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CALCE ALUMNI

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2017
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M.S

Valentine, Nathan (Stanley Black and Decker, MD)
M.S Mechanical Engineering
Failure Modes and Mechanisms Analysis of Silicon Power Devices

Formica, Tyler (Raytheon, MA)
M.S Mechanical Engineering
The Effectiveness of Warranties in the Solar Photovoltaic and Automotive Industries

2016
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M.S

Power, Daniel (Northrop Grumman, MD)
M.S Mechanical Engineering
A Thermal Management Solution for Compact Power Converters

Bevensee, Helmut (Aerojet Rocketdyne, CA)
M.S Mechanical Engineering
The Effect of Package Geometry on Moisture Driven Degradation of Polymer Aluminum Capacitors

Ph.D.

Kim, Dae-Suk (PostDoc, UMD)
Ph.D. Mechanical Engineering
Comprehensive Electrical/Optical/Thermal Characterization Of High Power Light Emitting Diodes And Laser Diodes

Mahan, Kenny (Apple, CA)
Ph.D. Mechanical Engineering
Advanced Adhesion Strength Testing Methods of Thin Film Multilayers in Electronic Packaging Systems

Sun, Yong (Intel, AZ)
Ph.D. Mechanical Engineering
Characterization of Non-linear Polymer Properties to Predict Process Induced Warpage and Residual Stress of Electronic Packages

Vasan, Arvind (Empower Micro,CA)
Ph.D. Mechanical Engineering

2015
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Ph.D.

Meng, Jingshi (Apple, CA)
Ph.D. Mechanical Engineering
Multi-scale Dynamic Study of Secondary Impact during Drop Testing of Surface Mount Packages

Menon, Sandeep (Oracle,CA)
Ph.D. Mechanical Engineering
An Analytical Approach for Fatigue Life Estimation of Copper Traces for Design Optimization in Electronic Assemblies

George, Elviz (Oracle,CA)
Ph.D. Mechanical Engineering
A Non-Linear Damage Model with Load Dependent Exponents for Solders Under Sequential Cyclic Shear Loads

Mukherjee, Subhasis (SanDisk)
Ph.D. Mechanical Engineering
Multiscale Modelling of Anisotropic Creep Response of SnAgCu Single Crystal

Mathew, Sony (Schlumberger)
Ph.D. Mechanical Engineering
An Analytical Model for Developing a Canary Device

M.S.

Mahadeo, Dinesh Michael (Sandia National Laboratories)
M.S. Mechanical Engineering
Copper Corrosion in the Flowers of Sulfer Test Environment

Khanna, Sumeer
M.S. Mechanical Engineering
Structural Reliability of Novel 3-D Integrated Thermal Packaging for Power Electronics

2014
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Ph.D.

Shrivastava, Anshul (Rockwell Automation, WI)
Ph.D. Mechanical Engineering
Reliability Evaluation of Liquid and Polymer Aluminum Electrolytic Capacitors

Paradee, Gary (Intel, OR)
Ph.D. Mechanical Engineering
Fatigue Properties of Graphene Interconnects on Flexible Substrates

Patel, Chandradip (Schlumberger, TX)
Ph.D. Mechanical Engineering
Performance Assessment of Mems Gyroscope and Shock Durability Evaluation af SAC305-X Solders for High Temperature Applications

Chang, Moon-Hwan (Samsung Display Co. Ltd.)
Ph.D. Mechanical Engineering
Prognostics-based Qualification of White Light-Emitting Diodes

M.S.

Akman, Josh
M.S. Mechanical Engineering
Numerical Parametric Study of the Thermomechanical Effect of Encapsulation on a Welded Beam Lead Component

Pearl, Adam (NAVAIR - MD)
M.S. Mechanical Engineering
Effect of Palladium Thickness and Extended Isothermal Aging on the Reliability of Solder Interconnects Formed on ENEPIG Surface Finish

Bilger, Christopher John
M.S. Mechanical Engineering
Mechanical and electrical properties of metal-carbon connections for battery applications

Parsa, Ehsan (Advanced Bionics)
M.S. Mechanical Engineering
Effect of Encapsulation on Electrolyte Leakage in Aluminum Electrolytic Capacitors Under Constant Thermal and Electrical Loading

Kang, Stephen Junho
M.S. Mechanical Engineering
Adhesion Strength Measurement of Multilayer Structures with Vertical Crack by Four Point Bending Test

Levy, Jared Michael
M.S. Mechanical Engineering
Simulation and Analysis of Energy Consumption for an Energy-Intensive Academic Research Building

Allison, Hannah
M.S. Mechanical Engineering
A Simulation Approach to Modeling Contingency Strategies for Managing Electronic Part Supply Chain Disruptions

2013
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Ph.D.

Song, Bo (Draeger medical, MA)
Ph.D. Mechanical Engineering
Impact of Dust on the Reliability of Printed Circuit Assemblies
M.S. Mechanical Engineering - 2006
Reliability Evaluation of Stacked Die BGA Assemblies under Mechanical Bending Loads

Chai, Fei (Intel, AZ)
Ph.D. Mechanical Engineering
Solder Interconnect Life Prediction under Complex Temperature Cycling with Varying Mean and Amplitude

Xiaofei, He (Apple, CA)
Ph.D. Mechanical Engineering
Evaluation and Modeling of Electrochemical Migration on Printed Circuit Boards

M.S.

Sutrisno, Edwin (Schlumberger, TX)
M.S. Mechanical Engineering
Fault Detection and Prognostics of Insulated Gate Bipolar Transistor (IGBT) Using a K-Nearest Neighbor Classification Algorithm

Lillie, Edwin (Intel, AZ)
M.S. Mechanical Engineering
Assessing the Cost of Risk for New Technology and Process Insertion

Boettcher, Robert
M.S. Mechanical Engineering
Arcing Failure of RoHS Compliant Electromagnetic Relays

Fritzler, Thomas (Soraa)
M.S. Mechanical Engineering
Scintillation Conditioning of Tantalum Capacitors with Manganese Dioxide Cathodes

Bakhshi, Roozbeh (PhD Student, University of Maryland, College Park)
M.S. Mechanical Engineering
Reliability Assessment of Voided Microvias in High Density Interconnect Printed Circuit Boards under Thermo-Mechanical Stresses

Kunche, Surya Tej (Nordson Asymtek, CA)
M.S. Mechanical Engineering
Classifier Fusion Technique for Fault Diagnostics

Squiller, David
M.S. Mechanical Engineering
Methods and Models for Assessing Solder Interconnect Reliability of Control Boards in Power Electronic Systems

2012
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Ph.D.

