CALCE EPSC faculty and research staff have collectively authored over 25 internationally acclaimed textbooks and well over 250 research publications relevant to achieving quality and sustainability of electronic systems. To access a comprehensive list of CALCE publications, click here. The sublist of these publications that is of particular importance and interest to the aerospace and avionics industries is presented below.

• Electronic Part Obsolescence Driven Product Redesign Optimization, P. Singh, P. Sandborn, T. Geiser and D. Lorenson, International Journal of Advanced Manufacturing Systems, to be published in 2004.
• Design Guidelines for Avoiding Flex Cracking in Ceramic Capacitors, C. Hillman, N. Blattau, and D. Barker, Global SMT and Packaging, to be published in 2003. 
• Auditing The Reliability Capability of Electronics Manufactures, S. Tiku and M. Pecht, Proceedings of IPACK 03: International Electronic Packaging Technical Conference and Exhibition, July 6-11, 2003, Maui, Hawaii, USA.
• Measurement of Hygroscopic Swelling in Mold Compounds and Its Effect on PEM Reliability, E. Stellrecht, B. Han and M. Pecht, Proceedings of IPACK 03: International Electronic Packaging Technical Conference and Exhibition, July 6-11, 2003, Maui, Hawaii, USA.
• Failures in Base Metal Electrode (BME) Capacitors, D. Donahoe, C. Hillman and M. Pecht, 2003 Proceedings - 23rd Capacitor and Resistor Technology Symposium, pp. 129-133, Scottsdale, AZ, March 31 - April 3, 2003.
• Design Guidelines for Preventing Flex Cracking Failures in Ceramic Capacitors, N. Blattau, D. Barker, C. Hillman, 2003 Proceedings - 23rd Capacitor and Resistor Technology Symposium, pp. 155-162, Scottsdale, AZ, March 31 - April 3, 2003.
• Hygroscopic Swelling and Sorption Characteristics of Epoxy Molding Compounds Used in Electronic Packaging, H. Ardebili, E. Wong and M. Pecht, IEEE Transactions on Components and Packaging Technologies, Vol. 26, No. 1, pp. 206-214, March 2003.
• Carbon Nanotubes and an Optical Method for Life Consumption Monitoring of Electronic Assemblies, P. Casey, D. Anand and M. Pecht, Proceedings of 8th Annual Pan Pacific Microelectronics Symposium, Maui, HI, pp. 225-234, February 18-20, 2003.
• Remaining Life Assessment of Aging Electronics in Avionic Applications, R. Valentin, M. Osterman and Bob Newman, The Annual Reliability and Maintainability, 2003 Proceedings, pp. 313-318, Tampa Florida, January 27-30, 2003.
• Recommendations for Future Avionics Hardware Development, C. Wilkinson, M. Pecht, J. Wasson and L. Condra, Proceedings of the World Aviation Congress, Phoenix, AZ, November 2002.
• Remaining Life Assessment of Shuttle Remote Manipulator System End Effector, V. Shetty, D. Das, M. Pecht, D. Hiemstra and S. Martin, Proceedings of the 22nd Space Simulation Conference, Ellicott City, MD, October 21-23, 2002.
• Virtual Life Assessment of Electronic Hardware Used in the Advanced Amphibious Assault Vehicle (AAAV), R. Valentin, J. Cunningham, M. Osterman, A. Dasgupta, M. Pecht and D. Tsagos, Proceedings of the 2002 Winter Simulation Conference, San Diego, California, December 8-11, 2002.
• Design Guidelines for Avoiding Flex Crac king in Ceramic Capacitors, C. Hillman, N. Blattau, and D. Barker, Pr oceedings of the National Electronic Packaging and Production Conference (NEPCON -West), CA version pp. 318-326, San Jose, CA, December 2002.
• Using Electronic Parts Outside the Manufacturer's Specified Temperature Range, M. Pecht, D. Das, and R. Biagini, Proceedings of The 3^rd International Conference on Quality and Reliability, pp. 182-192, Australia, August 28-30, 2002.
• Airborne Operation of Portable Electronic Devices, L. Lin, J. Xie, O. Ramahi M. Pecht and B. Donham, to be published, IEEE Antennas and Propagation Magazine, June 2002.
• Manufacturer Assessment Procedure and Criteria for Parts Selection and Management, T. Syrus, M. Pecht, and R. Uppalapati, IEEE Transactions on Electronics Packaging Manufacturing, Vol. 24, No. 4, pp. 351-358, October 2001.
