CALCE Alumni
Name (company employed by)
Degree, field of study, year of graduation
Thesis title and abstract
-
Adams, Vance H. (employed by Motorola)
Ph.D. Mechanical Engineering - 1998
Three-Dimensional
Study of Combined Conduction, Radiation, and Natural Convection from an
Array of Discrete Heat Sources in a Horizontal Narrow-Aspect-Ratio Enclosure
- Afzali, Amir (employed by Amkor)
M.S. Mechanical Engineering - 1989
Contamination
Induced Failures in Microelectronic Packages
-
Agarwal, Rakesh K. (employed by Weatherford International, TX)
Ph.D. Mechanical Engineering - 1992
Prediction
of Thermal, Dielectric and Thermo-Mechanical Properties of Woven-Fabric
Composites for PWB Substrate Materials
- Ardebili, Haleh (employed by University of Houston, TX )
Ph.D. Mechanical Engineering - 2001
Moisture Diffusion and Reliability
Issues Associated with Moisture in Plastic Encapsulated
Microelectronics
-
Argento, Christopher W. (employed by Motorola, TX)
M.S. Mechanical Engineering - 1993
Forced Convection Air Cooling of a Commercial Electronic Chassis:
Experiments and Computations
-
Arora, Ajay K. (employed by Visteon Automotive Systems, MI)
M.S. Mechanical Engineering - 1992
Design
Guidelines for Lid Seals and Lids of Hermetic Microelectronic Packages
-
Bansal, Dhiraj (employed by Spansion, CA)
M.S. Mechanical Engineering - 1999
Effect of Voids on Electromigration in Solder Bumps for Power Flip Chips
-
Bahaskaran, Harish
M.S. Mechanical Engineering - 2002
Die Shear Experimental and Modeling Verification for Chip-to-Chip Bonded Microelectromechanical Systems
-
Balakrishnan, Sudha (employed by Western Electronics, CA)
M.S. Mechanical Engineering - 1992
A
Concurrent Approach to Printed Wiring Board Assembly Design
-
Rudra, Balu (employed by Capital One, VA)
M.S. Mechanical Engineering - 1994
Conductive
Filament Formation in Printed Wiring Boards
-
Bardhan, Samuel (employed by JDS Uniphase, NJ)
M.S. Mechanical Engineering - 2001
Electronics Technology Insertion
into Low Volume Complex Electronic Systems (LVCES)
-
Bauernschub, Richard A. (employed by AAI Systems, MD)
M.S. Mechanical Engineering - 1995
A
Physics-of-failure Approach to Defect-related Reliability
- Becker, Daniel V. (employed by Northrop, MD)
M.S. Mechanical Engineering - 2002
Development and Application of
Yielded Cost in Electronic Manufacturing Process Improvement
-
Bhagath, Shrikar (employed by SanDisk, CA)
M.S. Mechanical Engineering - 1993
Mechano-Stochastic
Modeling of Connector Reliability
-
Bhandarkar, Sarvotham M. (Navin) (employed by National Semiconductor:
Packaging & Process Development Division, Singapore)
Ph.D. Mechanical Engineering - 1992
Thermomechanical
Analysis and Fatigue Life Prediction of Multilayer PWB PTHs
-
Bhaskaran, Harish
M.S. Mechanical Engineering - 2002
Die Shear Experimental and Modeling Verification of Chip-to-Chip Bonded Microelectromechanical Systems
-
Biegel, Paul Eric
M.S. Mechanical Engineering - 1990
A
Framework for Decision Support in Concurrent Product Development
-
Blattau, Michael Dean (employed by Applied Data Systems, Inc., MD)
M.S. Mechanical Engineering - 1999
Evaluation of Ist Test Technology for Plated Through Hole Reliability
-
Blattau, Nathan J. (employed by CALCE EPSC, MD)
Ph.D. Mechanical Engineering - 2004
Models For Rapid Assessment of Surface Mount Component FailuresDuring Printed Wiring Board Bending
-
Bonadies, Gary (employed by Westinghouse, MD)
M.S. Mechanical Engineering - 1992
A
Computer Integrated Product Development Environment: An Implementation
of Concurrent Engineering for the Conceptual Design of Electronic Systems
-
Broadwater, Keita (employed by HP, OR)
Ph.D. Mechanical Engineering - 2001
Characterization and Health Monitoring of Epoxy-Cured Fiber Optic Connectors Via Fiber Optic Sensing
-
Braunberg, Gregory C. (employed by Hughes Network Systems, MD)
M.S. Mechanical Engineering - 1990
Computer
Aided Infrared Thermography Using Emissivity Compensated Imaging
-
Bumiller, Elissa (employed by NSWC, MD)
M.S. Mechanical Engineering - 2003
Electrochemical Migration on FR-4 Printed Wiring Board Surface
-
Burch, Melody
M.S. Mechanical Engineering
-
Calhan, Derya
M.S. Mechanical Engineering - 2003
-
Casey, Paul (employed by Electrolux Home Products Corporation N.V., Belgium)
M.S. Mechanical Engineering - 2003
Managementof Lead-Free Solder Alloy Intellectual Property for Lead-Free Electronics
-
Chandra, Vikram (employed by Hughes Network Systems, MD)
M.S. Mechanical Engineering - 1994
Computer
Tools for Reliability Modelling and Assessment of Microelectronic Packages
-
Chandrasekaran, Arvind (employed by Qualcomm, CA)
M.S. Mechanical Engineering - 2004
Effect of mold compound on Au-Al wirebond-bondpad intermetallic formation