Chauhan, Preeti (Intel, AZ)
Ph.D. Mechanical Engineering
Thermal Cycling Reliability of SAC305, SAC105, SN100C and SnPb Solders under Isothermal Aging

Dai, Jun (Electro-Motive Diesel, IL)
Ph.D. Mechanical Engineering
Risk Assessment and Mitigation of Telecommunication Equipment under Free Air Cooling Conditions

Han, Sung-Won (Samsung)
Ph.D. Mechanical Engineering
Assessment of Electrical Shorting and Metal Vapor Arcing Potential of Tin Whiskers

Nelson III, Raymond (WILLCOR Inc., MD)
Ph.D. Mechanical Engineering
Concurrent Multi-Part Multi-Event Design Refresh Planning Models Incorporating Solution Requirements and Part-Unique Temporal Constraints

Oh, Hyunseok (Seoul National University)
Ph.D. Mechanical Engineering
Prognostics of Ball Bearing based on Vibration and Acoustic Emission Analysis

Sinha, Koustav (Fujitsu, TX)
Ph.D. Mechanical Engineering
Mechanics of Non Planar Interfaces in Flip-Chip Interconnects

Charbaji, Amer (Beam International)
M.S. Mechanical Engineering
Influence of Varying H2S Concentrations and Humidity Levels on ImAg and OSP Surface Finishes

2011
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Ph.D.

Boteler, Lauren (Army Research Laboratory)
Ph.D. Mechanical Engineering
Microfabrication And Analysis Of Manifold Microchannel Coolers For Power Electronics

Cheng, Shunfeng (Intel, OR)
Ph.D. Mechanical Engineering
Prognostics and Health Management

Haddad, Gilbert (GE, CA)
Ph.D. Mechanical Engineering
Decision Support for Systems with Prognostic Capabilities

Jazouli, Taoufik
Ph.D. Mechanical Engineering
Design for Availability and PHM Cost Modeling

Sharon, Gil
Ph.D. Mechanical Engineering
Improved Flex Cracking Calculator and Failure Analysis for Multilayer Ceramic Capacitors

Sotiris, Vasilis (Barclays)
Ph.D. Applied Mathematics
Stochastic Processes, Probability Theory, and Data Driven Prognostics

 

M.S.

Crandall, Mike
M.S. Mechanical Engineering
High Temperature Lead Free Solder

Williard, Nick
M.S. Mechanical Engineering

 

2010
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Ph.D.

Challa, Vidyu
Ph.D. Mechanical Engineering
Effect of Joule heating on the reliability of stamped metal land grid array sockets

Cuddalorepatta, Gayatri (Harvard University, MA)
Ph.D. Mechanical Engineering
Evolution of the microstructure and viscoplastic behavior of miroscale SAC305 solder joints as a function of mechanical fatigue damage

Farley, Daniel (Post-doctoral Researcher, Technical University of Delft)
Ph.D. Mechanical Engineering
Development of fatigue models for copper traces on printed wiring assemblies under quasi-static cyclic mechanical bending

Gregory, Patrice (Sandia National Lab, Albuquerque, New Mexico)
Ph.D. Mechanical Engineering
Comparison of interconnect failures of electronic components mounted on Fr-4 boards with Sn37Pb and Sn3.0Ag0.5Cu solders under rapid loading conditions

Kwon, Daeil (Assistant Professor, Ulsan National Institute of Science and Technology, Korea )
Ph.D. Mechanical Engineering
Detection of Interconnect Failure Precursors Using RF Impedance Analysis

Patil, Nishad (Intel, OR)
Ph.D. Mechanical Engineering
Prognostics of Insulated Gate Bipolar Transistors

Wang, Yong (Microsoft)
Ph.D. Mechanical Engineering
Integrated Measurement Technique To Measure Curing Process-dependent Mechanical And Thermal Properties Of Polymeric Materials Using Fiber Bragg Grating Sensors

 

M.S.

Douglas, Stuart (Google)
M.S. Mechanical Engineering
High accelerations Produced Through Secondary Impact and Its Effect on Reliability of Printed Wiring Assemblies

George, Elviz (PhD Student, University of Maryland)
M.S. Mechanical Engineering
Reliability of Lead-Free Solders under High Temperature Thermal Cycling

Jaai, Rubyca (PhD Student, University of Maryland)
M.S. Mechanical Engineering
Fusion Prognostics Methodology for Prognostics and Systems Health Management

Paquette, Beth (NASA, MD)
M.S. Mechanical Engineering
Harmonic Vibration Testing of Electronic Components Attached to Printed Wiring Boards with SAC305 and Eutectic SnPb Solder

Srinivas, Vikram (Lab126, CA)
M.S. Mechanical Engineering
Mechanical Testing of Printed Wiring Assemblies with Experience in Torsional Load; Bend Load and Vibration Load (Random, Sinusoidal and Classical Shock) Testing to Evaluate Second-Level Interconnects Reliability

Woodworth, Laura (CIA, VA)
M.S. Mechanical Engineering
Characterization of Time and Temperature Dependent Mechanical Properties of Advanced Polymers Using Bragg Grating Sensors


 

2009
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Ph.D.

Zhou, Yuxun (Google, CA)
Ph.D. Mechanical Engineering
Harmonic and Random Vibration Durability Investigation for SAC305 (Sn3.0Ag0.5Cu) Solder Joint

Gu, Jie (Apple, CA)
Ph.D. Mechanical Engineering
Prognostics of Solder Joint Reliability Under Vibration Loading Using Physics of Failure Approach

Khuu, Vinh (Philips Lighting, MA)
Ph.D. Mechanical Engineering
Evaluation of Thermal Interface Materials and the Laser Flash Method

Kumar, Sachin (ASML, CT)
Ph.D. Mechanical Engineering
Prognostic and Health Management of Electronic Products

Lopez, Leoncio
Ph.D. Mechanical Engineering
Quality and Reliability of Land Grid Array Sockets

Nie, Lei (Apple, CA)
Ph.D. Mechanical Engineering
Reliability of Reballed and Reworked Ball Grid Array Packages in SNPB and SAC Assembly


M.S.

Askari, Alex F. (U.S. Navy, MD)
M.S. Mechanical Engineering
Modeling and Simulation of Shock and Drop Loading for Complex Portable Electronic Systems

Brock, Garry (Graduate Student, Cornell University)
M.S. Mechanical Engineering
Reliability of Multilayer Ceramic Capacitors

Emmel, Rachel (General Dynamics - AIS)
M.S. Mechanical Engineering
Development of a Test Metohdology to Determine Dynamic Fracture Strength in Microfabricated MEMS Structures

Majeed, Yasir (PhD Student, University of Maryland)
M.S. Mechanical Engineering

Panashchenko, Lyudmyla (NASA Goddard, MD)
M.S. Mechanical Engineering
Evaluation of Environmental Tests for Tin Whisker Assessment

Roettele, Shaughn M. (JHU-APL, MD)
M.S. Mechanical Engineering
Probabilistic Physics of Failure Assessment of Thermomechanical Fatigue of High-I/O Area-Array Interconnects

Wang, Weiqiang (Baker Hughes, TX)
M.S. Mechanical Engineering
Solder Joint Reliability of Sn and SnBi Finished and Refinished Sn (SAC/SnPb) SMT Packages under Temperature Cycling Test


2008
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Ph.D.