• Part Assessment Guidelines and Criteria for Parts Selection and Management, T. Syrus, M. Pecht, and D. Humphrey, IEEE Transactions on Electronics Packaging Manufacturing, Vol. 24, No. 4, pp. 339-350,  October 2001.
• Microsystem Packaging for High Temperature and Harsh Environments, L. Chen and P. McCluskey, MST (Microsystems) News, pp. 41-42, September 2001.
• Junction Temperature Considerations in Evaluating Electronic Parts for Use Outside Manufacturers- Specified Temperature Ranges, L. Condra, D. Das, N. Pendse, and M. Pecht, IEEE Transactions on  Components and Packaging Technologies, Vol. 24, No. 4, pp. 721-728, December 2001.
• Parameter Recharacterization: A Method of Thermal Uprating, D. Das, N. Pendse, C. Wilkinson, and  M. Pecht, IEEE Transact IEEE Transactions on Components and Packaging Technologies, Vol. 24, No. 4,  pp. 729-737, December 2001.
• Reliability Engineering in the 21st Century - A Focus on Predicting the Reliability of Electronic Products and Systems, M. Pecht, Proceedings of The 5th ICRMS 2001, Vol. 1, pp. 1-19, 28-31, August, 2001, Dalian, China.
• A Demonstration of Virtual Qualification for the Design of Electronic Hardware, J. Cunningham, R. Valentin,  C. Hillman, A. Dasgupta, and M. Osterman, ESTECH 2001, IEST, Phoenix, AZ, April 2001.
• Life Cycle Forecasting of ASICs Z. Huang, P. Sandborn, M. Pecht and R. Solomon, FutureCircuits  International, Issue 7, pp. 101-107, Technology Publishing Ltd, London, UK, 2001. 
• Electronic Hardware Reliability, A. Ramakrishnan, T. Syrus and M. Pecht, Avionics Handbook, pp. 22-1 to 22-21, CRC Press, Boca Raton, Florida, December 2000.
• Method for Assessing Remaining Life in Electronic Assemblies, P. McCluskey, J. Kweon, J. Kim and  H. Jeon, Microelectronics Reliability, Vol. 40, No. 2, pp. 293-306, 2000.
• Reliable Use of Commercial Technology in High Temperature Environments, P. McCluskey, K. Mensah, C. O'Connor and A. Gallo, Microelectronics Reliability, Vol. 40, No. 8-10, pp. 1671-1678, Aug. - Oct. 2000.
• Electronic Part Life Cycle Concepts and Obsolescence Forecasting, R. Solomon, P. Sandborn and M. Pecht, IEEE Transactions on Components and Packaging Technologies, Vol. 23, No. 3, pp. 707-717, December 2000.
• An Avionics Guide to Uprating of Electronic Parts, D. Humphrey, L. Condra, N. Pends, D. Das, C. Wilkinson and M. Pecht, IEEE Transactions on Components and Packaging Technologies, Vol. 23, No. 3, pp. 595-599, September, 2000.
• Equipment Supplier Intervention Techniques, C. A. Schwach, A. Mathur, R. Solomon, P. Sandborn, and M. Pecht, Future EMS International, No. 3, pp. 97-100, 2000.
• Electrical Performance Comparison of the Military and Commercial Versions of a TI, Octal Buffer N. Pends?nbsp; and M. Pecht, Future Circuits International, Vol. 6, pp. 63-67, 2000.
• The Electronic Part Life Cycle M. Pecht and D. Das, IEEE Transactions on Components and Packaging Technologies, Vol. 23, No. 1, pp. 190-193, March 2000.
• Editorial: Life Cycle and Environmental Mismatches in Electronics for Critical Applications, P. McCluskey, Microelectronics International, Vol. 16, No. 1, pp. 6-7 1999.
• A Risk-Informed Methodology for Parts Selection and Management, M. Jackson, P. Sandborn, M. Pecht, C. Hemens-Davis and P. Audette, Quality and Reliability Engineering International, Vol. 15, pp. 261-271, September 1999.
• Editorial: A Standard Methodology for Reliability Prediction M. Pecht, IEEE Transactions on Components  and Packaging Technologies, Vol. 22, No. 1, pp. 266-269, March 1999.