-
Chen, An-Tung (employed by National Semiconductor, CA)
Ph.D. Mechanical Engineering - 1995
Plated
Through Hole Life Estimation in Rigid Flex Using Finite Element Analysis
-
Chen, Qing Yan Jenny (employed by AT&T, NJ)
M.S. Mechanical Engineering - 1995
Failure
Mechanisms and Reliability Assessment of Optoelectronic and Electronic
Packages
-
Chen, Yeong-Shu (employed by NJIT, NJ)
Ph.D. Mechanical Engineering - 1992
Predicting
the Vibration Fatigue Lives of Electronic Components Mounted on a Printed
Wiring Board
-
Cho, James (employed by Quantum Photonics, MD)
M.S. Mechanical Engineering - 2000
Accelerated Thermomechancial Qualification of an Automotive Electronic Module
-
Cho, Seungmin
Ph.D. Mechanical Engineering - 2005
Development of Moiré Interferometry for Real-time Observation of Nonlinear Thermal Deformations of Solder and Solder Assembly
-
Cho, Sungyeol
Ph.D. Mechanical Engineering - 2004
Development of Optical Measurement Technique for Nano-Mechanics
-
Choi, Hing (employed by GSE Power Systems, Inc., Columbia, MD)
M.S. Mechanical Engineering
-
Ciocci, Richard (employed by Pennsylvania State University, PA)
Ph.D. Mechanical Engineering - 2001
Assessing the Migration to Lead-free
Electronic Products
-
Cluff, Kevin (employed by Abbot Lab, TX)
Ph.D. Mechanical Engineering - 1996
Characterizing
the Humidity and Thermal Environments of Commercial Avionics for Accelerated
Test Tailoring
-
Cunningham, Jeremy (employed by Honeywell, AZ)
M.S. Mechanical Engineering - 2002
Demonstration of Physics-of-Failure Assessment of an Avionic Controller
-
Cushing, Michael (employed by AMSAA, MD)
Ph.D. Reliability Engineering - 1997
Monte
Carlo Reliability Simulations Of An Electrical-Overstress Model Using Symbolic
Math Tools
-
Darbha, Krishna (employed by Microsoft, WA)
Ph.D. Mechanical Engineering - 1999
A Physics of Failure
(PoF) Approach for Virtual Qualification of Area Array Interconnect
Technologies
-
Das, Diganta (employed by CALCE EPSC, MD)
Ph.D. Mechanical Engineering - 1999
Effect of thermal profile on performance and reliability of microelectronics
-
Dash, Manas (employed by Schlumberger, TX)
Ph.D. Mechanical Engineering - 2006
Thermo-Mechanical Durability Assessment and Microstructural Characterization Study of 95.5Pb2Sn2.5Ag High Temperature Solder
-
Davuluri, Pavan (employed by Microsoft, WA)
M.S. Mechanical Engineering - 2001
A multi- scale
modeling approach for stress analysis of electronic interconnects
-
Deng, Yuliang. (employed by De Amertek Corporation, IL)
Ph.D. Mechanical Engineering - 2006
Carbon Fiber Electronic Interconnect
-
Donahoe, Daniel (employed by Exponent, Inc. CA)
Ph.D. Mechanical Engineering - 2004
Moisture in Multilayer Ceramic Capacitors
-
Dujari, Prateek J. (employed by Intel, OR)
Ph.D. Mechanical Engineering - 1999
Analysis of Random Vibration on
Repetitive Shock and Electrodynamic Shakers for Accelerated Fatigue of
Electronic Interconnects
-
Duvall, William (employed by Northrop Grumman, MD)
M.S. Mechanical Engineering
-
Etienne, Bevin
Ph.D. Reliability Engineering - 2005
The Development
of Cost and Size Analysis for the Assessment of Embedded Passives
in Printed Circuit Boards
-
Evans, Jillian (employed by Daewoo, Korea)
Ph.D. Reliability Engineering - 1995
Effects
of Thermal and Humidity Cycling on 3-D Electronic Packaging Technology
M.S. Mechanical Engineering - 1993
Qualification
and Quality Assurance of 3-D Technology
-
Fang, Tong, (employed by Vitesse, CA)
PH.D. Mechanical Engineering - 2005
Tin Whisker Risk Assessment Studies
-
Feng, Dan, (employed by Booz Allen Hamilton)
M.S. Mechanical Engineering - 2007
Optimizing Lifetime Buy Quantities To Minimize Lifecycle Costs
-
Fowler, Andre (employed by Intel, AZ)
M.S. Mechanical Engineering - 1996
Storage Reliability Assessment
Modeling of PEMs
-
Fukuda, Yuki, (employed by Lumileds Lighting, CA)
PH.D. Mechanical Engineering - 2005
Experimental Investigations of Whisker Formation on Tin Platings
-
Ganesan, Sathyanarayan (employed by Intel, AZ)
M.S. Mechanical Engineering - 2004
Virtual Design and Improved System Level Approach for Life Consumption Monitoring of Electronics
-
Ganguly, Gautam (employed by Cisco Systems, CA)
M.S. Mechanical Engineering - 1995
Damage
Due To Lead Insertion in Through-Hole Compliant Pin Connectors
-
Gannamani, Ranjit (employed by Advanced Micro Devices, CA)
M.S. Mechanical Engineering - 1995
Assembly
of PEMs Without Popcorning
-
Gohari, Kamran (employed by Thomas & Betts)
M.S. Mechanical Engineering - 1993
Effect of Temperature and Humidity
Cycling on FR-4, BT and CE Printed Wiring Boards
-
Gopinath, Deepak (employed by GE, MI)
M.S. Mechanical Engineering - 2001
Multi-Objective Placement
Optimization of Power Electronic Modules on Liquid Cooled Heat Sinks