Bi, Hongbo (CGGVeritas)
Ph.D. Mechanical Engineering
Development Of Displacement Measurement Technique For Nano-Scale Structures

Goswami, Arindam (Apple, CA)
Ph.D. Mechanical Engineering
Quantitative Hermeticity Assessment of Packages with Micro to Nano-Liter Cavities

Moores, Kevin A. (U.S. Department of Defense, MD)
Ph.D. Mechanical Engineering - 2002
Thermal and Hydrodynamic Investigation of Shrouded Pin Fin Heat Sinks With Liquid Cooling

Wu, Rui (ASML Inc., CT)
Ph.D. Mechanical Engineering
Influence of Cryogenic Temperature and Microstructure on Fatigue Failure of Indium Solder Joint

 

M.S.

Pike, Leah (Johnson Space Flight Center, NASA, TX)
M.S. Mechanical Engineering

Plaza, Gustavo Alberto (Schlumberger, TX)
M.S. Mechanical Engineering
Impact of Board Pad Finish on the SNPB and Lead-Free Solder Interconnect Reliability for Leadless Chip Resistors Under Random Vibration Loading

Sanapala, Ravikumar (KLA-Tencor, India)
M.S. Mechanical Engineering
Characterization of FR-4 Printed Circuit Board Laminates Before and After Exposure to Lead-Free Soldering Conditions

 


2007
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Ph.D.

Choubey, Anupam (Jet Propulsion lab, Pasadena, CA)
Ph.D. Mechanical Engineering
Microsturctural Changes Under Isothermal Aging and Their Influence on Thermal Fatigue Reliability for Tin-Lead and Lead-free Solder Joints, Including Microstructural Changes Under Isothermal Aging in Mixed Solder Joints

Elerath, Jon (Jon Elerath Reliability Engineering Consulting)
Ph.D. Mechanical Engineering
Reliability Model and Assessment of Redundant Arrays of Inexpensive Disks (RAID) Incorporating Latent Defects and Non-Homogenous Poisson Process Events


M.S.

Feng, Dan (Booz Allen Hamilton)
M.S. Mechanical Engineering
Optimizing Lifetime Buy Quantities To Minimize Lifecycle Costs

Myers, Jessica (U.S. PTO)
M.S. Mechanical Engineering
Integration of Technology Roadmapping Information into DMSMS-Driven Design Refresh Planning of the V-22 Advanced Mission Computer

Tuchband, Brian (Boeing, PA)
M.S. Mechanical Engineering
Implementation of Prognostics and Health Management for Electronic Systems


2006
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Ph.D.

Dash, Manas (Philips Healthcare, MA)
Ph.D. Mechanical Engineering
Thermo-Mechanical Durability Assessment and Microstructural Characterization Study of 95.5Pb2Sn2.5Ag High Temperature Solder

Deng, Yuliang (Knight Trailer Sales Inc., Canada)
Ph.D. Mechanical Engineering
Carbon Fiber Electronic Interconnect

Jannesari Ladani, Leila (Utah State University)
Ph.D. Mechanical Engineering
Damage Initiation and Evolution in Voided and Unvoided Lead Free Solder Joints Under Cyclic Thermo-Mechanical Loading

Keimasi, Mohammedreza (Force10 networks, CA)
Ph.D. Mechanical Engineering
Flex cracking and temperature-humidity-bias effects on reliability of multilayer ceramic capacitors

Liu, Yan (Medtronic, Inc. - MN)
Ph.D. Mechanical Engineering
Reduction of Skin Stretch Induced Motion Artifacts in Electrocardiogram Monitoring Using Adaptive Filtering

Qi, Haiyu (Cameron International, TX)
Ph.D. Mechanical Engineering
Plastic Ball Grid Array Solder Joint Reliability Assessment Under Combined Thermal Cycling and Vibration Loading Conditions

Varghese, Joseph (Entrepreneur, India)
Ph.D. Mechanical Engineering
Drop Testing of Portable Electronic Devices

Vichare, Nikhil (Dell, TX)
Ph.D. Mechanical Engineering
Prognostics and Health management of Electronics by Utilizing Environmental and Usage Loads

Wu, Mei-Ling (National Cheng Kung University, Taiwan)
Ph.D. Mechanical Engineering
Dissertation: Rapid Assessment Methodology of BGA Fatigue Life under Vibration Loading

Zhan, Sheng, (Baker Hughes, TX)
Ph.D. Mechanical Engineering
Surface Insulation Resistance Degradation and Electrochemical Migration on Printed Circuit Boards


M.S.

Jinka, Krishna Kumar (entrepreneur, Hyderabad, India)
M.S. Mechanical Engineering
Thermo-mechanical Analysis of Encapsulated Ball-Wedge Wire Bonds in Microelectronics, using Raleigh-Ritz Modeling

Sengupta, Shirsho (Qualcomm, CA)
M.S. Mechanical Engineering
Effects of Solder-Dipping as A Termination Re-Finishing Technique

Wang, Zhixiang
M.S. Mechanical Engineering


2005
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Ph.D.

Cho, Seungmin
Ph.D. Mechanical Engineering
Development of Moiré Interferometry for Real-time Observation of Nonlinear Thermal Deformations of Solder and Solder Assembly

Etienne, Bevin
Ph.D. Reliability Engineering
The Development of Cost and Size Analysis for the Assessment of Embedded Passives in Printed Circuit Boards

Fang, Tong (Vitesse, CA)
PH.D. Mechanical Engineering
Tin Whisker Risk Assessment Studies

Fukuda, Yuki (Polycom Inc., TX)
PH.D. Mechanical Engineering
Experimental Investigations of Whisker Formation on Tin Platings

Han, Changwoon (KETI, Korea)
Ph.D. Mechanical Engineering
Shadow Moir¨¦ Using Non-zero Talbot Distance and Application of Diffraction Theory to Moir¨¦ Interferometry

Hwang, Yu-Chul (Samsung, Korea)
Ph.D. Materials and Nuclear Engineering
Electrostatic Discharge and Electrical Overstress Failures of Non-Silicon Devices

Tiku, Sanjay (Microsoft Inc., WA)
Ph.D. Mechanical Engineering
Reliability Capability Evaluation for Electronics Manufacturers

Zhao, Ping (Apple)
Ph.D. Mechanical Engineering
Creep Corrosion over Plastic Encapsulated Microcircuit Packages with Noble Metal Pre-plated Leadframes

Zheng, Yunqi (General Motors Technical Center, MI)
Ph.D. Mechanical Engineering
Effect of Surface Finishes and imtermetallics on power Cycling Reliability of Snagcu Die Attach


M.S.