• Part Manufacturer Assessment Process, M. Jackson, A. Mathur, M. Pecht and R. Kendall, Quality and Reliability Engineering International, Vol. 15, pp. 457-468, 1999.
• Tipping the Scales in Your Favor when Uprating, R. Biagini, M. Rowland, M. Jackson, and M. Pecht, IEEE Circuits & Devices Magazine, pp. 15-23, July 1999.
• Terminology for Use of Parts Outside Manufacturer-Specified Temperature Ranges, L. Condra, R. Hoad, D. Humphrey, T. Brennom, J. Fink, J. Heebink, C. Wilkinson, D. Marlborough, D. Das, N. Pends? and M. Pecht, IEEE Transactions on Components and Packaging Technology, Vol. 22, No. 3, pp. 355-356, September 1999.
• Trends in Component Reliability and Testing, Y. Zhang, D. Das, A. Katz, M. Pecht and O. Hallberg, Semiconductor International, pp. 101-106, September 1999.
• Use of thermal analysis information in avionics equipment development, D. Das, Electronics Cooling, Vol. 5, No. 3, September 1999. 
• Low Temperature Delamination of Plastic Encapsulated Microcircuits, P. McCluskey, F. Lilie, O. Beysser  and A. Gallo, Microelectronics Reliability, Vol 38, pp. 1829-1834.
• A Critique of the Reliability Analysis Center's Failure Rate Model for Plastic Encapsulated Microcircuits, N. Sinnadurai, A. Shukla and M. Pecht, IEEE Transactions on Reliability, Vol. 47, No. 2, pp. 110-113, June 1998.
• Characterizing the Thermal Performance of a Flow Through Electronic Module (SEM-E Format) Using  a Porous Media Model, L. Tang, K. Moores, C. Ramaswamy and Y. Joshi, Proceedings of the IEEE SEMITHERM XIV Symposium, pp. 68-77, San Diego, CA March 1998.
• An Investigation of 'Cannot Duplicate' Failure, R. Williams, J. Banner, I. Knowles, M. Natishan, and  M. Pecht, Quality and Reliability Engineering International;, Vol. 14, pp. 331-337, 1998.
• Low Temperature Delamination of Plastic Encapsulated Microelectronics, P. McCluskey, F. Lilie, O. Beysser, and A. Gallo, Proceedings of the 1998 International Acoustic Microimaging Symposium- IAMIS '98,  Anaheim, CA, Feb. 26-27, 1998.
• Packaging of Electronics for High Temperature Environments, P. McCluskey, D. Das, J. Jordan, L. Condra, T. Torri, J. Fink and R. Grztbowski, International Journal of Microcircuits and Electronics Packaging, Vol. 20,  No. 3, 1998.
• Packaging of Power Electronics for High Temperature Applications, P. McCluskey, D. Das, J. Jordan,  L. Condra, R. Grzybowski, T. Torri and J. Fink, Advanced Microelectronics, Vol. 25, No. 1, pp. 19-24, Jan/Feb 1998.
• Passive Thermal Control of Electronic Equipment, Y .Joshi, Applied Computation Fluid Dynamics,  V. Garg, Ed., Marcel Dekker, Chapter 8, pp. 301-333, 1998.
• Realism of FAA Reliability-Safety Requirements and Alternatives, M. Pecht, J. Boullie, E. Hakim,  A. Jain, M. Jackson, I. Knowles, R. Shroeder, A. Strange and J. Wyler, IEEE AES Systems Magazine,  pp. 16-20, February 1998.
• Reliability Assessment of Electronic Components Exposed to Long-Term Non-Operating Conditions, P. McCluskey, E. Hakim, J. Fink, A. Fowler, and M. Pecht, IEEE Transactions on Components, Packaging and Manufacturing Technology, Part A, Vol. 21, No. 2, pp. 352-360, June 1998.
• Reliability Concerns in High Temperature Electronic Systems, P. McCluskey, R. Grzybowski, L. Condra,  D. Das, J. Fink, J. Jordan and T. Torri, 1998 Engineering Foundation Conference on High Temperature Electronic Materials, Devices and Sensors, San Diego, CA, February 22-27, 1998.
• Transient Thermal Management of an Avionics Module Using Solid-Liquid Phase Change Materials, D. Pal, and Y. Joshi, AIAA Journal of Thermophysics and Heat Transfer, Vol. 12, pp. 256-262, 1998.
