The Center for Advanced Life Cycle Engineering

Computer and Consumer Electronics Industries: Articles

CALCE EPSC faculty and research staff have collectively authored over 25 internationally acclaimed textbooks and well over 400 research publications relevant to achieving quality and sustainability of electronic systems. To access a comprehensive list of CALCE publications, click here. The sublist of these publications that is of particular importance and interest to the computer and consumer electronics industries is presented below.

Reliability Assessment of Delamination in Chip-to-Chip Bonded MEMS Packaging, R. Swaminathan, H. Bhaskaran, P. Sandborn, G. Subramanian, M. Deeds, and K. Cochran, IEEE Transactions on Advanced Packaging, to be published in 2003.

Design Guidelines for Avoiding Flex Cracking in Ceramic Capacitors, C. Hillman, N. Blattau, and D. Barker, Global SMT and Packaging, to be published in 2003.

Factors Dominating Corrosion of Zinc-Coated Steel Enclosures for Electromagnetic Shielding, J. Xie, M. Pecht, and O. Ramahi, IEEE Trans. Components Manufacturing and Packaging Technology, to be published in 2003.

Modeling Test, Diagnosis, and Rework Operations and Optimzing Their Location in General Manufacturing Processes, Z. Shi and P. Sandborn, ASME 8^th Design for Manufacturing Conference, Chicago, IL, to be publshed in September 2003.

Cost and Production Analysis for Substrates with Embedded Passives, P. Sandborn, B. Etienne, J. W. Herrmann, and M. M. Chincholkar, Circuit World, to be published in 2003.

Auditing The Reliability Capability of Electronics Manufactures, S. Tiku and M. Pecht, Proceedings of IPACK 03: International Electronic Packaging Technical Conference and Exhibition, July 6-11, 2003, Maui, Hawaii, USA.

A Review of the Economics of Embedded Passives, P. Sandborn, Proceedings of IPACK 03: International Electronic Packaging Technical Conference and Exhibition, July 6-11, 2003, Maui, Hawaii, USA.

Failures in Base Metal Electrode (BME) Capacitors, D. Donahoe, C. Hillman and M. Pecht, 2003 Proceedings - 23rd Capacitor and Resistor Technology Symposium, pp. 129-133, Scottsdale, AZ, March 31 - April 3, 2003.

Design Guidelines for Preventing Flex Cracking Failures in Ceramic Capacitors, N. Blattau, D. Barker, C. Hillman, 2003 Proceedings - 23rd Capacitor and Resistor Technology Symposium, pp. 155-162, Scottsdale, AZ, March 31 - April 3, 2003.

The Economics of Embedded Passives, P. Sandborn, in Integrated Passive Component Technology, Wiley- IEEE Press, 2003.

The NEMI Roadmap: Integrated Passives Technology and Economics, J. Dougherty, J. Galvagni, L. Marcanti, R. Sheffield, P. Sandborn, and R. Ulrich, Proceedings of the Capacitor and Resistor Technology Symposium (CARTS), Scottsdale, AZ, April 2003.

Test Tailoring Methodology for Impact Testing of Portable Electronic Products, J. Varghese and A. Dasgupta, IMAC-XXI Conference on Structural Dynamics, Kissimmee, Florida, February3-6, 2003.

Optical Measurement of Flip-Chip Package Warpage and Its Effect on Thermal Interfaces, B. Han, Electronics Cooling, Vol. 9, No. 1, pp. 10-14, February 2003.

Characterization of Some Commercial Thermally-Cured Potting Materials, I. Baylakoglu, C. Hillman and M. Pecht, Proceedings of the International IEEE Conference on the Business of Electronic Product Reliability and Liability, Hong Kong, January 13-14, 2003.

Challenges for Adopting Pb-Free Interconnects for "Green" Electronics, P. Casey and M. Pecht, IPC/JEDEC International Conference on Lead-Free Electronic Components and Assemblies, pp. 21-32, Taipei, Taiwan, December 10-12, 2002.

Thermal Characteristics of Glass-Metal Composition Plasma Display Panels, M. Lee and M. Pecht, IEEE Transactions on Advanced Packaging, Vol. 25, No. 4, pp. 488-494, 2002.

