CALCE Electronic Products and Systems Consortium 

One of the major efforts of the CALCE Center is the CALCE Electronic Products and Systems Consortium, a successful international industry-government-academic partnership, sponsored by over 100 major international organizations from all sectors of the electronics industry. Consortium research projects are performed on an annual basis and are developed in collaboration with the Consortium members.

Recent Consortium projects of particular interest to the telecommunications  industry are the following:

2004 Consortium Research Projects

• Logistics and Cost Analysis for Pb-free Implementation
• Accelerated Qualification of Pb-free Electronics Assemblies
• Mechanical Durability Characterization of Pb-free Sn3.0Ag0.5Cu Solders
• Effect of Temperature Cycle on the Durability Pb-free Interconnects (Sn-Ag-Cu and Sn-Ag)
• Guideline for Finite Element Analysis of Solder Joint Fatigue Assessment
• Intermetallic-Related Embrittlement of Pb-free Solder Die Attach
• Investigation of Whisker Growth in Sn Finished Surface
• Characterization of Non-Conductive Adhesives Interconnects
• Qualification and Reliability Assessment of New Capacitor Technology
• Degradation of Multilayer Ceramic Chip Capacitors in High Humidity
• Reliability Assessment of High Density IC Sockets and Tests for the Causes of Failure
• Environmental Degradation of Polymer Waveguides
• Methodology for Equipment Manufacturer Intervention in their Supply Chain
• Reliability Capability Assessment for Contractors and Vendors
• High Performance Cold Plates with Micro-Structured Grooved Surfaces
• Advanced Liquid Cooled Module for Cooling of High Flux Electronics
• Spot Cooling of High Flux and Commercial Electronics
• Thermal Characterization of Die Attach Adhesives
• PoF-based Screening Methodology for Electronic Assemblies
• Analysis of Intermittent Failures in Electronic
• Introduction of 3-D Image Correlation Measurement Method and Reliability Assessment for FBGA under Thermal Loading Conditions
• Development of PoF Based Virtual Qualification Methodology for COF Packages Phase II

2003 Consortium Research Projects

• Risks to Equipment Manufacturers from the Incremental Transition to Lead Free Electronics in the Supply Chain
• Creep Corrosion over PEM Package with Noble Metal Plated Leadframes
• Risk Assessment & Accelerated Qualification of Lead Free Electronics
• Characterization of Anisotropic Conductive Adhesives
• The Effects of No-Clean Flux and Alternative Finishes on Electrochemical Migration
• Thermal Management Solutions for Low Volume Complex Electronic Systems
• Optimization and Reliability of Power Modules with Advanced Cooling Systems
• Electrical Analysis and Characterization of Flex Circuits and Interconnects
• Embedded Passives Demonstrator ?Embedded Capacitor Reliability
• Smaller Optical Fiber Bend Radius with Acceptable Risk

2002 Consortium Research Projects

• Review and Assessment of Telcordia Reliability Specifications
• Degradation of High-Frequency Signals through Traces Plated with Alternative Finishes and Lead-Free Solder
• Characterization of Fiber and Epoxy Stresses in Physical Contact Fiber Optic Connectors
• Reliability of Optical Interfaces to MEMS
• Embedded Passive Reliability and Tradeoff Analysis
• Influence of Intermetallic on the Durability of Lead-Free Solder Interconnects
• Constitutive Relationships of Binary Lead-Free Solder
• Accelerated Thermal Cycling Tests for Lead-Free Assemblies
• Durability Characterization of Lead-Free Solders
• Electrical Leakage in Printed Wiring Assemblies
• Creep Corrosion Over Noble Plating Material
• Characterization of Anisotropic Conductive Adhesives

2001 Consortium Research Projects

• Effect of Proof Testing on Optical Fiber Fusion Splices
• Constitutive Relationships of Lead-Free Solders Materials
• Durability of Lead Free Solders
• Influence of Intermetallics on Durability of Lead-Free Solder Interconnects
• Characterization of Conductive Adhesives  
• Reliability Issues with Microvias in HDI and Build-up Substrates (Continued)
• Integral and Integrated Passives Webbook Update
• Development and Validation of Electronic Distributor Assessment Methodology
• Implementing the Failure Free Operating Period Process
• Advanced Cooling concepts for 100 W/cm?and Higher Heat Removal
• Thermal Management of Power Electronics Modules
• Electromagnetic Compatibility and Interference Testing Facility
• Impact of Environmental Regulations on Electronics Manufacture, Use and Disposal
• Effect of Lead Free Solder Reflow Profiles on the Component Integrity
• Electrical Characterization of Lead-Free Solder Separable Contact Interface

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