)
M.S. Mechanical Engineer
Full Monte Carlo Technical Cost
Modeling with Detailed Test/Rework Analysis for Inclusion in a
Multi-Attribute Optimization Environment
Zhang, Kang (General Bandwidth, TX)
M.S. Mechanical Engineering
Reliability Assessment and Failure Analysis of Plastic Ball Grid Array
1999
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Ph.D.
Darbha, Krishna (Microsoft, WA)
Ph.D. Mechanical Engineering
A Physics of Failure
(PoF) Approach for Virtual Qualification of Area Array Interconnect
Technologies
Das, Diganta (CALCE EPSC, MD)
Ph.D. Mechanical Engineering
Effect of thermal profile on performance and reliability of microelectronics
Dujari, Prateek J. (Intel, OR)
Ph.D. Mechanical Engineering
Analysis of Random Vibration on
Repetitive Shock and Electrodynamic Shakers for Accelerated Fatigue of
Electronic Interconnects
Ramaswamy, Chandrashekhar (IBM)
Ph.D. Mechanical Engineering
Compact thermosyphons for passive
thermal control of high heat flux electronic components
Solomon, Rajeev (Raytheon, AZ)
Ph.D. Mechanical Engineering
Life Cycle Mismatch Assessment and
Obsolescence Management of Electronic Components
Sun, Ming (Broadcom, CA)
Ph.D. Mechanical Engineering
Lifetime Resistance Models of Electrical
Contact and Interconnect
M.S.
Bansal, Dhiraj (Spansion, CA)
M.S. Mechanical Engineering
Effect of Voids on Electromigration in Solder Bumps for Power Flip Chips
Blattau, Michael Dean (Applied Data Systems, Inc., MD)
M.S. Mechanical Engineering
Evaluation of Ist Test Technology for Plated Through Hole Reliability
Henry, Mark
M.S. Mechanical Engineering
A Methodology for Determining Root Causes of Failures due to Contamination of Electronic Assemblies
Mensah, Kofi (Intel Corp., AZ)
M.S. Mechanical Engineering
Relative Reliability of Plastic and Ceramic Microelectronic
Components at Elevated Temparature
Ramamoorthy, Aravind (Intel Corp.)
M.S. Mechanical Engineering
Investigation of Variable Frequency Microwave technology for rapid
curing of flip chip underfills
Uppalapati, Ramgopal Venkata (Intel, OR)
M.S. Mechanical Engineering
A Case Study Assessment of
Electronic Part Manufacturers and Part Families
Sagrario, Daniel
M.S. Mechanical Engineering
Optoelectronic Packaging and Reliability
Thomas, Dawn A. (Metasensors Inc., MD)
M.S. Mechanical Engineer
Analysis of Cannot Duplicate Failures
Tu, Cheng-Chieh (Taiwan)
M.S. Mechanical Engineering
Effect of Exposure and Wettability of Solder on Various Board Finishes
1998
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Ph.D.
Adams, Vance H. (Motorola)
Ph.D. Mechanical Engineering
Three-Dimensional
Study of Combined Conduction, Radiation, and Natural Convection from an
Array of Discrete Heat Sources in a Horizontal Narrow-Aspect-Ratio Enclosure
Hines, Kristen Marie (Northrop Grumman, MD)
Ph.D. Mechanical Engineering
The Effect of Metal Vias on the Strength of Ceramic Printed Wiring
Board
Tang, Lan (Cisco Systems, MA)
Ph.D. Mechanical Engineer
A Multi-Scale, Conjugate Thermal
Analysis Methodology for Convectively Cooled Electronic Enclosures
Upadhyayula, Kumar (Cascade Engineering, CA)
Ph.D. Mechanical Engineering
An Incremental Damage Superposition Approach for Surface Mount Electronic Interconnect Durability Under Combined Temperature and Vibration Environments
M.S.