• Why a New Parts Selection and Management Program? B. Foucher, R. Kennedy, N. Kelkar, Y. Ranade, A. Govind, W. Blake, A. Mathur and R. Solomon, IEEE Transactions on Components, Packaging, and Manufacturing Technology - Part A, Vol. 21, No. 2, pp. 375-378, June 1998
• An Assessment of the Qualified Manufacturer List (QML) M. Pecht, J. Fink, E. Hakim and J. Wyler, IEEE Aerospace and Electronic Systems, Vol. 12, No. 7, pp. 39-43, July 1997.
• Criteria for the Assessment of Reliability Models, M. Pecht, A. Shukla, N. Kelkar and J. Pecht, IEEE Transactions on Components, Packaging, and Manufacturing Technology - Part B, Vol- 20, No. 3,  pp. 229-234, August, 1997
• Electronic Components Obsolescence, L. Condra, A. Anissipour, D. Mayfield and M. Pecht, IEEE  Transactions on Components, Packaging, and Manufacturing Technology - Part A, Vol. 20, No. 3,  pp. 368-371, 1997
• Flat Panel Displays- What is Going on in East Asia Outside Japan, M. Pecht and C. Lee, Circuit World,  Vol. 24(1), pp. 20-27, November 1997
• How Burn-in can Reduce Quality and Reliability, J. Jordan, M. Pecht, and J. Fink, The International Journal  of Microcircuits and Electronic Packaging, Vol. 20, No. 1, pp. 36-40, First Quarter, 1997.
• Integrated Thermal Analysis of Indirect Air-Cooled Electronic Chassis , L. Tang and Y. Joshi, IEEE Transactions on Components, Packaging and Manufacturing Technology - Part A, Vol. 20, No. 2,  pp. 103-110, June 1997.
• Liquid-Cooling of Electronic Equipment: Where Does it Offer Viable Solutions? ,W. Nakayama, Advances  in Electronic Packaging, ASME, Vol. 2, pp. 2045-2052, 1997.
• Packaging of Electronics for High Temperature Applications, P. McCluskey, D. Das, J. Jordan,  R. Grzybowski, J. Fink, L. Condra and T. Torri, International Journal of Microcircuits and Electronic  Packaging, Vol. 20, No. 3, 3rd Quarter, 1997
• Perspectives to Understand Risks in the Electronic Industry, A. Dasgupta, E. Magrab, D. Anand,  K. Eisinger, J. McLeish M. Torres, P. Lall and T. Dishongh, IEEE Transaction on Components Packaging and Manufacturing Technology - Part A, Vol. 20, No. 4, pp. 542-547, December 1997
• Plastic-Encapsulated Microcircuits (PEMs): Long-term Dormancy Studies, E. Hakim, J. Fink, S. Tam, P. McCluskey and M. Pecht, Circuit World, Vol. 23, No. 4, pp. 26-29, 1997.
• "Smart" Electronic Systems for Condition-Based Health Management, N. Kelkar, A. Dasgupta,  M. Pecht, I. Knowles, M. Hawley and D. Jennings, Quality and Reliability Engineering International,  Vol. 13, pp. 3-7, 1997.
• Temperature as a Reliability Factor, M. Pecht, P. Lall and E. Hakim, Thermal Management of Electronic  System II, Kluwer Academic Publishers, Belgium, pp. 27-41, 1997.
• Uprating Electronic Components for Use Outside Teir Temperature Specification Limits, M. Wright, D. Humphrey and P. McCluskey, IEEE Transactions on Components, Packaging, and Manufacturing  Technology, Part A, Vol. 20, No. 2, pp. 252-256, June 1997.
• Characterizing the Commercial Avionics Thermal Environment for Field Reliability Assessment K. Cluff, D. Barker, D. Robbins and T. Edwards, Proceedings-Institute of Environmental Sciences,  pp. 50-57, 1996.
• How Burn-in Can Reduce Quality and Reliability , J. Jordan and M. Pecht, Proceedings-Institute of Environmental Sciences, pp. 16-19, 1996
• Issues Affecting Early Affordable Access to Leading Electronic Technologies by the US Military and Government, M. Pecht, Circuit World, Vol. 22, No. 2, pp. 7-15, 1996.
• Plastic Encapsulated Microelectronics , M. Pecht, Engineering Magazine, pp. 22-23, September, 1996
• Plastic-Encapsulated Microcircuit Reliability & Cost Effectiveness Study, D. Emerson, E. Hakim and A. Govind, IEEE Transactions on Reliability, Vol. 45, No. 1, pp. 19-22, March 1996.
