Automotive Industries: Article

CALCE EPSC faculty and research staff have collectively authored over 25 internationally acclaimed textbooks and well over 250 research publications relevant to achieving quality and sustainability of electronic systems. To access a comprehensive list of CALCE publications, click here. The sublist of these publications that is of particular importance and interest to the automotive industry is presented below

  • Creep and High-Temperature Isothermal Fatigue of Pb-Free Solders, Q. Zhang, A. Dasgupta and P. Haswell, Proceedings of IPACK 03: International Electronic Packaging Technical Conference and Exhibition, July 6-11, 2003, Maui, Hawaii, USA.
  • Pool Boiling of Water and FC-72 on Copper and Graphite Foams, S. Moghaddam, M. Ohadi and J. Qi, Proceedings of IPACK 03: International Electronic Packaging Technical Conference and Exhibition, July 6-11, 2003, Maui, Hawaii, USA.
  • Chip Level Refrigeration of Portable Electronic Equipment Using Thermoelectric Devices, G. Solbrekken, K. Yazawaand A. Bar-Cohen, Proceedings of IPACK 03: International Electronic PackagingTechnical Conference and Exhibition, July 6-11, 2003, Maui, Hawaii, USA.
  • Measurement of Hygroscopic Swelling in Mold Compounds and Its Effect on PEM Reliability, E. Stellrecht, B. Han and M. Pecht, Proceedings of IPACK 03: International Electronic Packaging Technical Conference and Exhibition, July 6-11, 2003, Maui, Hawaii, USA.
  • Wire Flexure Fatigue Model for Asymmetric Bond Height, K. Meyyappan, P. Hansen and P. McCluskey, Proceedings of IPACK 03: International Electronic Packaging Technical Conference and Exhibition, July 6-11, 2003, Maui, Hawaii, USA.
  • Hygroscopic Swelling and Sorption Characteristics of Epoxy Molding Compounds Used in Electronic Packaging, H. Ardebili, E. Wong and M. Pecht, IEEE Transactions on Components and Packaging Technologies, Vol. 26, No. 1, pp. 206-214, March 2003.
  • Ion Transport in Encapsulants Used in Microcircuit Packaging, L Lantz II and M. Pecht, IEEE Transactions on Components and Packaging Technologies, Vol. 26, No. 1, pp. 199-205, March 2003.
  • Field Failure due to Creep Corrosion on Components with Palladium Pre-plated Leadframes, P. Zhao and M. Pecht, Microelectronics Reliability, Vol. 43, No. 5, pp. 775-778, 2003.
  • Isothermal Mechanical Creep and Fatigue of Pb-free Solders, Q. Zhang, P. Haswell and A. Dasgupta, International Brazing &Soldering Conference, San Diego, CA, February 16-19, 2003.
  • Observing Real-Time Thermal Deformations in Electronic Packaging, S. Cho, S. Cho and B. Han, Experimental Techniques, Vol. 26, No. 3, pp. 25-29, May/June 2002.
  • Temperature Dependent Deformation Analysis of Ceramic Ball Grid Array Package Assembly under Accelerated Thermal Cycling Condition, B. Han, S. Cho and J. Joo, Journal of Electronic Packaging, Transaction of the ASME August 2002.
  • Effect of Underfill on Flip-Chip Solder Bumps: An Experimental Study By Microscopic Moir?Interferometry, S. Cho and B. Han, The International Journal of Microcircuits and Electronic Packaging, Vol. 24, No. 3, pp. 217-239, 2002.
  • Cyclic Mechanical Durability of Sn-3.9Ag-0.6Cu and Sn-3.5Ag Lead-Free Solder Alloys, Q. Zhang, P. Haswell and A. Dasgupta, Proceedings ASME IMECE 2002, New Orleans, LA, November 17-22, 2002.
  • Underfilled PBGA Packages and Their Board Level Cycling and Vibration Performance, T. Baumann, D. Humphrey, K. Prodromides, T. Burnette, T. Koschmieder, J. Kennedy, J. Veum, M. Osterman, SMTA International 2002, Donald Stephens Convention Center, Rosemont, Illinois, Sept. 24-26, 2002.
  • Using Electronic Parts Outside the Manufacturer's Specified Temperature Range, M. Pecht, D. Das, and R. Biagini, Proceedings of The 3rd International Conference on Quality and Reliability, pp. 182-192, Australia, August 28-30, 2002.