Design Guidelines for Avoiding Flex Crac king in Ceramic Capacitors, C. Hillman, N. Blattau, and D. Barker, Pr oceedings of the National Electronic Packaging and Production Conference (NEPCON -West), CA version pp. 318-326, San Jose, CA, December 2002.

Fretting Corrosion Studies For Lead-Free Alloy Plated Contacts, J. Wu and M. Pecht, Proceedings of the 4th Electronics Packaging Technology Conference, Singapore, pp. 20-24, December 10-12, 2002.

The IEEE Standards on Reliability Program and Reliability Prediction Methods for Electronic Equipment, M. Pecht, D. Das, A. Ramakrishnan, Microelectronics Reliability, Vol. 42, pp. 1259-1266, 2002.

Calculation and Mitigation of Power Plane Resonance in Printed Circuit Boards (PCB), V. Subramanian and O. Ramahi, In Proc. IEEE Antennas and Propagation Society/URSI International Symposium, San Antonio, TX, June 16-21, 2002.

A Detailed Cost Model for Concurrent Use With Hardware/Software Co-Design, D. Ragan, P. Sandborn, and P. Stoaks, Proc. IEEE Design Automation Conference, pp. 269-274, New Orleans, LA, June 2002.

A Review of Reliability Prediction Methods for Electronic Devices, B. Foucher, J. Boullie, B. Meslet and D. Das, Microelectronics Reliability, Vol. 42, No. 8, pp. 1155-1162, August, 2002.

Impact of Environmental Regulations on Electronics Manufacture, Use and Disposal, R. Ciocci, J. Wu and M. Pecht, European Microelectronics Packaging and Interconnection Symposium, Cracow, Poland, pp. 73-80, June 16-18, 2002.

The "Trouble Not Identified" Phenomenon in Automotive Electronics, D. Thomas, K. Ayers and M. Pecht, Microelectronics Reliability, Vol. 42, pp. 641-651, 2002.

Tracking Semiconductor Part Changes Through the Part Supply Chain, S. Murray, M. Boru, M. Pecht and D. Erhart, IEEE Transactions on Components and Packaging Technologies, Vol. 25, No. 2, pp. 230-238, June 2002.

Lifetime RC Time Delay of On-Chip Copper Interconnect, M. Sun, M. Pecht and D. Barbe, IEEE Transactions on Semiconductor Manufacturing, Vol. 15, No. 1, pp. 253-259, May 2002.

Using PEEC and FDTD to Solve the Challenge Delay Line Problem, B. Archambeault, A. Roden and O. Ramahi, IEEE International Symposium on Electromagnetic Compatibility, Montreal, Canada, Aug. 13-17, 2001.

Full-Wave Analysis of Delay Lines, O. Ramahi, and B. Archambeault, 14th International Zurich Symposium and Technical Exhibition on Electromagnetic Compatibility, Zurich, Switzerland, Feb. 20-22, 2001.

Prediction of Shielding Degradation Arising from Variation in Contact Impedance of Inter-metallic Junctions, L. Li and O. Ramahi, IEEE Antennas and Propagation Society International Symposium, Boston, MA, July 8-13, 2001.

Manufacturer Assessment Procedure and Criteria for Parts Selection and Management, T. Syrus, M. Pecht, and R. Uppalapati, IEEE Transactions on Electronics Packaging Manufacturing, Vol. 24, No. 4, pp. 351-358, October 2001.

Rapid Reliability Assessment of ULSI Electronics, P. McCluskey, Proceedings of the 18th International VLSI Multilevel Interconnection, held in Santa Clara, CA, November 28-29, 2001.

Process Capability and Product Reliability, B. Ramakrishnan, P. Sandborn and M. Pecht, Microelectronics Reliability, Vol. 41, No. 12, pp. 2067-2070, December 2001.

Using Yielded Cost as a Metric for Modeling Manufacturing Processes, D. Becker and P. Sandborn, Proc. ASME 6th Design for Manufacturing Conference, Pittsburgh PA, September 2001.

Fundamental Reliability Issues Associated with a Commercial Particle-in-Elastomer Interconnection System, W. Liu, M. Pecht and J. Xie, IEEE Transactions on Components and Packaging Technologies, Volume 24, No. 3, pp. 520-525, September, 2001.