-
Goray, Kunal (employed by GE, Bangalore, India)
M.S. Mechanical Engineering - 2001
Durability of Surface mount components under flexural loads
-
Govind, Anand (employed by LSI Logic, CA)
M.S. Mechanical Engineering - 1996
Real-Time
Measurement and Characterization of Deformations in Surface Mount Packages
during Infra-Red Reflow Soldering
-
Green, Andrew (employed by NSWC, VA)
M.S. Mechanical Engineer - 2000
-
Gupta, Shirish (employed by Dell, TX)
M.S. Mechanical Engineer - 2003
Temperature and Rate Dependent Partitioned Constitutive Relationships for 95.5PB2SN2.5AG Solder Alloy
-
Gupta, Vineet K. (employed by Delco Electronics, IN)
Ph.D. Mechanical Engineering (Solid Mechanics) -1994
Modeling
Solder Joint Reliability For Surface Mount Compliant Leaded Electronic
Components
-
Harris, David (employed by Pulse Embedded Computer System, MD)
M.S. Mechanical Engineering - 1992
Fuzz
Button Design Variation and Performance Effects
-
Haswell, Peter L. (employed by Hamilton Sundstrand, CT)
Ph.D. Mechanical Engineering - 2001
Durability Assessment and Microstructural Observations of Selected Solder Alloys
-
Henry, Mark
M.S. Mechanical Engineering - 1999
Moisture Related Growth Failure
Mechanisms of Automotive Assemblies
-
Hines, Kristen Marie (employed by Northrop Grumman, MD)
Ph.D. Mechanical Engineering - 1998
The Effect of Metal Vias on the Strength of Ceramic Printed Wiring
Board
-
Hoffman, Harry Joseph
M.S. Mechanical Engineering -1989
Application
of the Hopkinson Split Bar to Gun Propellant Testing
-
Huang, Choupin (employed by Analog Devices, Inc., CA)
Ph.D. Materials and Nuclear Engineering - 1994
Degradation
Analysis and Modeling of Bi-Sb-Te(Se) Semiconductor Thermoelectric Power
Modules
- Huang, Zhenya (employed by Motorola, TX)
M.S. Mechanical Engineering - 2000
Parts Selection and Management: A Life Cycle Perspective to Supply
Chain Management and Technology Trend Analyses
-
Hwang, Ten-ken (employed by Dynamic Systems, CA)
Ph.D. Materials and Nuclear Engineering - 1993
Monte Carlo Reliability Model for
Monolithic Microwave Integrated circuits (MMICs)
-
Hwang, Yu-Chul, (employed by SamSung, Korea)
Ph.D. Materials and Nuclear Engineering - 2005
Electrostatic Discharge and Electrical Overstress Failures of Non-Silicon Devices
-
Iyengar, Raghuram (Ph.D. Student at Columbia University, NY)
M.S. Mechanical Engineering - 2000
Investigation into New Attach Materials for Power Devices
-
Jackson, Margaret
M.S. Mechanical Engineering - 1996
Developing a Part Selection Plan
using Benchmarking and Other Techniques
-
Jain, Ritesh (employed by Intel Corp., OR)
M.S. Mechanical Engineering - 1998
-
Jannesari Ladani, Leila,
Ph.D. Mechanical Engineering - 2006
Effectiveness of steady state burn-in in screening of hybrid modules
-
Jinka, Krishna Kumar
M.S. Mechanical Engineering - 2006
Thermo-mechanical Analysis of Encapsulated Ball-Wedge Wire Bonds in Microelectronics, using Raleigh-Ritz Modeling
-
Johnson, Scott David (employed by Westinghouse, MD)
M.S. Mechanical Engineering - 1992
Experimental Determination of
Mechanical Properties of Single Crystal Gallium Arsenide (GaAs) Wafers
-
Johnson, Timothy Mason
M.S. Mechanical Engineering - 1987
High
Strain Rate Testing of Cement Paste with a Split Hopkinson Pressure Bar
-
Jordan, Jill (employed by Northrup Grumman Corp., MD)
M.S. Mechanical Engineering - 1996
Effectiveness of Screening
Procedures
-
Kalchuri, Shantanu (employed by Qualcomm, CA)
M.S. Mechanical Engineering - 2001
Effects of Low Temperature Power
Cycling on Reliability of Power Electronic Devices
-
Kelkar, Nikhil V. (employed by National Semiconductor Corp.,
CA)
M.S. Mechanical Engineering - 1996
Phenomenological
Reliability Modeling of Plastic Encapsulated Microcircuits
-
Khan, Sohail Ahmad
M.S. Mechanical Engineering - 1989
A Constitutive Stress-Strain Model for
Linerboard Under Various Constant Moisture and Temperature States
-
Kimseng, Krisada (employed in Thailand)
M.S. Mechanical Engineering
Accelerated testing of PEMs for long term storage
-
Ko, Wing Fu (employed in Hong Kong)
M.S. Mechanical Engineering 1990
A Systems Engineering Approach to Design
a Smart Tool Post Structure
-
Kuo, Jong-Shyang (employed by Lockheed-Martin, CA)
M.S. Mechanical Engineering - 1993
Temperature
Dependent Performance Simulation and Failure Mechanisms of Heterostructure
Field Effect Transistors and Inverter Circuits
-
Kweon, Young-Do (employed by Flip Chip Technologies Inc., AZ)
M.S. Mechanical Engineering - 1998
Experimental degradation analysis and remaining life assessment for
electronic assemblies
-
Lall, Pradeep (employed by Auburn University, AL)
Ph.D. Mechanical Engineering - 1993
The Influence of Temperature on