Jain, Ritesh (Intel Corp., OR)
M.S. Mechanical Engineering
Evaluation of Wire Bond Systems in High Temperature Electronics
Kweon, Young-Do (Flip Chip Technologies Inc., AZ)
M.S. Mechanical Engineering
Experimental degradation analysis and remaining life assessment for
electronic assemblies
Mathur, Anant
M.S. Mechanical Engineering
Manufacturer, Electronic Part Quality and Integrity, and Distributor Assessment
Nagvanshi, Manpreet (General Motors, MI)
M.S. Mechanical Engineering
Electrical and Mechanical Characterization of Particle Filled Extrinsic Polymer Composites
Tiwari, Nivedan
M.S. Mechanical Engineering
Computer Aided Design of Microelectronic Packages
Zhang, Yibin (CommerceOne Inc.)
M.S. Mechanical Engineering
Case Studies of Semiconductor Component Reliability
1997
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Ph.D.
Cushing, Michael (AMSAA, MD)
Ph.D. Reliability Engineering
Monte
Carlo Reliability Simulations Of An Electrical-Overstress Model Using Symbolic
Math Tools
Ling, Sharon X. (Applied Physics Laboratory, Johns
Hopkins University, MD)
Ph.D. Mechanical Engineering
A Multi-domain Rayleigh Ritz
Thermomechanical Stress Analysis Model for Surface-mount Interconnects
M.S.
Neel, John
M.S. Mechanical Engineering
Semi-analytic Durability Models for
Surface Mount Solder Joints
Searls, Damion (Intel Corp., OR)
M.S. Mechanical Engineering
Uprating of Components for Use
Outside Their Temperature Specifications
To'mey, Hala (Applied Physics Labs, Johns
Hopkins University, MD)
M.S. Mechanical Engineering
Qualification of IBM Laptop for
Ruggedized Environment
Turner, Kellie A. (ELDEC Corporation, WA)
M.S. Mechanical Engineering
Uprating the IBM 730TE Thinkpad
Computer for use in a Public Safety Mobile Computing Environment
Walker, Donald James
M.S. Mechanical Engineering
Circuit Card Assembly Failure
Mechanism Model Handbook
1996
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Ph.D.
Cluff, Kevin (Abbot Lab, TX)
Ph.D. Mechanical Engineering
Characterizing
the Humidity and Thermal Environments of Commercial Avionics for Accelerated
Test Tailoring
Martens, Rod (FormFactor, Inc., CA)
Ph.D. Mechanical Engineering
Automated Contact Resistance
Probe
Pal, Debabrata (Hamilton Sundstrand, IL)
Ph.D. Mechanical Engineering
Application of Phase Change Materials to
Passive Thermal Control of Electronic Modules
Yu, Enchao (CFD Research Corp., AL)
Ph.D. Mechanical Engineering
Passive Cooling of Vented and Closed
Enclosures by Natural Convection, Conduction and Radiation
M.S.
Fowler, Andre (Intel, AZ)
M.S. Mechanical Engineering
Storage Reliability Assessment
Modeling of PEMs
Govind, Anand (LSI Logic, CA)
M.S. Mechanical Engineering
Real-Time
Measurement and Characterization of Deformations in Surface Mount Packages
during Infra-Red Reflow Soldering
Jackson, Margaret (Emergency Response Services, MD)
M.S. Mechanical Engineering
Developing a Part Selection Plan
using Benchmarking and Other Techniques
Jordan, Jill (Northrup Grumman Corp., MD)
M.S. Mechanical Engineering
Effectiveness of Screening
Procedures
Kelkar, Nikhil V. (National Semiconductor Corp.,
CA)
M.S. Mechanical Engineering
Phenomenological
Reliability Modeling of Plastic Encapsulated Microcircuits
Lyons, Kevin (NIST, MD)
M.S. Mechanical Engineering
Product Realization Process
Modeling: A Study of Requirements and Needs for Successful
Implementation
Poddar, Anindya (National Semiconductor Corp., CA)
M.S. Mechanical Engineering
Development of a Ruggedized Laptop
Computer for Mobile Applications
Ranade, Yogendra (LSI Logic Corp., CA)
M.S. Mechanical Engineering
Delamination and Cracking Effects in
PEMs
Rothman, Timothy (Intel, CA)
M.S. Mechanical Engineering
Acceleration Transform Model for
Leadless Solder Joint
Shukla, Anand (Flarion Technologies, NJ)
M.S. Mechanical Engineering
Sorption Characterization of
Laminates Used in Electronic Packaging Substrates
Verma, Vani (Cypress Corp., CA)
M.S. Mechanical Engineering
Mechanical and Thermal Analysis of a
Unit Cell of a Microbridge Uncooled Focal Plane Array Infrared
Detector
1995
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Ph.D.