Mishra, Rajeev (Apple, CA)
M.S. Mechanical Engineering
An Uprateability Risk Assessment Methodology


2004
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Ph.D.

Blattau, Nathan J. (Entrepeneur)
Ph.D. Mechanical Engineering
Models For Rapid Assessment of Surface Mount Component FailuresDuring Printed Wiring Board Bending

Cho, Sungyeol (Intel)
Ph.D. Mechanical Engineering
Development of Optical Measurement Technique for Nano-Mechanics

Donahoe, Daniel (1000 kilometers, UT)
Ph.D. Mechanical Engineering
Moisture in Multilayer Ceramic Capacitors

Li, Lin
Ph.D. Mechanical Engineering
Analysis and Mitigation of Electromagnetic Noise in Resonant Cavities and Apertures

Meyyappan, Karumbu Nathan (Intel Corp., OR)
Ph.D. Mechanical Engineering
Failure Prediction of Wire Bonds due to Flexure

Rogers, Keith (U.S. Department of Defense, MD)
Ph.D. Mechanical Engineering
An Analytical and Experimental Investigation of Filament Formation in Glass/Epoxy Composites

Singh, Pameet (GE)
Ph.D. Mechanical Engineering
Forecasting Technology Insertion Concurrent with Design Refresh Planning for COTS-Based Obsolescence Sensitive Sustainment-Dominated Systems
M.S. Mechanical Engineering - 2001
Design Refresh Planning Optimization Driven by Electronic Part Obsolescence

Zhang, Qian (Carefusion, CA)
Ph.D. Mechanical Engineering
Isothermal Mechanical and Thermo-Mechancial Durability Characterizaton of Selected Pb-free Solders


M.S.

Chandrasekaran, Arvind (MBA student, UCLA)
M.S. Mechanical Engineering
Effect of mold compound on Au-Al wirebond-bondpad intermetallic formation

Ganesan, Sathyanarayan (Intel, AZ)
M.S. Mechanical Engineering
Virtual Design and Improved System Level Approach for Life Consumption Monitoring of Electronics

Mathew, Sony (CALCE-UMD, MD)
M.S. Mechanical Engineering
Remaining life assessment Methodology for electronic hardware under vibration and shock Loads

Shi, Zhen
M.S. Mechanical Engineering
Test of Electronic Systems Assembly

Shrivastava, Anshul (CALCE-UMD, MD)
M.S. Mechanical Engineering


2003
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Ph.D.

Lantz, Leon (LPS, MD)
Ph.D. Mechanical Engineering
The Measurement of Ion Diffusion in Epoxy Molding Compounds Used to Encapsulate Microelectronic Devices

Stadterman, Thomas (U.S. AMSAA, MD)
Ph.D. Mechanical Engineering
Practical Assessment Methodologies for Circuit Cards Under Mechanical Shock Loading

Valentin, Ricky (University of Puerto Rico, Mayaguz, Puerto Rico)
Ph.D. Mechanical Engineering
A Rapid Failure Assessment Approach for Insertion Mounted Solder Interconnects Under Thermomechanical Cycling

Wang, Zhaoyang (The Catholic University of America, DC)
Ph.D. Mechanical Engineering
Development and Application of Computer-aided Fringe Analysis

Wu, Ji (Intel, AZ)
Ph.D. Mechanical Engineering
Electrical Characterizaton and Reliability Assessment of Lead-Free Solder Separable Contact Interfaces

Wu, Xin
Ph.D. Mechanical Engineering
Developing Highly Accurate and Stable Open-region Electromagnetic Simulations

Yang, Yubing
Ph.D. Mechanical Engineering
Reliability Assessment of Optical Fibers Under Tension and Bending Loads


M.S.

Bumiller, Elissa (NSWC, MD)
M.S. Mechanical Engineering
Electrochemical Migration on FR-4 Printed Wiring Board Surface

Calhan, Derya
M.S. Mechanical Engineering
An Application of the 3-Parameter Weibull Distribution to the Estimation of the Failure Free Operating Period of Electronic Systems

Casey, Paul (Electrolux Home Products Corporation N.V., Belgium)
M.S. Mechanical Engineering
Managementof Lead-Free Solder Alloy Intellectual Property for Lead-Free Electronics

Gupta, Shirish (Dell, TX)
M.S. Mechanical Engineering
Temperature and Rate Dependent Partitioned Constitutive Relationships for 95.5PB2SN2.5AG Solder Alloy

Mishra, Satchidananda (Dell Computer Crop., TX)
M.S. Mechanical Engineering
Life Consumption Monitoring for Electronics

Pollack, Deborah (NIST)
M.S. Mechanical Engineering
Validity of Constitutive Properties of Mechanical Deformation Analysis of Eutectic Solder

Rajagopal, Subramanian (Capital One, VA)
M.S. Mechanical Engineering
Transition of Low-Volume Complex Electronics System Industries to Lead-free Electronics

Rawat, Anoop (Chrysler, MD)
M.S. Mechanical Engineering
Thermomechanical Characterization and Evaluation of Conformal Coatings

Shetty, Vidyasagar
M.S. Mechanical Engineering
Remaining Life Assessme nt Process of Electronic Systems

Stellrecht, Eric (Sierra Research)
M.S. Mechanical Engineering
Hygroscopic Swelling in Plastic Encapsulated Microelectronics: An Experimental Study Using Moiré Interferometry

Vijayaragavan, Niranjan (Boston Consulting Group, Houston)
M.S. Mechanical Engineering
Physics of Failure Based Reliability Assessment of Printed Circuit Boards Used Permanent Downhole Monitoring Sensor Gauges


2002
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Ph.D.

O'Connor, Casey (Sensors for Medicine and Science, Inc. MD)
Ph.D. Mechanical Engineering
Influence of Rapid Altitude Cycling on the Reliability of Plastic Encapsulated Microcircuits


M.S.

Becker, Daniel V. (Northrop, MD)
M.S. Mechanical Engineering
Development and Application of Yielded Cost in Electronic Manufacturing Process Improvement

Bhaskaran, Harish (Yale University)
M.S. Mechanical Engineering
Die Shear Experimental and Modeling Verification of Chip-to-Chip Bonded Microelectromechanical Systems

Chebolu, Vijaya B. (Professor, Texas A&M University, TX)
M.S. Mechanical Engineering
Frequency-Domain Simulation of Open-Region Radiation and Scattering Problems Using the Complementary Operators Method

Cunningham, Jeremy (Honeywell, AZ)
M.S. Mechanical Engineering
Demonstration of Physics-of-Failure Assessment of an Avionic Controller

Mager, Brent M. (Systems Engineering Group, MD)
M.S. Mechanical Engineering
Analytic Characterization of Interconnect Shear Force Behavior

Subramanian, Vinay (Goldman Sachs)
M.S. Mechanical Engineering
Modeling and Predictions of Switching Noise in High Speed Circuts and Packages

Topolosky, Zeke
M.S. Mechanical Engineering
Reliability Analysis of Springs Used as Interconnects in Press-Pack Power Electronic Modules


2001
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Ph.D.