Microelectronic Device Failures
- Lantz, Leon (employed by LPS, MD)
Ph.D. Mechanical Engineering - 2003
The Measurement of Ion Diffusion in Epoxy Molding Compounds Used to Encapsulate Microelectronic Devices
-
Lawton, Douglas (employed by Westinghouse, MD)
M.S. Mechanical Engineering - 1992
Interface Heat Transfer and Wedgelock
Assemblies
-
Li, Lin
Ph.D. Mechanical Engineering - 2004
Analysis and Mitigation of Electromagnetic Noise in Resonant Cavities and Apertures
-
Ling, Sharon X. (employed by Applied Physics Laboratory, Johns
Hopkins University, MD)
Ph.D. Mechanical Engineering - 1997
A Multi-domain Rayleigh Ritz
Thermomechanical Stress Analysis Model for Surface-mount Interconnects
-
Liu, Weifeng, (employed by Hewlett-Packard, CA)
Ph.D. Mechanical Engineering - 2001
Reliability Assessment of IC Component
Sockets
-
Liu, Yan,(employed by Medtronic, Inc. - MN)
Ph.D. Mechanical Engineering - 2006
Reduction of Skin Stretch Induced Motion Artifacts in Electrocardiogram Monitoring Using Adaptive Filtering
-
Lyons, Kevin (employed by NIST, MD)
M.S. Mechanical Engineering - 1996
Product Realization Process
Modeling: A Study of Requirements and Needs for Successful
Implementation
-
Mager, Brent M. (employed by Systems Engineering Group, MD)
M.S. Mechanical Engineering - 2002
Analytic Characterization of
Interconnect Shear Force Behavior
-
Majeed, Majed (Ph.D. Student at Virginia Tech, VA)
M.S. Mechanical Engineering - 2001
Multifunctional Dual-Stiffness
Sensor for Insitu Real-time Stiffness and Energy-Density
-
Malhotra, Anupam (employed by Automotive Multimedia Interface
Collaboration, MI)
M.S. Mechanical Engineering - 1994
Standard
Program for Reliable Product Development
-
Mallick, Shashank (employed by Hibbitt, Karlsson and
Sorensen)
M.S. Mechanical Engineering
Reliability Modeling of Electro-optic Packages
-
Martens, Rod (employed by FormFactor, Inc., CA)
Ph.D. Mechanical Engineering - 1996
Automated Contact Resistance
Probe
-
Mathew, Sony
M.S. Mechanical Engineering - 2004
Remaining life assessment Methodology for electronic hardware under vibration and shock Loads
-
Mathieu, Barry (employed by Raytheon Co., MD)
M.S. Mechanical Engineering - 1993
Stress Analysis of Glass Lead Seals
Under General Mechanical Loading
-
Mathur, Anant (Ph.D. Candidate at Johns Hopkins University, MD)
M.S. Mechanical Engineering - 1998
-
Mensah, Kofi (employed by Intel Corp., AZ)
M.S. Mechanical Engineering - 1999
Relative Reliability of Plastic and Ceramic Microelectronic
Components at Elevated Temparature
-
Meyyappan, Karumbu Nathan (employed by Intel Corp., OR)
Ph.D. Mechanical Engineering - 2004
Failure Prediction of Wire Bonds due to Flexure
-
Mishra, Rajeev (employed by Qualcomm, CA)
M.S. Mechanical Engineering - 2005
An Uprateability Risk Assessment Methodology
-
Mishra, Satchidananda (employed by Dell Computer Crop., TX)
M.S. Mechanical Engineering - 2003
Life Consumption Monitoring for Electronics
-
Mofid, Nabil (employed by Piemont, NC)
M.S. Mechanical Engineering - 1992
Transient Thermal Stress Analysis of
Surface Mounted MLC Capacitors Subjected to Wave Soldering
-
Moores, Kevin A. (employed by National Security Agency, MD)
Ph.D. Mechanical Engineering - 2002
Thermal and Hydrodynamic
Investigation of Shrouded Pin Fin Heat Sinks With Liquid Cooling
-
Munamarty, Ramesh (employed by Oracle Consulting, GA)
M.S. Mechanical Engineering - 1995
Failure Mechanisms of Plastic
Encapsulated Microcircuits
-
Murray, Steve (employed by Northrop Grumman, MD)
M.S. Mechanical Engineering - 2001
Aging and Qualification of Polyimide
Dielectric Film
-
Myers, Jessica
M.S. Mechanical Engineering - 2007
Integration of Technology Roadmapping Information into DMSMS-Driven Design Refresh Planning of the V-22 Advanced Mission Computer
-
Nagvanshi, Manpreet (employed by GM, MI)
M.S. Mechanical Engineering - 1998
-
Naqvi, Syed Ali Naved
M.S. Mechanical Engineering - 1990
Transient
Thermal Stress Analysis of Plated Through Holes Subjected to Wave Soldering
- Narayan, Raj
M.S. Mechanical Engineering - 2000
Management and Decision Support for the Contract Manufacturing of Electronic Products
-
Natarajan, Rajesh (employed by Comcast, MD)
M.S. Mechanical Engineering - 2000
Screening of Electronic Assemblies
-
Neel, John
M.S. Mechanical Engineering - 1997
Semi-analytic Durability Models for
Surface Mount Solder Joints
-
O'Connor, Casey (employed by Sensors for Medicine and Science, Inc. MD)
Ph.D. Mechanical Engineering - 2002
Influence of Rapid Altitude Cycling on the Reliability of Plastic Encapsulated Microcircuits
-
Okura, Juscelino Hozumi (employed by Nokia Mobile Phones, TX)
Ph.D. Mechanical Engineering - 2000
Assessment of Reliability of Low-cost
Flip Chip Assembiles
-
