Gas and Oil Well Applications: Articles

CALCE EPSC faculty and research staff have collectively authored over 25 internationally acclaimed textbooks and well over 250 research publications relevant to achieving quality and sustainability of electronic systems. To access a comprehensive list of CALCE publications, click here. A sublist of these publications that is of particular importance and interest to the gas and oil well industries is presented below.

• Electronic Part Obsolescence Driven Product Redesign Optimization, P. Singh, P. Sandborn, T. Geiser and D. Lorenson, International Journal of Advanced Manufacturing Systems, to be published in 2004.

• Creep and High-Temperature Isothermal Fatigue of Pb-Free Solders, Q. Zhang, A. Dasgupta and P. Haswell, Proceedings of IPACK 03: International Electronic Packaging Technical Conference and Exhibition, July 6-11, 2003, Maui, Hawaii, USA.

  Plastic Ball-Grid-Arrays (PBGA): Are They Ready for Environmentally Harsh Aerospace Applications?, R. Guha, D. Humphrey, K. Prodromides, T. Burnette, T. Koschmieder, M. Osterman, H. Qi, J. Kennedy and J. Veum, 02WAC-149, World Aviation Congress & Display (WAC), Phoenix, Arizona, November 5-7, 2002.

  A Review of Reliability Prediction Methods for Electronic Devices, B. Foucher, J. Boullie, B. Meslet and D. Das, Microelectronics Reliability, Vol. 42, No. 8, pp. 1155-1162, August, 2002.

  Defining Accelerated Test Requirements for PWBs: A Physics-Based Approach, K. Cluff and M. Osterman, presented at IPC Printed Circuits Expo 2002, Long Beach Convention Center, Long Beach, CA, March 24-28, 2002.

• The Business, Product Liability and Technical Issues Associated with Using Electronic Parts Outside the Manufacturer's Specified Temperature Range, M. Pecht and R. Biagini, Pan Pacific Microelectronics Symposium, pp. 391-398, Maui, Hawaii, February 5-7, 2002. 
• Microsystem Packaging for High Temperature and Harsh Environments, L. Chen and P. McCluskey, MST (Microsystems) News, pp. 41-42, September 2001.
• Parameter Recharacterization: A Method of Thermal Uprating, D. Das, N. Pendse, C. Wilkinson, and M. Pecht, IEEE Transactions on Components and Packaging Technologies, Vol. 24, No. 4, pp. 729-737, December 2001.
• Reliability Engineering in the 21st Century - A Focus on Predicting the Reliability of Electronic Products and Systems, M. Pecht, Proceedings of The 5th ICRMS 2001, Vol. 1, pp. 1-19, 28-31, August, 2001, Dalian, China.
• A Demonstration of Virtual Qualification for the Design of Electronic Hardware, J. Cunningham, R. Valentin, C. Hillman, A. Dasgupta, and M. Osterman, ESTECH 2001, IEST, Phoenix, AZ, April 2001.
• A Web-Based Graduate Course on the Mechanical Design of High Temperature and High Power Electronics, P. McCluskey, Proceedings of the Electronic Component and Technology Conference (ECTC), pp. 397-400, Lake Buena Vista, FL, May 30, 2001.
• Electronic Hardware Reliability, A. Ramakrishnan, T. Syrus and M. Pecht, Avionics Handbook, pp. 22-1 to 22-21, CRC Press, Boca Raton, Florida, December 2000.
• Method for Assessing Remaining Life in Electronic Assemblies, P. McCluskey, J. Kweon, J. Kim and H. Jeon, Microelectronics Reliability, Vol. 40, No. 2, pp. 293-306, 2000.
• Reliable Use of Commercial Technology in High Temperature Environments, P. McCluskey, K. Mensah, C. O'Connor and A. Gallo, Microelectronics Reliability, Vol. 40, No. 8-10, pp. 1671-1678, Aug. - Oct. 2000.
• High Temperature Performance of Polymer Film Capacitors, R. Grzybowski and P. McCluskey, International Journal of Microelecronic Packaging, Vol. 1, pp. 153-158, 1998.
• Packaging of Electronics for High Temperature Environments, P. McCluskey, D. Das, J. Jordan, L. Condra, T. Torri, J. Fink and R. Grztbowski, International Journal of Microcircuits and Electronics Packaging, Vol. 20, No. 3, 1998.
• Packaging of Power Electronics for High Temperature Applications, P. McCluskey, D. Das, J. Jordan, L. Condra, R. Gryzbowski, T. Torri and J. Fink, Advanced Microelectronics, Vol. 25, No. 1, pp. 19-24, Jan/Feb 1998. 
• Reliability Concerns in High Temperature Electronic Systems, P. McCluskey, R. Grzybowski, L. Condra, D. Das, J. Fink, J. Jordan and T. Torri, 1998 Engineering Foundation Conference on High Temperature Electronic Materials, Devices and Sensors, San Diego, CA, February 22-27, 1998.
• Packaging of Electronics for High Temperature Applications, P. McCluskey, D. Das, J. Jordan, R. Grzybowski, J. Fink, L. Condra and T. Torri, International Journal of Microcircuits and Electronic Packaging, Vol. 20, No. 3, 3rd Quarter, 1997.
• Perspectives to Understand Risks in the Electronic Industry, A. Dasgupta, E. Magrab, D. Anand, K. Eisinger, J. McLeish M. Torres, P. Lall and T. Dishongh, IEEE Transaction on Components Packaging and Manufacturing Technology - Part A, Vol. 20, No. 4, pp. 542-547, December 1997. 
• Reducing Time-to-Market Using Virtual Qualification, P. McCluskey, M. Pecht and S. Azarm, Proceedings, Institute of Environmental Sciences, pp. 148-152, 1997.
• Temperature as a Reliability Factor, M. Pecht, P. Lall and E. Hakim, Thermal Management of Electronic System II, Kluwer Academic Publishers, Belgium, pp. 27-41, 1997.
• Packaging Reliability for High Temperature Electronics: A Materials Focus, P. McCluskey, L. Condra, T. Torri and J. Fink, Microelectronics International, No. 41, pp. 23-26, September 1996.
• Characterization of Functional Relationship Between Temperature and Microelectronic Reliability, P. Lall, M. Pecht and E. Hakim, Microelectronics and Reliability, Vol. 35(3), pp. 377-402, March 1995.
• Physics-of-Failure: An Approach to Reliable Product Development, M. Pecht and A. Dasgupta, Journal of the Institute of Environmental Sciences, Vol. 38, pp. 30-34, September/October 1995 also in 1995 International Integrated Reliability Workshop Final Report, Lake Tahoe, CA, pp. 1-4, October 22-25, 1995.
• Temperature as a Reliability Factor, M. Pecht, P. Lall and E. Hakim, Eurotherm Seminar No. 45 : Thermal Management of Electronic Systems , pp. 36.1-36.22, 1995.
• Test-Time Compression for Qualification Testing of Electronic Systems: A Case Study, J. Hu, A. Dasgupta and T. Rothman, Proceedings of the Annual Reliability & Maintainability Symposium, pp. 246-252, January 1995.

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