Ardebili, Haleh (University of Houston, TX )
Ph.D. Mechanical Engineering
Moisture Diffusion and Reliability Issues Associated with Moisture in Plastic Encapsulated Microelectronics

Broadwater, Keita (HP, OR)
Ph.D. Mechanical Engineering
Characterization and Health Monitoring of Epoxy-Cured Fiber Optic Connectors Via Fiber Optic Sensing

Ciocci, Richard (Pennsylvania State University, PA)
Ph.D. Mechanical Engineering
Assessing the Migration to Lead-free Electronic Products

Haswell, Peter L. (Hamilton Sunstrand, CT)
Ph.D. Mechanical Engineering
Durability Assessment and Microstructural Observations of Selected Solder Alloys

Liu, Weifeng, (Huawei)
Ph.D. Mechanical Engineering
Reliability Assessment of IC Component Sockets

Sangalli, Nicoletta (Cascade Engineering, WA)
Ph.D. Mechanical Engineering
Development of Creep-Fatigue Crack Propagation Models for Solder Joint


M.S.

Bardhan, Samuel (Zygo Corporation, CT)
M.S. Mechanical Engineering
Electronics Technology Insertion into Low Volume Complex Electronic Systems (LVCES)

Davuluri, Pavan (Microsoft, WA)
M.S. Mechanical Engineering
A multi- scale modeling approach for stress analysis of electronic interconnects

Gopinath, Deepak (GE, MI)
M.S. Mechanical Engineering
Multi-Objective Placement Optimization of Power Electronic Modules on Liquid Cooled Heat Sinks

Goray, Kunal (GE, Germany)
M.S. Mechanical Engineering
Durability of Surface mount components under flexural loads

Kalchuri, Shantanu (Qualcomm, CA)
M.S. Mechanical Engineering
Effects of Low Temperature Power Cycling on Reliability of Power Electronic Devices

Majeed, Majed
M.S. Mechanical Engineering
Multifunctional Dual-Stiffness Sensor for Insitu Real-time Stiffness and Energy-Density

Murray, Steve (Northrop Grumman, MD)
M.S. Mechanical Engineering
Aging and Qualification of Polyimide Dielectric Film

Radhakrishnan, Jagadeesh (Intel, CA)
M.S. Mechanical Engineering
A Process-Based Cost of Ownership Model for Inclusion of High-Frequency Micromachined Structures in a Conventional

Raghavan, Ravi (Hughes Network Systems, MD)
M.S. Mechanical Engineering
Analysis of Test/Diagnosis/Rework Operation Placement in the Technical Cost Modeling of Advanced Electrical Power System Modules

Ramakrishnan, Arun (Broadcom)
M.S. Mechanical Engineering
Healthand Life Consumption Monitoring Using Sensor Technologies

Ragan, Daniel (Price WaterHouse Cooper, VA)
M.S. Mechanical Engineering
Detail Cost Modeling for use with Hardware/Software Co-Design of a System on a Chip

Sahasrabudhe, Shubhada (Intel, AZ)
M.S. Mechanical Engineering
Implementation and interpretation of Failure Free Operating Periods and Associated Confidence Limits in Electronic Systems Using 3-Parameter Weibull Distribution

Sexton, Kontay V. (U.S. Department of Defense, MD)
M.S. Mechanical Engineering
Formulation of Simple Model to Assess Microvia Thermal Cycle Fatigue Life

Sidhu, Jaspreet
M.S. Mechanical Engineering
Reliability Assessment of Thinpak Power Module for Thermal Cycling Environments

Swaminathan, Rajesh (Manager, Office of the CTO at Applied Materials)
M.S. Mechanical Engineering
Experimental and Theoretical Methods for Estimating the Delamination of MEMS Chip-to-Chip Bonded Devices in a LIGA-Based Safety and Arming System

Syrus, Tobias (Wireline GFE, Argentina)
M.S. Mechanical Engineering
Refinement of Part and Manufacturer Assessment and Update to Include Discrete Passive Parts

Yoo, Dong-won (LGA, S. Korea)
M.S. Mechanical Engineering
Smart Thermal Management Systems Based on Solid Liquid Phase Change Materials (PCM)

Yuan, Lang (Fujitsu Network Communications, NY)
M.S. Mechanical Engineering
The Effect of Orientation and Imposed Circulation on the Performance of A Compact Two-Phase Thermosyphon


2000
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Ph.D.

Okura, Juscelino Hozumi (Apple)
Ph.D. Mechanical Engineering
Assessment of Reliability of Low-cost Flip Chip Assembiles

Sealing, C. Scott (General Electric, Corp.)
Ph.D. Mechanical Engineering
Accelerated Testing and Health Monitoring Methods for Electronic Circuit Cards and Electronic Box Assemblies

Sharma, Pradeep (University of Houston, TX)
Ph.D. Mechanical Engineering
Micro-Structural Modeling of Cyclic Creep Damage in Tin-lead Eutectic Solder

Shekhar, P. S. R. (IBM Corp.)
Ph.D. Mechanical Engineering
Enhancement of Test-Time Compression for Thermal Cycling Based Accelerated Testing of Surface Mount electronics

Xie, Jingsong (Beihang University, China)
Ph.D. Mechanical Engineering
Characterization of Conductive Elastomer Button Style Integrated Circuit Component Sockets


M.S.

Cho, James (Quantum Photonics, MD)
M.S. Mechanical Engineering
Accelerated Thermomechancial Qualification of an Automotive Electronic Module

Green, Andrew (NSWC, VA)
M.S. Mechanical Engineering
Development of Edge-Card Connector Vibration Testing Device

Huang, Zhenya (Lenovo Lean Six Sigma)
M.S. Mechanical Engineering
Parts Selection and Management - ASICs: A Life Cycle Perspective to Supply Chain Management and Technology Trend Analyses

Iyengar, Raghuram (Ph.D. Student at Columbia University, NY)
M.S. Mechanical Engineering
Investigation into New Attach Materials for Power Devices

Narayan, Raj
M.S. Mechanical Engineering
Management and Decision Support for the Contract Manufacturing of Electronic Products

Natarajan, Rajesh (Comcast, MD)
M.S. Mechanical Engineering
Screening of Electronic Assemblies

Parthasarathy, Srinivasan (Advanced Micro Devices, CA)
M.S. Mechanical Engineering
Reliability of Die Attach Materials

Pendse, Neeraj (Elo TouchSystems, Menlo Park, CA. )
M.S. Mechanical Engineering
Stress Balancing: A Method of uprating and Uprating Case Studies

