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Gas and Oil Well Applications: Resources
Since 1984, nearly $45M has been invested in developing
innovative methodologies to decrease life-cycle risks for the next
generation of electronic products and systems, and to provide an
educational and technological infrastructure for their rapid
dissemination and use. We now offer an extensive set of resources to
help engineers assess, mitigate, and manage risks in electronic
products. These include web-based documents and tools to: conduct
parts selection and management; conduct cost-effective accelerated
testing and screening; predict reliability based on physics of
failure and using virtual qualification software; design using
components outside their rated temperature; design and utilize high
temperature electronics; and model life cycle economics.
CalcePWA and CADMP II reliability assessment software was
developed at CALCE EPSC over the past 15 years. It is the most
advanced reliability assessment and virtual qualification tools
currently available providing engineers with a silicon-to-systems
accelerated product qualification capabilities. To access more
information on the CALCE software products, click here.
The center offers a wide access to a collection of web-based
documents, called webbooks, that cover areas of critical importance
in electronic products and system development, ranging from
solder-joint fatigue analysis and accelerated test development to
cost analysis and supply chain management. To access a complete list
of CALCE webbooks and their short descriptions, click
here.
Webbooks of particular interest to the gas and oil well industries are listed below:
- Accelerated Product Qualification and Quality Assurance
This online resource presents interactive physics-of-failure guidelines
for accelerated product qualification and quality assurance. The
material is intended to give electronics manufacturers, suppliers,
managers, analysts, and engineers a rational understanding of efficient
ways to assess product durability and quality. Further, the fundamental
concepts required to develop a successful physics-of-failure based
accelerated qualification and quality assurance program that meets the
product requirements, lowers life-cycle costs and reduces the
time-to-market are addressed in detail through interactive
case-studies. The valuable lessons learned are outlined as a set of
generic guidelines to help design, plan, and implement a PoF based
accelerated qualification program. Contact: Dr. Abhijit Dasgupta, Dr.
Keith Rogers, [software, presentations, tutorials, case studies, and
reports].
- High Temperature Electronic Packaging
This interactive guidebook for the development of electronic systems
for use at temperatures above 125 °C/ Provides information for each
package element. Information includes material properties, failure
mechanisms, failure models, and manufacturing sites. Contact: Dr.
Patrick McCluskey, Dr. Diganta Das, [presentations, interactive online
guidebook, book chapters and references].
- Influence of Temperature on Microelectronics and System Reliability
An authoritative source on the effects of temperature on
microelectronic device failure mechanisms. The document covers the
important issues of steady state temperature dependent models,
temperature effects associated with temperature cycling, temperature
gradient, and time dependent temperature changes. It identifies models
quantifying the temperature effects on various package elements, and
address of the impacts of various design for temperature trade-offs on
electronic systems. Temperature related models are assessed in terms of
their use for determining the maximum and minimum allowable thermal
stresses for a given system architecture. Contact: Dr. Michael Pecht
and Dr. Diganta Das, [book chapters and references].
- Integrated Circuit, Hybrid and MCM Package Design Guidelines
A handbook providing descriptions of critical failure mechanisms for a
wide range of packaging elements in IC, hybrid and multi-chip module
packages. It also gives fundamental models for assessing the
susceptibility for failure of these electronic products. Contact:
Dr.Michael Pecht, [book chapters and references].
- Long Term Non-Operating Reliability of Electronic Products
Electronics can experience a range of environments subsequent to
manufacture and prior to disposal. Non-operating electronics do not
necessarily experience benign environments. The potential environmental
stresses on non-operating electronics can be natural, such as those due
to climatic conditions, or can be induced by humans. This book examines
non-operating electronics reliability issues, outlining and discussing
storage conditions, the stresses that can arise in these conditions,
and the failure mechanisms that can cause a failure. Contact: Dr.
Michael Pecht and Dr. Diganta Das, [book chapters and references].
- Moisture Diffusion and Corrosion in Electronics
This webbook provides tutorials, bibliographies, and research work
associated with moisture diffusion and corrosion in electronic systems.
Moisture ingress into electronic assemblies can have many deleterious
effects. In plastic encapsulated microelectronics (PEMs), moisture can
cause or attribute to reliability problems such as popcorning,
cracking, delamination and corrosion of the metalization at the die
surface. Moisture in printed wiring boards can lead to corrosion,
oxidation , and dendritic growth. Corrosion can cause degradation in
electrical and mechanical performance of the electronic systems, and
eventually, opens or shorts. Contact: Dr. Michael Osterman, [tutorials, presentations, and references].
- Plas
tic
Encapsulated Microelectronics (including, PEM
Encyclopedia, and PEM
Bibliography)
An interactive guide including a webbook, a bibliography, and
online movies, provides a state of current technology and guidelines
for use, manufacturing and purchasing of Plastic Encapsulated
Microcircuits (PEMs). The webbook presents the science and technology
behind PEMs. The advantages of using plastic packages, and the state of
the current technology are discussed. A perspective on future trends in
plastic encapsulation, especially on chip technology, packaging,
design, materials selection, manufacturing processes, device
integration and application-specific reliability is included. Also
included is a bibliography of a wide range of critical publications in
the fields of PEM manufacture, use, and reliability. Contact: Dr.
Michael Pecht and Dr. Diganta Das, [book chapters, references,
bibliography and online movies].
- Root
Cause Identification for Failure in PWBs
The purpose of failure analysis is to determine the root-cause
of what, why, how, and where products can fail. Expert systems,
which use decision trees and material data to create solutions
to complex problems, can provide users with improved
problem-solving capabilities without the expense of additional
employees or facilities. This expert system for failure
analysis, developed by the CALCE Research Center, provides
designers, manufacturers, and users of electronic products a
powerful tool in identification and corrective/preventive
actions. At this time, our expert system is set up only for
failures at the printed wiring board, but will soon include all
possible failure mechanisms and defects that can occur in
electronic products and systems. Contact: Dr. Michael Osterman,
[interactive database and tutorials].
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