Osterman, Michael (employed by CALCE EPSC)
Ph.D. Mechanical Engineering - 1990
Placement Methods for Electronic
Components on Printed Wiring Boards Based on Reliability and Routability
Measures
M.S. Mechanical Engineering - 1987
Component Placement for Reliability
and Routability
-
Pal, Debabrata (employed by Hamilton Sundstrand, IL)
Ph.D. Mechanical Engineering - 1996
Application of Phase Change Materials to
Passive Thermal Control of Electronic Modules
-
Panchwagh, Tanmay (employed by Aerospace Engineering & Research
Associates)
M.S. Mechanical Engineering - 1995
Reliability of Surface Mount
Capacitor Subjected to Wave Soldering
-
Parthasarathy, Srinivasan (employed by Advanced Micro Devices, CA)
M.S. Mechanical Engineering - 2000
Reliability of Die Attach Materials
-
Pends? Neeraj (employed by National Semiconductor, CA)
M.S. Mechanical Engineering - 2000
Stress Balancing: A Method of
uprating and Uprating Case Studies
-
Poddar, Anindya (employed by National Semiconductor Corp., CA)
M.S. Mechanical Engineering - 1996
Development of a Ruggedized Laptop
Computer for Mobile Applications
-
Pollack, Deborah(employed by NIST)
M.S. Mechanical Engineering - 2003
Validity of Constitutive Properties of Mechanical Deformation Analysis of Eutectic Solder
-
Prabhu, Ashok S. (employed by National Semiconductor Corp., CA)
M.S. Mechanical Engineering - 1994
Stress Analysis of the G.E. High
Density Interconnect
-
Pusarla, Chandrasekhar (employed by MACOM, MA)
Ph.D. Mechanical Engineering - 1992
Design Guidelines for Flip-Chip
Bonding for Hermetic Microelectronic Packages
-
Qi, Haiyu (employed by Dell, TX)
Ph.D. Mechanical Engineering - 2006
Plastic Ball Grid Array Solder Joint Reliability Assessment Under Combined Thermal Cycling and Vibration Loading Conditions
-
Radhakrishnan, Jagadeesh (employed by Intel, CA)
M.S. Mechanical Engineering - 2001
A Process-Based Cost of
Ownership Model for Inclusion of High-Frequency Micromachined Structures
in a Conventional
-
Raghavan, Ravi (employed by Hughes Network Systems, MD)
M.S. Mechanical Engineering - 2001
Analysis of Test/Diagnosis/Rework
Operation Placement in the Technical Cost Modeling of Advanced Electrical
Power System Modules
-
Ramakrishnan, Arun (employed by LSI Logic, CA)
M.S. Mechanical Engineering - 2001
Healthand Life Consumption
Monitoring Using Sensor Technologies
-
Ramakrishnan, Bharatwaj (employed by AMD, CA)
M.S. Mechanical Engineering - 2000
-
Ramamoorthy, Aravind (employed by Intel)
M.S. Mechanical Engineering - 1999
Investigation of Variable Frequency Microwave technology for rapid
curing of flip chip underfills
-
Ramappan, Vijay (employed by Ford Motor Corp., MI)
M.S. Mechanical Engineering - 1993
A Numerical Simulation of Selected
Manufacturing Variabilities in Plated Through Holes
-
Ramaswamy, Chandrashekhar (employed by IBM)
Ph.D. Mechanical Engineering - 1999
Compact thermosyphons for passive
thermal control of high heat flux electronic components
-
Uppalapati, Ramgopal Venkata (employed by Intel, OR)
M.S. Mechanical Engineering - 1999
A Case Study Assessment of
Electronic Part Manufacturers and Part Families
-
Ranade, Yogendra (employed by LSI Logic Corp., CA)
M.S. Mechanical Engineering - 1996
Delamination and Cracking Effects in
PEMs
-
Ragan, Daniel (employed by PriceWaterHouseCoppers, VA)
M.S. Mechanical Engineering
Detail Cost Modeling for use with
Hardware/Software Co-Design of a System on a Chip
-
Rajagopal, Subramanian (employed by Capital One, VA)
M.S. Mechanical Engineering - 2003
Transition of Low-Volume Complex Electronics System Industries to Lead-free Electronics
-
Rao, Prathviraj
M.S. Mechanical Engineering - 1989
Application of Infrared Thermography for
Quantitative Detection of Surface Flaws
-
Rawat, Anoop (employed by MBtech Group - North America, MI)
M.S. Mechanical Engineering - 2003
Thermomechanical Characterization and Evaluation of Conformal Coatings
-
Reinhart, Hugh Steven
M.S. Mechanical Engineering - 1990
Automated Maintanability
(M) Modeling and Analysis
-
Resch, Cheryl Lynn (employed by John Hopkins University,
Applied Physics Labs, MD)
M.S. Mechanical Engineering - 1988
Calculation and Measurement of Temperature
Profiles of Electronic Printed Wiring Boards
-
Rogers, Keith (employed by CALCE EPSC, MD)
Ph.D. Mechanical Engineering - 2004
An Analytical and Experimental Infvestigation of Filament Formation in Glass/Epoxy Composites
-
Rothman, Timothy (employed by Intel, CA)
M.S. Mechanical Engineering - 1996
Acceleration Transform Model for
Leadless Solder Joint
-
Roy, Loren Louis (employed by Silicon Video Corp., CA)
M.S. Mechanical Engineering - 1995
Experimental Determination of the Shear
Modulus of Compliant Adhesives Using Single Lap-Shear Tests
-
Roza, Scott A.