Ramakrishnan, Bharatwaj (AMD, CA)
M.S. Mechanical Engineering
Interval Estimation and Qualification for Failure Free Operating Periods in Electronic Systems

Sharma, Rajdeep (General Electric, Corp.)
M.S. Mechanical Engineering
A Probabilistic Methodology for Virtual QUalification

Shetty, Santosh (BP America, TX)
M.S. Mechanical Engineering
Effect of Cyclic Bending on Chip Scale Package Assemblies

Subramanian, Gowrishankar (AMD, CA)
M.S. Mechanical Engineering
Analysis Methods for Size/Cost Tradeoffs for PWBs with Embedded Passives

Subrahmanyam, Rajiv (Netapps, AZ)
M.S. Mechanical Engineering
The Economic Impact of Component Replacement in Electronic Systems

Trichy, Thiagarajan (Oracle CA)
M.S. Mechanical Engineering
Full Monte Carlo Technical Cost Modeling with Detailed Test/Rework Analysis for Inclusion in a Multi-Attribute Optimization Environment

Zhang, Kang (Dell)
M.S. Mechanical Engineering
Reliability Assessment and Failure Analysis of Plastic Ball Grid Array


1999
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Ph.D.

Darbha, Krishna (Microsoft, WA)
Ph.D. Mechanical Engineering
A Physics of Failure (PoF) Approach for Virtual Qualification of Area Array Interconnect Technologies

Das, Diganta (CALCE EPSC, MD)
Ph.D. Mechanical Engineering
Effect of thermal profile on performance and reliability of microelectronics

Dujari, Prateek J. (Intel, OR)
Ph.D. Mechanical Engineering
Analysis of Random Vibration on Repetitive Shock and Electrodynamic Shakers for Accelerated Fatigue of Electronic Interconnects

Ramaswamy, Chandrashekhar (IBM)
Ph.D. Mechanical Engineering
Compact thermosyphons for passive thermal control of high heat flux electronic components

Solomon, Rajeev (Raytheon, AZ)
Ph.D. Mechanical Engineering
Life Cycle Mismatch Assessment and Obsolescence Management of Electronic Components

Sun, Ming (Broadcom, CA)
Ph.D. Mechanical Engineering
Lifetime Resistance Models of Electrical Contact and Interconnect


M.S.

Bansal, Dhiraj (Spansion, CA)
M.S. Mechanical Engineering
Effect of Voids on Electromigration in Solder Bumps for Power Flip Chips

Blattau, Michael Dean (Applied Data Systems, Inc., MD)
M.S. Mechanical Engineering
Evaluation of Ist Test Technology for Plated Through Hole Reliability

Henry, Mark
M.S. Mechanical Engineering
A Methodology for Determining Root Causes of Failures due to Contamination of Electronic Assemblies

Mensah, Kofi (Intel Corp., AZ)
M.S. Mechanical Engineering
Relative Reliability of Plastic and Ceramic Microelectronic Components at Elevated Temparature

Ramamoorthy, Aravind (Intel Corp.)
M.S. Mechanical Engineering
Investigation of Variable Frequency Microwave technology for rapid curing of flip chip underfills

Uppalapati, Ramgopal Venkata (Intel, OR)
M.S. Mechanical Engineering
A Case Study Assessment of Electronic Part Manufacturers and Part Families

Sagrario, Daniel
M.S. Mechanical Engineering
Optoelectronic Packaging and Reliability

Thomas, Dawn A. (Metasensors Inc., MD)
M.S. Mechanical Engineering
Analysis of Cannot Duplicate Failures

Tu, Cheng-Chieh (Taiwan)
M.S. Mechanical Engineering
Effect of Exposure and Wettability of Solder on Various Board Finishes


1998
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Ph.D.

Adams, Vance H. (Motorola)
Ph.D. Mechanical Engineering
Three-Dimensional Study of Combined Conduction, Radiation, and Natural Convection from an Array of Discrete Heat Sources in a Horizontal Narrow-Aspect-Ratio Enclosure

Hines, Kristen Marie (Clark School of Engineering, UMD)
Ph.D. Mechanical Engineering
The Effect of Metal Vias on the Strength of Ceramic Printed Wiring Board

Tang, Lan (Cisco Systems, MA)
Ph.D. Mechanical Engineering
A Multi-Scale, Conjugate Thermal Analysis Methodology for Convectively Cooled Electronic Enclosures

Upadhyayula, Kumar (Cascade Engineering, CA)
Ph.D. Mechanical Engineering
An Incremental Damage Superposition Approach for Surface Mount Electronic Interconnect Durability Under Combined Temperature and Vibration Environments


M.S.

Jain, Ritesh (Intel Corp., OR)
M.S. Mechanical Engineering
Evaluation of Wire Bond Systems in High Temperature Electronics

Kweon, Young-Do (Flip Chip Technologies Inc., AZ)
M.S. Mechanical Engineering
Experimental degradation analysis and remaining life assessment for electronic assemblies

Mathur, Anant (Apple, Cupertino CA)
M.S. Mechanical Engineering
Manufacturer, Electronic Part Quality and Integrity, and Distributor Assessment

Nagvanshi, Manpreet (General Motors, MI)
M.S. Mechanical Engineering
Electrical and Mechanical Characterization of Particle Filled Extrinsic Polymer Composites

Palli, Naveen (i2, Dallas, TX)
M.S. Mechanical Engineering
An Interactive Multistage Method for Multiple Objectives Decision Making

Tiwari, Nivedan
M.S. Mechanical Engineering
Computer Aided Design of Microelectronic Packages

Zhang, Yibin (CommerceOne Inc.)
M.S. Mechanical Engineering
Case Studies of Semiconductor Component Reliability


1997
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Ph.D.

Cushing, Michael
Ph.D. Reliability Engineering
Monte Carlo Reliability Simulations Of An Electrical-Overstress Model Using Symbolic Math Tools

Ling, Sharon X. (Applied Physics Laboratory, Johns Hopkins University, MD)
Ph.D. Mechanical Engineering
A Multi-domain Rayleigh Ritz Thermomechanical Stress Analysis Model for Surface-mount Interconnects


M.S.

Neel, John
M.S. Mechanical Engineering
Semi-analytic Durability Models for Surface Mount Solder Joints

Searls, Damion (Intel Corp., OR)
M.S. Mechanical Engineering
Uprating of Components for Use Outside Their Temperature Specifications

To'mey, Hala (Applied Physics Labs, Johns Hopkins University, MD)
M.S. Mechanical Engineering
Qualification of IBM Laptop for Ruggedized Environment

Turner, Kellie A. (ELDEC Corporation, WA)
M.S. Mechanical Engineering
Uprating the IBM 730TE Thinkpad Computer for use in a Public Safety Mobile Computing Environment

Walker, Donald James
M.S. Mechanical Engineering
Circuit Card Assembly Failure Mechanism Model Handbook


1996
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Ph.D.