Chen, An-Tung (National Semiconductor, CA)
Ph.D. Mechanical Engineering
Plated
Through Hole Life Estimation in Rigid Flex Using Finite Element Analysis
Evans, Jillian
Ph.D. Reliability Engineering
Effects
of Thermal and Humidity Cycling on 3-D Electronic Packaging Technology
M.S. Mechanical Engineering - 1993
Qualification
and Quality Assurance of 3-D Technology
Yalamanchili, Prasad (Analog Devices, Inc., CA)
Ph.D. Mechanical Engineering
Evaluation of Electronic
Packaging Reliability Using Acoustic Microscopy
M.S.
Bauernschub, Richard A. (AAI Systems, MD)
M.S. Mechanical Engineering
A
Physics-of-failure Approach to Defect-related Reliability
Chen, Qing Yan Jenny (AT&T, NJ)
M.S. Mechanical Engineering
Failure
Mechanisms and Reliability Assessment of Optoelectronic and Electronic
Packages
Ganguly, Gautam (Cisco Systems, CA)
M.S. Mechanical Engineering
Damage
Due To Lead Insertion in Through-Hole Compliant Pin Connectors
Gannamani, Ranjit (Advanced Micro Devices, CA)
M.S. Mechanical Engineering
Assembly
of PEMs Without Popcorning
Munamarty, Ramesh (Oracle Consulting, GA)
M.S. Mechanical Engineering
Failure Mechanisms of Plastic
Encapsulated Microcircuits
Panchwagh, Tanmay (Aerospace Engineering & Research
Associates)
M.S. Mechanical Engineering
Reliability of Surface Mount
Capacitor Subjected to Wave Soldering
Roy, Loren Louis (Silicon Video Corp., CA)
M.S. Mechanical Engineering
Experimental Determination of the Shear
Modulus of Compliant Adhesives Using Single Lap-Shear Tests
Sidharth, S. (Microsoft Corp., WA)
Ph.D. Mechanical Engineering
Fatigue Life Estimation of Leads in
Local Electronic Assemblies Subject to Vibration
Vasanth, G.B. (Texas Instruments, TX)
M.S. Mechanical Engineering
Physics of Failure of Power MOSFETs
1994
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Ph.D.
Gupta, Vineet K. (Delco Electronics, IN)
Ph.D. Mechanical Engineering (Solid Mechanics)
Modeling
Solder Joint Reliability For Surface Mount Compliant Leaded Electronic
Components
Huang, Choupin (Analog Devices, Inc., CA)
Ph.D. Materials and Nuclear Engineering
Degradation
Analysis and Modeling of Bi-Sb-Te(Se) Semiconductor Thermoelectric Power
Modules
Sridhar, Sundaram (Philips Electronics - North America
Corporation, NJ)
Ph.D. Mechanical Engineering
Heat Transfer and Pressure Drop in
Flows Perpendicular to an Offset Fin Structure
M.S.