M.S. Mechanical Engineering - 1990
Vibrational Modeling of Wedge-lock Edge
Guides
-
Sagrario, Daniel
M.S. Mechanical Engineering - 1999
Optoelectronic Packaging and Reliability
-
Sahasrabudhe, Shubhada (employed by Intel AZ)
M.S. Mechanical Engineering - 2001
Implementation and
interpretation of Failure Free Operating Periods and Associated
Confidence Limits in Electronic Systems Using 3-Parameter Weibull
Distribution
- Sangalli, Nicoletta (employed by Microsoft, WA)
Ph.D. Mechanical Engineering - 2001
Development of Creep-Fatigue Crack
Propagation Models for Solder Joint
-
Sealing, C. Scott (employed by General Electric, Corp.)
Ph.D. Mechanical Engineering - 2000
Accelerated Testing and Health Monitoring Methods for Electronic
Circuit Cards and Electronic Box Assemblies
-
Searls, Damion (employed by Intel Corp., OR)
M.S. Mechanical Engineering - 1997
Uprating of Components for Use
Outside Their Temperature Specifications
-
Sengupta, Shirsho (employed by AMD, CA)
M.S. Mechanical Engineering - 2006
Effects of Solder-Dipping as A Termination Re-Finishing Technique
-
Sexton, Kontay V. (employed by National Security Agency, MD)
M.S. Mechanical Engineering - 2001
Formulation of Simple Model to
Assess Microvia Thermal Cycle Fatigue Life
-
Sharif, Irfan
M.S. Mechanical Engineering - 1990
Effect of Dimensional Variabilities
on Lead Compliance and Solder Joint Fatigue Life
-
Sharma, Pradeep (employed by University of Houston, TX)
Ph.D. Mechanical Engineering - 2000
Micro-Structural Modeling of Cyclic
Creep Damage in Tin-lead Eutectic Solder
-
Sharma, Rajdeep (Ph.D. candidate in MIT)
M.S. Mechanical Engineering - 2000
A Probabilistic Methodology for Virtual QUalification
-
She, Jieyu
M.S. Mechanical Engineering - 1990
A New Algorithm for Evaluating Complex
System Reliability
-
Shekhar, P. S. R. (employed by IBM Corp.)