Cluff, Kevin (Abbot Lab, TX)
Ph.D. Mechanical Engineering
Characterizing the Humidity and Thermal Environments of Commercial Avionics for Accelerated Test Tailoring

Martens, Rod (FormFactor, Inc., CA)
Ph.D. Mechanical Engineering
Automated Contact Resistance Probe

Pal, Debabrata (Hamilton Sundstrand, IL)
Ph.D. Mechanical Engineering
Application of Phase Change Materials to Passive Thermal Control of Electronic Modules

Yu, Enchao (CFD Research Corp., AL)
Ph.D. Mechanical Engineering
Passive Cooling of Vented and Closed Enclosures by Natural Convection, Conduction and Radiation


M.S.

Fowler, Andre (Intel, AZ)
M.S. Mechanical Engineering
Storage Reliability Assessment Modeling of PEMs

Govind, Anand (LSI Logic, CA)
M.S. Mechanical Engineering
Real-Time Measurement and Characterization of Deformations in Surface Mount Packages during Infra-Red Reflow Soldering

Jackson, Margaret (Emergency Response Services, MD)
M.S. Mechanical Engineering
Developing a Part Selection Plan using Benchmarking and Other Techniques

Jordan, Jill (Northrup Grumman Corp., MD)
M.S. Mechanical Engineering
Effectiveness of Screening Procedures

Kelkar, Nikhil V. (National Semiconductor Corp., CA)
M.S. Mechanical Engineering
Phenomenological Reliability Modeling of Plastic Encapsulated Microcircuits

Lyons, Kevin (NIST, MD)
M.S. Mechanical Engineering
Product Realization Process Modeling: A Study of Requirements and Needs for Successful Implementation

Poddar, Anindya (National Semiconductor Corp., CA)
M.S. Mechanical Engineering
Development of a Ruggedized Laptop Computer for Mobile Applications

Ranade, Yogendra (LSI Logic Corp., CA)
M.S. Mechanical Engineering
Delamination and Cracking Effects in PEMs

Rothman, Timothy (Intel, CA)
M.S. Mechanical Engineering
Acceleration Transform Model for Leadless Solder Joint

Shukla, Anand (Flarion Technologies, NJ)
M.S. Mechanical Engineering
Sorption Characterization of Laminates Used in Electronic Packaging Substrates

Verma, Vani (Cypress Corp., CA)
M.S. Mechanical Engineering
Mechanical and Thermal Analysis of a Unit Cell of a Microbridge Uncooled Focal Plane Array Infrared Detector


1995
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Ph.D.

Chen, An-Tung (National Semiconductor, CA)
Ph.D. Mechanical Engineering
Plated Through Hole Life Estimation in Rigid Flex Using Finite Element Analysis

Evans, Jillian
Ph.D. Reliability Engineering
Effects of Thermal and Humidity Cycling on 3-D Electronic Packaging Technology
M.S. Mechanical Engineering - 1993
Qualification and Quality Assurance of 3-D Technology

Yalamanchili, Prasad (Analog Devices, Inc., CA)
Ph.D. Mechanical Engineering
Evaluation of Electronic Packaging Reliability Using Acoustic Microscopy


M.S.

Bauernschub, Richard A. (AAI Systems, MD)
M.S. Mechanical Engineering
A Physics-of-failure Approach to Defect-related Reliability

Chen, Qing Yan Jenny (AT&T, NJ)
M.S. Mechanical Engineering
Failure Mechanisms and Reliability Assessment of Optoelectronic and Electronic Packages

Ganguly, Gautam (Juniper Systems, CA)
M.S. Mechanical Engineering
Damage Due To Lead Insertion in Through-Hole Compliant Pin Connectors

Gannamani, Ranjit (Microsoft, CA)
M.S. Mechanical Engineering
Assembly of PEMs Without Popcorning

Munamarty, Ramesh (Oracle Consulting, GA)
M.S. Mechanical Engineering
Failure Mechanisms of Plastic Encapsulated Microcircuits

Panchwagh, Tanmay (Aerospace Engineering & Research Associates)
M.S. Mechanical Engineering
Reliability of Surface Mount Capacitor Subjected to Wave Soldering

Roy, Loren Louis (Silicon Video Corp., CA)
M.S. Mechanical Engineering
Experimental Determination of the Shear Modulus of Compliant Adhesives Using Single Lap-Shear Tests

Sidharth, S. (Microsoft Corp., WA)
Ph.D. Mechanical Engineering
Fatigue Life Estimation of Leads in Local Electronic Assemblies Subject to Vibration

Vasanth, G.B. (Texas Instruments, TX)
M.S. Mechanical Engineering
Physics of Failure of Power MOSFETs

1994
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Ph.D.

Gupta, Vineet K. (Delco Electronics, IN)
Ph.D. Mechanical Engineering (Solid Mechanics)
Modeling Solder Joint Reliability For Surface Mount Compliant Leaded Electronic Components

Huang, Choupin (Analog Devices, Inc., CA)
Ph.D. Materials and Nuclear Engineering
Degradation Analysis and Modeling of Bi-Sb-Te(Se) Semiconductor Thermoelectric Power Modules

Sridhar, Sundaram (Philips Electronics - North America Corporation, NJ)
Ph.D. Mechanical Engineering
Heat Transfer and Pressure Drop in Flows Perpendicular to an Offset Fin Structure


M.S.

Rudra, Balu (Entrepreneur, Tympana Lmt)
M.S. Mechanical Engineering
Conductive Filament Formation in Printed Wiring Boards

Chandra, Vikram (Becton Dickinson, MD)
M.S. Mechanical Engineering
Computer Tools for Reliability Modelling and Assessment of Microelectronic Packages

Malhotra, Anupam (Automotive Multimedia Interface Collaboration, MI)
M.S. Mechanical Engineering
Standard Program for Reliable Product Development

Prabhu, Ashok S. (National Semiconductor Corp., CA)
M.S. Mechanical Engineering
Stress Analysis of the G.E. High Density Interconnect

Vikram, Seshadri (National Semiconductor, CA)
M.S. Mechanical Engineering
Correlation of Natural Convection Heat Transfer from a Horizontal Printed Circuit Board in an Enclosure


1993
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Ph.D.

Hwang, Ten-ken (Dynamic Systems, CA)
Ph.D. Materials and Nuclear Engineering
Monte Carlo Reliability Model for Monolithic Microwave Integrated circuits (MMICs)

Lall, Pradeep (Auburn University, AL)
Ph.D. Mechanical Engineering
The Influence of Temperature on Microelectronic Device Failures

Wu, Xin (Corona Optical Systems, IL)
Ph.D. Mechanical Engineering
An Experimental Study of Polyimide Films Used in High Density Interconnects


M.S.