Rudra, Balu (Entrepreneur, Tympana Lmt)
M.S. Mechanical Engineering
Conductive
Filament Formation in Printed Wiring Boards
Chandra, Vikram (Becton Dickinson, MD)
M.S. Mechanical Engineering
Computer
Tools for Reliability Modelling and Assessment of Microelectronic Packages
Malhotra, Anupam (Automotive Multimedia Interface
Collaboration, MI)
M.S. Mechanical Engineering
Standard
Program for Reliable Product Development
Prabhu, Ashok S. (National Semiconductor Corp., CA)
M.S. Mechanical Engineering
Stress Analysis of the G.E. High
Density Interconnect
Vikram, Seshadri (National Semiconductor, CA)
M.S. Mechanical Engineering
Correlation
of Natural Convection Heat Transfer from a Horizontal Printed Circuit Board
in an Enclosure
1993
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Ph.D.
Hwang, Ten-ken (Dynamic Systems, CA)
Ph.D. Materials and Nuclear Engineering
Monte Carlo Reliability Model for
Monolithic Microwave Integrated circuits (MMICs)
Lall, Pradeep (Auburn University, AL)
Ph.D. Mechanical Engineering
The Influence of Temperature on
Microelectronic Device Failures
Wu, Xin (Corona Optical Systems, IL)
Ph.D. Mechanical Engineering
An Experimental Study of Polyimide Films
Used in High Density Interconnects
M.S.
Argento, Christopher W. (Motorola, TX)
M.S. Mechanical Engineering
Forced Convection Air Cooling of a Commercial Electronic Chassis:
Experiments and Computations
Bhagath, Shrikar (SanDisk, CA)
M.S. Mechanical Engineering
Mechano-Stochastic
Modeling of Connector Reliability
Gohari, Kamran (Thomas & Betts)
M.S. Mechanical Engineering
Effect of Temperature and Humidity
Cycling on FR-4, BT and CE Printed Wiring Boards
Kuo, Jong-Shyang (Lockheed-Martin, CA)
M.S. Mechanical Engineering
Temperature
Dependent Performance Simulation and Failure Mechanisms of Heterostructure
Field Effect Transistors and Inverter Circuits
Mathieu, Barry (Raytheon Co., MD)
M.S. Mechanical Engineering
Stress Analysis of Glass Lead Seals
Under General Mechanical Loading
Ramappan, Vijay (Ford Motor Corp., MI)
M.S. Mechanical Engineering
A Numerical Simulation of Selected
Manufacturing Variabilities in Plated Through Holes
1992
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Ph.D.
Agarwal, Rakesh K. (Weatherford International, TX)
Ph.D. Mechanical Engineering
Prediction
of Thermal, Dielectric and Thermo-Mechanical Properties of Woven-Fabric
Composites for PWB Substrate Materials
Bhandarkar, Sarvotham M. (Navin) (National Semiconductor:
Packaging & Process Development Division, Singapore)
Ph.D. Mechanical Engineering
Thermomechanical
Analysis and Fatigue Life Prediction of Multilayer PWB PTHs
Chen, Yeong-Shu (NJIT, NJ)
Ph.D. Mechanical Engineering
Predicting
the Vibration Fatigue Lives of Electronic Components Mounted on a Printed
Wiring Board
Pusarla, Chandrasekhar (MACOM, MA)
Ph.D. Mechanical Engineering
Design Guidelines for Flip-Chip
Bonding for Hermetic Microelectronic Packages
M.S.