Ph.D. Mechanical Engineering - 2000
Enhancement of Test-Time Compression for Thermal Cycling Based
Accelerated Testing of Surface Mount electronics
-
Shetty, Santosh (employed by Nokia Mobile Phones, TX)
M.S. Mechanical Engineering - 2000
Effect of Cyclic Bending on Chip Scale Package Assemblies
-
Shetty, Vidyasagar
M.S. Mechanical Engineering - 2003
Remaining Life Assessme
nt Process of Electronic Systems
-
Shi, Zhen
M.S. Mechanical Engineering - 2004
Test of Electronic Systems Assembly
- Shrivastava, Anshul (employed by CALCE EPSC, MD)
M.S. Mechanical Engineering - 2004
-
Shukla, Anand (employed by Flarion Technologies, NJ)
M.S. Mechanical Engineering - 1996
Sorption Characterization of
Laminates Used in Electronic Packaging Substrates
-
Sidharth, S. (employed by Advanced Micro Devices, CA)
Ph.D. Mechanical Engineering - 1995
Fatigue Life Estimation of Leads in
Local Electronic Assemblies Subject to Vibration
-
Sidhu, Jaspreet (employed by Hughes Network Systems, MD)
M.S. Mechanical Engineering - 2001
Reliability Assessment of Thinpak
Power Module for Thermal Cycling Environments
-
Singh, Pameet (employed by CALCE EPSC)
M.S. Mechanical Engineering - 2001
Design Refresh Planning Optimization
Driven by Electronic Part Obsolescence
Ph.D. Mechanical Engineering - 2004
Forecasting Technology Insertion Concurrent with Design Refresh Planning for COTS-Based Obsolescence Sensitive Sustainment-Dominated Systems
-
Solomon, Rajeev (employed by Nortel Networks, NC)
Ph.D. Mechanical Engineering - 1999
Life Cycle Mismatch Assessment and
Obsolescence Management of Electronic Components
-
Song, Bo (employed by Vicor Corporation, MA)
M.S. Mechanical Engineering - 2006
Reliability Evaluation of Stacked Die BGA Assemblies under
Mechanical Bending Loads
-
Sridhar, Sundaram (employed by Philips Electronics - North America
Corporation, NJ)
Ph.D. Mechanical Engineering - 1994
Heat Transfer and Pressure Drop in
Flows Perpendicular to an Offset Fin Structure
-
Stadterman, Thomas (employed by U.S. AMSAA, MD)
Ph.D. Mechanical Engineering - 2003
Practical Assessment Methodologies for Circuit Cards Under Mechanical Shock Loading
-
Stellrecht, Eric (employed by Sierra Research)
M.S. Mechanical Engineering - 2003
Hygroscopic Swelling in Plastic Encapsulated Microelectronics: An Experimental Study Using Moir?Interferometry
-
Subramanian, Gowrishankar (employed by AMD, CA)
M.S. Mechanical Engineering - 2000
Analysis Methods for Size/Cost Tradeoffs for PWBs with Embedded Passives
-
Subramanian, Vinay (employed by Schlumberger Oil Drilling Services, France)
M.S. Mechanical Engineering - 2002
-
Subrahmanyam, Rajiv (employed by Netapps, AZ)
M.S. Mechanical Engineering - 2000
The Economic Impact of Component
Replacement in Electronic Systems
-
Sun, Ming (employed by Alpha & Omega Semiconductor, CA)
Ph.D. Mechanical Engineering - 1999
Lifetime Resistance Models of Electrical
Contact and Interconnect
-
Swaminathan, Rajesh (employed by Lucent Technologies, Bell
Labs, NJ)
M.S. Mechanical Engineering - 2001
Experimental and Theoretical
Methods for Estimating the Delamination of MEMS Chip-to-Chip Bonded
Devices in a LIGA-Based Safety and Arming System
-
Syed, Ahmer (employed by Amkor)
M.S. Mechanical Engineering - 1989
Vibration Analysis of Printed Wiring
Boards
- Syrus, Tobias (Peace Corps Volunteer, Africa)
M.S. Mechanical Engineering - 2001
Refinement of Part and Manufacturer
Assessment and Update to Include Discrete Passive Parts
-
Tang, Lan (employed by Cisco Systems, MA)
Ph.D. Mechanical Engineer - 1998
A Multi-Scale, Conjugate Thermal
Analysis Methodology for Convectively Cooled Electronic Enclosures
-
Thomas, Dawn A. (employed by Metasensors Inc., MD)
M.S. Mechanical Engineer - 1999
Analysis of Cannot Duplicate Failures
- Tiku, Sanjay (employed by Microsoft Inc., WA)
Ph.D. - Summer 2005
Reliability Capability Evaluation for Electronics Manufacturers
- Tiwari, Nivedan
M.S. Mechanical Engineering - 1998
Computer Aided Design of Microelectronic Packages
-
To'mey, Hala (employed by Applied Physics Labs, Johns
Hopkins University, MD)
M.S. Mechanical Engineering - 1997
Qualification of IBM Laptop for
Ruggedized Environment
-
Topolosky, Zeke
M.S. Mechanical Engineer - 2002
Reliability Analysis of Springs Used as Interconnects in Press-Pack Power Electronic Modules
-
Trichy, Thiagarajan (employed by Oracle CA)
M.S. Mechanical Engineer - 2000
Full Monte Carlo Technical Cost Modeling with Detailed Test/Rework Analysis for Inclusion in a Multi-Attribute Optimization Environment
-
Tu, Cheng-Chieh (employed in Taiwan)
M.S. Mechanical Engineering - 1999
Effect of Exposure and Wettability of Solder on Various Board Finishes
-
Tuchband, Brian, (employed by Boeing, PA)
M.S. Mechanical Engineering - 2007
Implementation of Prognostics and Health Management for Electronic Systems
-
Turner, Kellie A. (employed by ELDEC Corporation, WA)
M.S. Mechanical Engineering - 1997
Uprating the IBM 730TE Thinkpad
Computer for use in a Public Safety Mobile Computing Environment
-
Upadhyayula, Kumar (employed by Microsoft, WA)
Ph.D. Mechanical Engineering - 1998
Accelerated electronic