• Reliability Assessments of Fielded Plastic and Hermetically Packaged Microelectronics, B. Johnson and V. Verma, IEEE Transactions on Reliability, Vol. 45, No. 1, pp. 23-26, March 1996.
• Reliability of Surface Mount Capacitor Subjected to Wave Soldering, T. Panchwagh and P. McCluskey, International Journal of Microelectronics Packaging, Vol. 2, No. 1, February 1996.
• The Role of Heat Transfer Analysis in Avionics Equipment Development, D. Das and M. Pecht, ASME Proceedings of the 32nd National Heat Transfer Conference, Vol. 7, HTD-Vol. 329, pp. 197-209,  August. 1996.
• Smart Electronic Systems for Condition-Based Health Management, N. Kelkar, A. Dasgupta, M. Pecht, I. Knowles, M. Hawley and D. Jennings Proceedings of 9th International Congress and Exhibition  on Condition Monitoring and Diagnostic Engineering Management (COMADEM), Sheffield, UK,  pp. 591-601, July 1996.
• Why the Traditional Reliability Prediction Models Do Not Work - Is There an Alternative? M. Pecht, Electronics Cooling, Vol. 2, pp. 10-12, January 1996.
• Beyond the Qualified Manufacturer List (QML), E. Hakim, C. Rust and W. Olsson, Proceedings Annual Reliability and Maintainability Symposium, Washington DC, pp. 362-369, January 16-19, 1995.
• Characterization of Functional Relationship Between Temperature and Microelectronic Reliability, P. Lall, M. Pecht and E. Hakim, Microelectronics and Reliability, Vol. 35(3), pp. 377-402, March 1995.
• Does the Cooling of Electronics Increase Reliability? A. Dasgupta and M. Pecht, Proceedings of Thermal Stresses '95 Conference, No. 231, 1995
• Framework for a Dual-Use Standard for Reliability Program, I. Knowles, A. Malhotra, R. Munamarty and T. Stadterman, Proceedings of 1995 Annual Reliability & Maintainability Symposium, pp. 481-493, January 1995
• Long Term Storage Reliability for Plastic Encapsulated Microcircuits, A. Fowler, P. McCluskey and K. Rogers, Proceedings of 1995 Advanced Technology, Acquisition, Qualification, and Reliability Workshop, Newport Beach, CA, pp. 269-278, August 1995.
• Temperature as a Reliability Factor, M. Pecht, P. Lall and E. Hakim, Eurotherm Seminar No. 45 : Thermal Management of Electronic Systems , pp. 36.1-36.22, 1995.
• Understanding and Solving the Real Reliability Assurance Problems, M. Pecht, F. Nash and J. Lory, Proceedings of the Annual Reliability & Maintainability Symposium, pp. 159-161, January 1995.
• The Demise of Plastic Encapsulated Microcircuit Myths, E. Hakim, R. Agarwal and M. Pecht, 5th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis, Glasgow, Scotland, Oct. 6, 1994; also Proceedings of NATO Advisory Group for Aerospace Research and Development, Avionic Panel on Advanced Packaging Concepts for Digital Avionics, San Diego, CA, June 8, 1994.
• Liquid Flow-Through Cooling of Electronic Modules, S. Sridhar, M. Osterman, J. Carbonell and K. Herold, AGARD Conference Proceedings 562 for the Avionics Panel Symposium, San Diego, CA, Vol. 17, No. 1-6, October 1994.
• Predicting the Reliability of Electronic Equipment, M. Pecht and F. Nash, Proceedings of the IEEE, Vol. 82, (7), pp. 992-1004, July 1994.
• Using Plastic-Encapsulated Microcircuits in High Reliability Applications, L. Condra, G. Kromholtz, M. Pecht and E. Hakim, Proceedings 1994 Annual Reliability and Maintainability Symposium, pp. 481-493, Jan. 1994.
•  Derating Guidelines for Temperature-Tolerant Design of Microelectronics, P. Lall, M. Pecht and E. Hakim, 6th International Conference Quality in Electronic Components Failure Prevention, Detection and Analysis; 4th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis, Bordeaux, France, October 4-7, 1993. 
• The Future of Military Standards - A Focus on Electronics, M. Pecht and E. Hakim, IEEE Aerospace and Electronic Systems, Vol. 17 (7), pp. 16-19, 1993.