Reliability Engineering in the 21st Century - A Focus on Predicting the Reliability of Electronic Products and Systems, M. Pecht, Proceedings of The 5th ICRMS 2001, Vol. 1, pp. 1-19, 28-31, Dalian, China, August, 2001.

Fatigue of Chip Scale Package Interconnects Due to Cyclic Bending, S. Shetty, V. Lehtinen, A. Dasgupta and V. Halkola and T. Reinikainen, Journal of Electronic Packaging, Vol. 123, Issue 3, pp. 302-308, September 2001.

Application-Specific Economic Analysis of Integral Passives, P. A. Sandborn, B. Etienne, and G. Subramanian, IEEE Trans. on Electronics Packaging Manufacturing, Vol. 24, No. 3, pp. 203-213, July 2001.

On the Use of Yielded Cost in Modeling Electronic Assembly Processes, D. Becker and P. Sandborn, IEEE Trans. on Electronics Packaging Manufacturing, Vol. 24, No. 3, pp. 195-202, July 2001.

Lead-free Solder and the Consumer Electronics Market, R. Ciocci, Proceedings of 2001 Green Engineering Conference, Roanoke, VA, July 29-31, 2001.

Lifecycle Forecasting of ASICs, Z. Huang, P. Sandborn, M. Pecht and R. Solomon, Future Circuits International, Issue 7, pp. 101-107, Technology Publishing Ltd, London, UK, 2001.

Application-Specific Economic Analysis of Integral Passives, B. Etienne and P. A. Sandborn, Proceedings of the IMAPS Advanced Packaging Materials Processes, Properties and Interfaces Symposium, Braselton GA, pp. 399-404, March 2001.

An Investigation of the Mechanical Behavior of Conductive Elastomer Interconnects, J. Xie, M. Pecht, D. DeDonato and A. Hassanzadeh, Microelectronics Reliability, Vol. 41, No. 1, pp. 281-286, 2001.

Fatigue and Intermetallic Formation in Lead Free Solder Die Attach, P. McCluskey, Proceedings of IPACK'01, The Pacific Rim/ASME International Electronic Packaging Technical Conference and Exhibition, Kauai, HI, July 9-13, 2001.

We STILL have a headache with Arrhenius, M. Osterman, Electronics Cooling, Vol. 7, No. 1, pp 53-54, February 2001.

Palladium-plated Packages: Creep Corrosion and Its Impact on Reliability, J. Xie and M. Pecht, Advanced Packaging, pp. 39-42, February 2001.

Guidelines to Select Underfills for Flip Chip on Board Assemblies and Compliant Interposers for Chip Scale Package Assemblies, J. Okura, S. Shetty, B. Ramakrishnan, A. Dasgupta, J. Caers and T. Reinikainen, Microelectronics Reliability, Vol. 40, No. 7, pp. 1173-1180, July 2000.

Semiconductor Companies in China, W. Liu, M. Pecht and D. Hodges, Semiconductor International, Vol. 23, N0. 10, pp. 148-154, September 2000.

A Comparison with Taiwan, M. Pecht, W. Liu and D. Hodges, Semiconductor International, Vol. 23, N0. 10, pp. 135-136, September 2000.

Newer Fabs in China, M. Pecht, W. Liu and D. Hodges, Semiconductor International, Vol. 23, N0. 10, pp. 156-162, September 2000.

Trends in China's Semiconductor Industry, M. Pecht, W. Liu and D. Hodges, Semiconductor International, Vol. 23, N0. 10, pp. 134-144, September 2000.

Virtual Prototyping Printed Circuit Boards, P. Sandborn, The Board Authority, vol. 2, no. 4, pp. 6-10, December 2000.

Chinese Electronics Industry in the Year 2000, C. Lee, M. Pecht, and Y. Chen, IMAPS Taiwan Technical Symposium 2000, Session 4, pp. 289-302, 2000.

Equipment Supplier Intervention Techniques, C. A. Schwach, A. Mathur, R. Solomon, P. Sandborn, and M. Pecht, Future EMS International, No. 3, pp. 97-100, 2000.