interconnect durability under multiple environments
-
Valentin, Ricky (employed by University of Puerto Rico, Mayaguz, Puerto Rico)
Ph.D. Mechanical Engineering - 2003
A Rapid Failure Assessment Approach for Insertion Mounted Solder Interconnects Under Thermomechanical Cycling
-
Varghese, Joseph (employed by Apple, CA)
Ph.D. Mechanical Engineering - 2006
Drop Testing of Portable Electronic Devices
-
Vasanth, G.B. (employed by Texas Instruments, TX)
M.S. Mechanical Engineering - 1995
Conductive Filament Formation
-
Verma, Shailendra (employed by Delco Electronics, IN)
M.S. Mechanical Engineering - 1992
Screening Guidelines for Electronics
at the Assembly Level
-
Verma, Vani (employed by Cypress Corp., CA)
M.S. Mechanical Engineering - 1996
Mechanical and Thermal Analysis of a
Unit Cell of a Microbridge Uncooled Focal Plane Array Infrared
Detector
-
Vichare, Nikhil (employed by Dell, TX)
Ph.D. Mechanical Engineering - 2006
Prognostics and Health management of Electronics by Utilizing Environmental and Usage Loads
-
Vijayaragavan, Niranjan (employed by Schlumberger, TX)
M.S. Mechanical Engineering - 2003
Physics of Failure Based Reliability Assessment of Printed Circuit Boards Used Permanent Downhole Monitoring Sensor Gauges
-
Vikram, Seshadri (employed by National Semiconductor, CA)
M.S. Mechanical Engineering - 1994
Correlation
of Natural Convection Heat Transfer from a Horizontal Printed Circuit Board
in an Enclosure
-
Vodzak, John
M.S. Mechanical Engineering - 1990
Coupled Thermal and Vibrational
Fatigue Analysis of Solder Joints for Surface Mounted Components
-
Walker, Donald James
M.S. Mechanical Engineering - 1997
Circuit Card Assembly Failure
Mechanism Model Handbook
-
Wang, Zhaoyang (employed by The Catholic University of America, DC)
Ph.D. Mechanical Engineering - 2003
Development and Application of Computer-aided Fringe Analysis
-
Wang, Zhixiang
M.S. Mechanical Engineering - 2006
-
Watts, Jonathon David
M.S. Mechanical Engineering - 1990
Placement for Producibility and
Assembly
-
Wong, Yeun Tsun (employed by Logicon, VA)
M.S. Mechanical Engineering - 1988
Steiner Tree Oriented Placement
-
Wu, Ji (employed by Inter, AZ)
Ph.D. Mechanical Engineering - 2003
Electrical Characterizaton and Reliability Assessment of Lead-Free Solder Separable Contact Interfaces
-
Wu, Mei-Ling
Ph.D. Mechanical Engineering - 2006
Dissertation: Rapid Assessment Methodology of BGA Fatigue Life under Vibration Loading
-
Wu, Xin (employed by Corona Optical Systems, IL)
Ph.D. Mechanical Engineering - 1993
An Experimental Study of Polyimide Films
Used in High Density Interconnects
-
Wu, Xin
Ph.D. Mechanical Engineering - 2003
Developing Highly Accurate and Stable Open-region Electromagnetic Simulations
-
Xie, Jingsong (employed by Beijing University of Aeronautics and Astronautics, China)
Ph.D. Mechanical Engineering - 2000
Characterization of Conductive
Elastomer Button Style Integrated Circuit Component Sockets
-
Yang, Yubing
Ph.D. Mechanical Engineering - 2003
Reliability Assessment of Optical Fibers Under Tension and Bending Loads
-
Yalamanchili, Prasad (employed by Analog Devices, Inc., CA)
Ph.D. Mechanical Engineering - 1995
Evaluation of Electronic
Packaging Reliability Using Acoustic Microscopy
-
Yoo, Dong-won (employed by LGA, S. Korea)
M.S. Mechanical Engineering - 2001
Smart Thermal Management Systems Based
on Solid Liquid Phase Change Materials (PCM)
-
Yu, Enchao (employed by CFD Research Corp., AL)
Ph.D. Mechanical Engineering - 1996
Passive Cooling of Vented and Closed
Enclosures by Natural Convection, Conduction and Radiation
-
Yuan, Lang (employed by Fujitsu Network Communications, NY)
M.S. Mechanical Engineering - 2001
The Effect of Orientation and Imposed
Circulation on the Performance of A Compact Two-Phase Thermosyphon
-
Zhan, Sheng, (employed by Baker Hughes, TX)
Ph.D. Mechanical Engineering - 2006
Surface Insulation Resistance Degradation and Electrochemical Migration on Printed Circuit Boards
- Zhang, Kang (employed by General Bandwidth, TX)
M.S. Mechanical Engineering - 2000
Reliability Assessment and Failure Analysis of Plastic Ball Grid Array
- Zhang, Qian (employed by Dell, TX)
Ph.D. Mechanical Engineering - 2004
Isothermal Mechanical and Thermo-Mechancial Durability Characterizaton of Selected Pb-free Solders
-
Zhang, Yibin (employed by CommerceOne Inc.)
M.S. Mechanical Engineering - 1998
Case Studies of Semiconductor Component Reliability
-
Zhang, Zhan (employed by U.S. Government - DC)
M.S. Mechanical Engineering - 1992
Project Planning and Scheduling in a
Concurrent Engineering Environment
-
Zhao, Ping (employed by Medtronic, Inc. - MN)
Ph.D. Mechanical Engineering - Spring 2005
Creep Corrosion over Plastic Encapsulated Microcircuit Packages with Noble Metal Pre-plated Leadframes
-
Zheng, Yunqi
Ph.D. Mechanical Engineering - 2005
Effect of Surface Finishes and
imtermetallics on power Cycling Reliability of Snagcu Die Attach
-
Zhu, Lily Hui (employed by NIST, MD)
M.S. Electrical Engineering - 1992
High Temperature Modeling and Thermal
Characteristics of GaAs Mesfets on Diamond Heat Sinks
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