• Plastic Packages Microcircuits: Quality, Reliability, Realibility and Cost Issues, M. Pecht, R. Agarwal and D. Quearry, IEEE Transactions on Reliability, Vol. 42(4), pp. 630-635, December 1993.
• Reliability Evaluation of Plastic Encapsulated Parts, L. Weil, M. Pecht and E. Hakim, IEEE Transactions on Reliability, Vol. 42(4), pp. 608-616, December 1993.
• Reliability Evaluation of Simple Logic Microcircuits in Surface Mount Plastic Package, L. Condra, G. Wenzel and M. Pecht, EEP-Vol. 6, Electronic Packaging Reliability, pp. 85-100, Nov. 1993. 
• Thermal Derating Guidelines for Temperature-Tolerant Design of Micro-Eletronic Devices P. Lall, M. Pecht and E. Hakim, ESREF (Bordaux France), 1993.
• Using Plastic Encapsulated Microcircuites in High Reliability Applications, L. Condra, G. Kromholtz,  M. Pecht, and E. Hakim, 1993.
• Are Components Still the Major Problem: A Review of Electronic System and Device Field Failure Returns,  M. Pecht and V. Ramappan, IEEE Trans. CHMT, 15(6), 1160-1164, 1992.
• Comparison of Plastic and Hermetic Micro-Circuits Under Temperature Cycling and Temperature Humidity Bias, L. Condra, S. O'Rear, T. Freedman, L. Flancia, M. Pecht and D. Barker, IEEE Trans. CHMT,  Vol. 15(5), pp. 640-650, 1992.
• Cooling Of Electronic Boards Using Internal Fluid Flows, K. Herold, S. Sridhar and S. Hu, Proceedings  1992 Joint ASME/JSME Conference on Electronic Packaging: Advances in Electronic Packaging 1992,  pp. 285-290, April 9-12, 1992.
• A Physics Of Failure Approach To IC Burn-In, M. Pecht and P. Lall, Proceedings 1992 Joint ASME/JSME Conference on Electronic Packaging: Advances in Electronic Packaging 1992, April 9-12, 1992, pp. 917-924; also presented at 21st Joint Hybrid Microelectronics Symposium, ISHM, Cherry Hill, NJ, May 27-28, 1992.
• Towards a QML Approach in Electronic Packaging, A. Dasgupta, S. Verma and R. Agarwal,  13th IEEE/CHMT International Electronics Manuf. Technology Sym., Baltimore, MD, pp. 19-29,  September 28-30, 1992.
• Transition of MIL-STD-785 From a Military to a Physics-of-Failure Based Com-Military Document,  M. Pecht, A. Malhotra, D. Wolfowitz, M. Oren and M. Cushing, 9th Int'l Conf. of the Israel Society for  Quality Assurance, Jerusalem, Israel, November 16-19, 1992.
• The Influence of Temperature on Integrated Circuit Failure Mechanisms, M. Pecht, P. Lall and E. Hakim,  Quality and Reliability Engineering Intl, Vol. 8, pp. 167-175, 1992.
• The Influence of Temperature on Integrated Circuit Failure Mechanisms; Part II, M. Pecht, P. Lall and E. Hakim, 5th International Conference on Quality in Electronic Components, Bordeaux, France, pp. 85-92, October 7-10, 1991. 
• Microelectronic Reliability/Temperature Independence, Part I, E. Hakim, M. Pecht and P. Lall, 5th  International Conference on Quality in Electronic Components, Bordeaux, France, pp. 49-54,  October 7-10, 1991
• Modeling the Influence of Absolute Temperature on Microelectronic Device Reliability, M. Pecht  and P. Lall, Internepcon/Semiconductor Thailand '91, Bangkok, Thailand, December 2-4, 1991. 
• How Failure Prediction Methodology affects Electronic Equipment Design, C. Leonard and M. Pecht,  Quality & Reliability Engineering International, Vol. 6, pp. 243-249, 1990.
• A Critique of Mil-Hdbk-217E Reliability Prediction Methods, M. Pecht and W. Kang, IEEE Transactions  on Reliability, Vol. 37 (5), pp. 453-457, December 1988.
• Temperature Dependence of Micro-Electronic Device Failures, M. Pecht, P. Lall and S. Whelan (Westinghouse), Quality and Reliability Engineering Intl, Vol. 6, pp. 275-284, 1990.

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