Argento, Christopher W. (Motorola, TX)
M.S. Mechanical Engineering
Forced Convection Air Cooling of a Commercial Electronic Chassis: Experiments and Computations

Bhagath, Shrikar (SanDisk, CA)
M.S. Mechanical Engineering
Mechano-Stochastic Modeling of Connector Reliability

Gohari, Kamran (Thomas & Betts)
M.S. Mechanical Engineering
Effect of Temperature and Humidity Cycling on FR-4, BT and CE Printed Wiring Boards

Kuo, Jong-Shyang (Lockheed-Martin, CA)
M.S. Mechanical Engineering
Temperature Dependent Performance Simulation and Failure Mechanisms of Heterostructure Field Effect Transistors and Inverter Circuits

Mathieu, Barry (Raytheon Co., MD)
M.S. Mechanical Engineering
Stress Analysis of Glass Lead Seals Under General Mechanical Loading

Ramappan, Vijay (Ford Motor Corp., MI)
M.S. Mechanical Engineering
A Numerical Simulation of Selected Manufacturing Variabilities in Plated Through Holes


1992
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Ph.D.

Agarwal, Rakesh K. (BP America Inc.)
Ph.D. Mechanical Engineering
Prediction of Thermal, Dielectric and Thermo-Mechanical Properties of Woven-Fabric Composites for PWB Substrate Materials

Bhandarkar, Sarvotham M. (Navin) (National Semiconductor: Packaging & Process Development Division, Singapore)
Ph.D. Mechanical Engineering
Thermomechanical Analysis and Fatigue Life Prediction of Multilayer PWB PTHs

Chen, Yeong-Shu (NJIT, NJ)
Ph.D. Mechanical Engineering
Predicting the Vibration Fatigue Lives of Electronic Components Mounted on a Printed Wiring Board

Pusarla, Chandrasekhar (MACOM, MA)
Ph.D. Mechanical Engineering
Design Guidelines for Flip-Chip Bonding for Hermetic Microelectronic Packages


M.S.

Arora, Ajay K. (Visteon Automotive Systems, MI)
M.S. Mechanical Engineering
Design Guidelines for Lid Seals and Lids of Hermetic Microelectronic Packages

Balakrishnan, Sudha (Western Electronics, CA)
M.S. Mechanical Engineering
A Concurrent Approach to Printed Wiring Board Assembly Design

Bonadies, Gary (Westinghouse, MD)
M.S. Mechanical Engineering - 1992
A Computer Integrated Product Development Environment: An Implementation of Concurrent Engineering for the Conceptual Design of Electronic Systems

Harris, David (Pulse Embedded Computer System, MD)
M.S. Mechanical Engineering
Fuzz Button Design Variation and Performance Effects

Johnson, Scott David (Westinghouse, MD)
M.S. Mechanical Engineering
Experimental Determination of Mechanical Properties of Single Crystal Gallium Arsenide (GaAs) Wafers

Lawton, Douglas (Westinghouse, MD)
M.S. Mechanical Engineering
Interface Heat Transfer and Wedgelock Assemblies

Mofid, Nabil (Piemont, NC)
M.S. Mechanical Engineering
Transient Thermal Stress Analysis of Surface Mounted MLC Capacitors Subjected to Wave Soldering

Verma, Shailendra (Delco Electronics, IN)
M.S. Mechanical Engineering
Screening Guidelines for Electronics at the Assembly Level

Zhang, Zhan (U.S. Government - DC)
M.S. Mechanical Engineering
Project Planning and Scheduling in a Concurrent Engineering Environment

Zhu, Lily Hui (NIST, MD)
M.S. Electrical Engineering
High Temperature Modeling and Thermal Characteristics of GaAs Mesfets on Diamond Heat Sinks


1991
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1990
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M.S.

Biegel, Paul Eric
M.S. Mechanical Engineering
A Framework for Decision Support in Concurrent Product Development

Braunberg, Gregory C. (Hughes Network Systems, MD)
M.S. Mechanical Engineering
Computer Aided Infrared Thermography Using Emissivity Compensated Imaging

Ko, Wing Fu (Hong Kong)
M.S. Mechanical Engineering
A Systems Engineering Approach to Design a Smart Tool Post Structure

Naqvi, Syed Ali Naved
M.S. Mechanical Engineering
Transient Thermal Stress Analysis of Plated Through Holes Subjected to Wave Soldering

Osterman, Michael (CALCE EPSC)
Ph.D. Mechanical Engineering
Placement Methods for Electronic Components on Printed Wiring Boards Based on Reliability and Routability Measures
M.S. Mechanical Engineering - 1987
Component Placement for Reliability and Routability

Reinhart, Hugh Steven
M.S. Mechanical Engineering
Automated Maintanability (M) Modeling and Analysis

Roza, Scott A.
M.S. Mechanical Engineering
Vibrational Modeling of Wedge-lock Edge Guides

Sharif, Irfan
M.S. Mechanical Engineering
Effect of Dimensional Variabilities on Lead Compliance and Solder Joint Fatigue Life

She, Jieyu
M.S. Mechanical Engineering
A New Algorithm for Evaluating Complex System Reliability

Vodzak, John
M.S. Mechanical Engineering
Coupled Thermal and Vibrational Fatigue Analysis of Solder Joints for Surface Mounted Components

Watts, Jonathon David
M.S. Mechanical Engineering
Placement for Producibility and Assembly


1989
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M.S.

Afzali, Amir (Amkor)
M.S. Mechanical Engineering
Contamination Induced Failures in Microelectronic Packages

Hoffman, Harry Joseph
M.S. Mechanical Engineering
Application of the Hopkinson Split Bar to Gun Propellant Testing

Khan, Sohail Ahmad
M.S. Mechanical Engineering
A Constitutive Stress-Strain Model for Linerboard Under Various Constant Moisture and Temperature States

Rao, Prathviraj
M.S. Mechanical Engineering
Application of Infrared Thermography for Quantitative Detection of Surface Flaws

Syed, Ahmer (Amkor)
M.S. Mechanical Engineering
Vibration Analysis of Printed Wiring Boards

Lall, Pradeep (Auburn University)
M.S. Mechanical Engineering
Wire and wire bond failures in microelectronic packages


1988
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M.S.

Resch, Cheryl Lynn (John Hopkins University, Applied Physics Labs, MD)
M.S. Mechanical Engineering
Calculation and Measurement of Temperature Profiles of Electronic Printed Wiring Boards

Wong, Yeun Tsun (Logicon, VA)
M.S. Mechanical Engineering
Steiner Tree Oriented Placement


1987
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M.S.

Johnson, Timothy Mason
M.S. Mechanical Engineering
High Strain Rate Testing of Cement Paste with a Split Hopkinson Pressure Bar


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