  • The IEEE Standards on Reliability Program and Reliability Prediction Methods for Electronic Equipment, M. Pecht, D. Das, A. Ramakrishnan, Microelectronics Reliability, Vol. 42, pp. 1259-1266, 2002.
  • Hygro-Mechanical Durability of Underfilled Flip-Chip-on-Board (FCOB) Interconnects, J. Okura, A. Dasgupta, and J. Caers, Transactions of the ASME, Vol. 124, pp. 184-187, September 2002.
  • Micro-Mechanics of Creep-Fatigue Damage in PB-SN Solder Due to Thermal Cycling-Part I: Formulation, P. Sharmal and A. Dasgupta, Transactions of the ASME, Vol. 124, pp. 292-297, September 2002.
  • Micro-Mechanics of Creep-Fatigue Damage in PB-SN Solder Due to Thermal Cycling-Part II: Mechanistic Insights and Cyclic Durability Predictions From Monotonic Data, P. Sharmal and A. Dasgupta, Transactions of the ASME, Vol. 124, pp. 298-304, September 2002.
  • The "Trouble Not Identified" Phenomenon in Automotive Electronics, D. Thomas, K. Ayers and M. Pecht, Microelectronics Reliability, Vol. 42, pp. 641-651, 2002.
  • Risk Factors in Automotive Electronics Compared to Other Electronic Industries, J. McLeish, S. Tiku and M. Pecht, 2002
  • A Comparison of the Theory of Moisture Diffusion in Plastic Encapsulated Microelectronics with Moisture Sensor Chip and Weight-Gain Measurements, H. Ardebili, C. Hillman, M. Natishan, P. McCluskey, M. Pecht, D. Peterson, IEEE Transactions on Components and Packaging Technologies, Vol. 25, No. 1, pp. 132-139, March 2002. 
  • Evaluating the Performance and Reliability of Embedded Computer Systems for Use in Industrial and Automotive Temperature Ranges, C. O'Connor, K. Nathan and P. McCluskey, Intel Developer Network News, Vol. 1, pp. 62-65, Fall 2001. 
  • Junction Temperature Considerations in Evaluating Electronic Parts for Use Outside Manufacturers-Specified Temperature Ranges, L. Condra, D. Das, N. Pendse, and M. Pecht, IEEE Transactions on Components and Packaging Technologies, Vol. 24, No. 4, pp. 721-728, December 2001. 
  • Parameter Recharacterization: A Method of Thermal Uprating, D. Das, N. Pendse, C. Wilkinson, and M. Pecht, IEEE Transactions on Components and Packaging Technologies, Vol. 24, No. 4, pp. 729-737, December 2001.
  • Fatigue of Chip Scale Package Interconnects Due to Cyclic Bending, S. Shetty, V. Lehtinen, A. Dasgupta and V. Halkola and T. Reinikainen, Journal of Electronic Packaging, Vol. 123, Issue 3, pp. 302-308, September 2001. 
  • Thermal Characterization of a Liquid Cooled AlSiC Base Plate with Integral Pin Fins K. Moores, Y. Joshi and G. Schiroky, IEEE Transactions on Components and Packaging Technologies, Vol. 24, No. 2, pp. 213-219, 2001. 
  • A Demonstration of Virtual Qualification for the Design of Electronic Hardware, J. Cunningham, R. Valentin, C. Hillman, A. Dasgupta, and M. Osterman, ESTECH 2001, IEST, Phoenix, AZ, April 2001. 
  • Fatigue and Intermetallic Formation in Lead Free Solder Die Attach, P. McCluskey, Proceedings of IPACK'01, The Pacific Rim/ASME International Electronic Packaging Technical Conference and Exhibition, Kauai, HI, July 9-13, 2001. 
  • Micro-Mechanics of Fatigue Damage in Pb-Sn Solder Due to Vibration and Thermal Cycling, A. Dasgupta, P. Sharma and K. Upadhyayula, International Journal of Damage Mechanics, Vol. 10, pp. 101-132, April 2001. 
  • Palladium-plated Packages: Creep Corrosion and Its Impact on Reliability, J. Xie and M. Pecht, Advanced Packaging, pp. 39-42, February 2001.
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