Arora, Ajay K. (Visteon Automotive Systems, MI)
M.S. Mechanical Engineering
Design
Guidelines for Lid Seals and Lids of Hermetic Microelectronic Packages
Balakrishnan, Sudha (Western Electronics, CA)
M.S. Mechanical Engineering
A
Concurrent Approach to Printed Wiring Board Assembly Design
Bonadies, Gary (Westinghouse, MD)
M.S. Mechanical Engineering - 1992
A
Computer Integrated Product Development Environment: An Implementation
of Concurrent Engineering for the Conceptual Design of Electronic Systems
Harris, David (Pulse Embedded Computer System, MD)
M.S. Mechanical Engineering
Fuzz
Button Design Variation and Performance Effects
Johnson, Scott David (Westinghouse, MD)
M.S. Mechanical Engineering
Experimental Determination of
Mechanical Properties of Single Crystal Gallium Arsenide (GaAs) Wafers
Lawton, Douglas (Westinghouse, MD)
M.S. Mechanical Engineering
Interface Heat Transfer and Wedgelock
Assemblies
Mofid, Nabil (Piemont, NC)
M.S. Mechanical Engineering
Transient Thermal Stress Analysis of
Surface Mounted MLC Capacitors Subjected to Wave Soldering
Verma, Shailendra (Delco Electronics, IN)
M.S. Mechanical Engineering
Screening Guidelines for Electronics
at the Assembly Level
Zhang, Zhan (U.S. Government - DC)
M.S. Mechanical Engineering
Project Planning and Scheduling in a
Concurrent Engineering Environment
Zhu, Lily Hui (NIST, MD)
M.S. Electrical Engineering
High Temperature Modeling and Thermal
Characteristics of GaAs Mesfets on Diamond Heat Sinks
1991
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1990
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M.S.
Biegel, Paul Eric
M.S. Mechanical Engineering
A
Framework for Decision Support in Concurrent Product Development
Braunberg, Gregory C. (Hughes Network Systems, MD)
M.S. Mechanical Engineering
Computer
Aided Infrared Thermography Using Emissivity Compensated Imaging
Ko, Wing Fu (Hong Kong)
M.S. Mechanical Engineering
A Systems Engineering Approach to Design
a Smart Tool Post Structure
Naqvi, Syed Ali Naved
M.S. Mechanical Engineering
Transient
Thermal Stress Analysis of Plated Through Holes Subjected to Wave Soldering
Osterman, Michael (CALCE EPSC)
Ph.D. Mechanical Engineering
Placement Methods for Electronic
Components on Printed Wiring Boards Based on Reliability and Routability
Measures
M.S. Mechanical Engineering - 1987
Component Placement for Reliability
and Routability
Reinhart, Hugh Steven
M.S. Mechanical Engineering
Automated Maintanability
(M) Modeling and Analysis
Roza, Scott A.
M.S. Mechanical Engineering
Vibrational Modeling of Wedge-lock Edge
Guides
Sharif, Irfan
M.S. Mechanical Engineering
Effect of Dimensional Variabilities
on Lead Compliance and Solder Joint Fatigue Life
She, Jieyu
M.S. Mechanical Engineering
A New Algorithm for Evaluating Complex
System Reliability
Vodzak, John
M.S. Mechanical Engineering
Coupled Thermal and Vibrational
Fatigue Analysis of Solder Joints for Surface Mounted Components
Watts, Jonathon David
M.S. Mechanical Engineering
Placement for Producibility and
Assembly
1989
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M.S.
Afzali, Amir (Amkor)
M.S. Mechanical Engineering
Contamination
Induced Failures in Microelectronic Packages
Hoffman, Harry Joseph
M.S. Mechanical Engineering
Application
of the Hopkinson Split Bar to Gun Propellant Testing
Khan, Sohail Ahmad
M.S. Mechanical Engineering
A Constitutive Stress-Strain Model for
Linerboard Under Various Constant Moisture and Temperature States
Rao, Prathviraj
M.S. Mechanical Engineering
Application of Infrared Thermography for
Quantitative Detection of Surface Flaws
Syed, Ahmer (Amkor)
M.S. Mechanical Engineering
Vibration Analysis of Printed Wiring
Boards
1988
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M.S.
Resch, Cheryl Lynn (John Hopkins University,
Applied Physics Labs, MD)
M.S. Mechanical Engineering
Calculation and Measurement of Temperature
Profiles of Electronic Printed Wiring Boards
Wong, Yeun Tsun (Logicon, VA)
M.S. Mechanical Engineering
Steiner Tree Oriented Placement
1987
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M.S.
Johnson, Timothy Mason
M.S. Mechanical Engineering
High
Strain Rate Testing of Cement Paste with a Split Hopkinson Pressure Bar
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