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Automotive Industry: Online Resources
Since 1984, nearly $45M has been invested in developing
innovative methodologies to decrease life-cycle risks for the next
generation of electronic products and systems, and to provide an
educational and technological infrastructure for their rapid
dissemination and use. We now offer an extensive set of resources to
help engineers assess, mitigate, and manage risks in electronic
products. These include web-based documents and tools to: conduct
parts selection and management; conduct cost-effective accelerated
testing and screening; predict reliability based on physics of
failure and using virtual qualification software; design using
components outside their rated temperature; design and utilize high
temperature electronics; and model life cycle economics.
CalcePWA and CADMP II reliability assessment software was
developed at CALCE EPSC over the past 15 years. It is the most
advanced reliability assessment and virtual qualification tool
currently available, providing engineers with a silicon-to-systems
accelerated product qualification capabilities. To access more
information on the CALCE software products, click here.
The center offers a wide access to a collection of web-based
documents, called webbooks, that cover areas of critical importance
in electronic products and system development, ranging from
solder-joint fatigue analysis and accelerated test development to
cost analysis and supply chain management. To access a complete list
of CALCE webbooks and their short descriptions, click
here.
Webbooks of particular interest to the automotive industry are listed below:
- Accelerated
Product Qualification and Quality Assurance
This
online resource presents interactive physics-of-failure guidelines for
accelerated product qualification and quality assurance. The material
is intended to give electronics manufacturers, suppliers, managers,
analysts, and engineers a rational understanding of efficient ways to
assess product durability and quality. Further, the fundamental
concepts required to develop a successful physics-of-failure based
accelerated qualification and quality assurance program that meets the
product requirements, lowers life-cycle costs and reduces the
time-to-market are addressed in detail through interactive
case-studies. The valuable lessons learned are outlined as a set of
generic guidelines to help design, plan, and implement a PoF based
accelerated qualification program. [software, presentations, tutorials,
case studies, and reports].
- EMC/EMI
This webbook contains information on approaches to
computational modeling, current capabilities of commercial
EMC/EMI software, and the fundamental mathematical principles
behind EMC/EMI modeling and analysis. It also contains various
EMC/EMI example problems.
- Influence
of Temperature on Microelectronics and System Reliability
An authoritative source on the effects of temperature on
microelectronic device failure mechanisms. The document covers the
important issues of steady state temperature dependent models,
temperature effects associated with temperature cycling,
temperature gradient, and time dependent temperature changes. It
identifies models quantifying the temperature effects on various
package elements, and address of the impacts of various design for
temperature trade-offs on electronic systems. Temperature related
models are assessed in terms of their use for determining the
maximum and minimum allowable thermal stresses for a given system
architecture.
[book chapters and references].
- Integrated
Circuit, Hybrid and Multichip Module Package Design Guidelines
A
handbook providing descriptions of critical failure mechanisms for a
wide range of packaging elements in IC, hybrid and multi-chip module
packages. It also gives fundamental models for assessing the
susceptibility for failure of these electronic products. [book chapters
and references].
- Moisture
Diffusion and Corrosion in Electronics
This
webbook provides tutorials, bibliographies, and research work
associated with moisture diffusion and corrosion in electronic systems.
Moisture ingress into electronic assemblies can have many deleterious
effects. In plastic encapsulated microelectronics (PEMs), moisture can
cause or attribute to reliability problems such as popcorning,
cracking, delamination and corrosion of the metalization at the die
surface. Moisture in printed wiring boards can lead to corrosion,
oxidation , and dendritic growth. Corrosion can cause degradation in
electrical and mechanical performance of the electronic systems, and
eventually, opens or shorts. [tutorials, presentations, and
references].
- Plastic
Encapsulated Microelectronics (including, PEM
Encyclopedia, and PEM
Bibliography)
An interactive guide including a
webbook, a bibliography, and online movies, provides a state of
current technology and guidelines for use, manufacturing and
purchasing of Plastic Encapsulated Microcircuits (PEMs). The
webbook presents the science and technology behind PEMs. The
advantages of using plastic packages, and the state of the current
technology are discussed. A perspective on future trends in
plastic encapsulation, especially on chip technology, packaging,
design, materials selection, manufacturing processes, device
integration and application-specific reliability is included. Also
included is a bibliography of a wide range of critical
publications in the fields of PEM manufacture, use, and
reliability. [book
chapters, references, bibliography and online movies].
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