CALCE News^©

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Published issues:

Fall 2007 Spring 2007 Fall 2006 Spring 2006 Fall 2005 Spring 2005 -CALCE EPSC Offers Design Reviews and Reliability Capability Audit Programs for Companies -CALCE Leads Sensor Roadmapping Efforts at NEMI -Guideline Development for Assessment of Lead Refinishing by Solder Dipping -CALCE Finds that Pb-free Electronics Can Be More Reliable, but Not Always -Reliability Assessment of Electronic Assemblies under High-G (Artillery Launch) Loads -Humidity Degradation of Base Metal Electrode Multilayer Ceramic Capacitors -Prediction of Transient Component-Board Heat Transfer -CALCE Wins NSF Grant to Work on Forecasting Electronic Part Obsolescence -Samsung Techwin Engineers and Prof. B. T. Han Win Gold Award for Best Paper -CALCE Offering Course at SEMI-THERM -Dr. Valérie Eveloy Joins CALCE EPSC -New Thermal Characterization Equipment Acquired by CALCE EPSC Fall/Winter 2004 -Integrated Health Monitoring and Prognostics for Electronic Products and Systems -Reliability Training for Companies -CALCE EPSC Long-term Lead-free Reliability Studies -Using Carbon Fibers in Electronic Interconnects -CALCE EPSC Six Sigma Workshop -CALCE EPSC Decision Support Model for Prognostic Health Management -Sensor and MEMS Efforts at CALCE EPSC -Heat Treatment, Tin Whisker Study -CALCE Investigates Product Take-back -Advances in Thermal Management -Major Grants Awarded to Prof. B. Han -Prof. M. Pecht Made Honorary Professor -New CALCE Research Scientists Spring/Summer 2004 -CALCE Pb-free Simulation Capabilities -Dr. Das Develops Six Sigma Materials for Celestica -CALCE Pioneers Noise Mitigation Designs for High-speed PCBs -Effect of Flip-chip Package Warpage on Thermal Interfaces -Failure Analysis and Virtual Qualification of PBGA Under Multiple Environmental Loadings -Extreme Environment Electronics Efforts at CALCE EPSC Fall/Winter 2003 -Message from the Director -Lead-Free Software IP Management -CALCE Develops Wireless Monitoring of Environmental Data -New Test Economics Models Optimize Functional Test Placement in Manufacturing Processes -Low Temperature Electronics Research -CALCE Develops and Implements Uprateability Risk Assessment Criteria -Test and Analysis in the Global Marketplace -Failure in BME Capacitors -Moisture Expansion Can Cause More Stress Than Thermal Expansion -CALCE Center Provides Six Sigma Training Material -Professor Sandborn Receives Invention of the Year Award -CALCE MOCA 1.3 Software Released -New Package Decapsulator at the Center Spring/Summer 2003 -CALCE R&D Model Influential Around the World -Intellectual Property and Lead-Free Solders -Effect of Mold Compound Swelling on PEM Reliability -Power Electronics Reliability Efforts at the CALCE EPSC -Electrochemical Migration on Printed Wiring Boards -CALCE Provides Root Cause Analysis for ESD Failures -CALCE/University of Missouri Collaboration on Unique Radiation Shielding -CALCE Collaborating with Merix on NSF Premise Program Grant Summer/Fall 2002 -Message from the Director -CALCE Expands New EMI/EMC Facilities -Lead-Free Research at CALCE: An Update -Phosphorus Molding Compounds -Risks of Conductive Whiskers in Electronics from Pure Tin Coatings -Using Scanning SQUID Microscopy for Detecting Electrical Shorts -Cost Model for Concurrent Use with Hardware/Software Co-design -New Research on Obsolescence Management -Equipment Donations Spring 2002 -Uprating Stirs Debate -Reliability Assessment of Critical Oil Exploration and Recovery Electronics -Selecting and Managing a PCB Supplier -Obsolescence Cost Analysis Software Tool -Failure Mechanisms in LEDs and Laser Diodes -Hollow Fibers and Conductive Filament Formation -Directions for Selecting Molding Compounds for Flip-Chip Devices -CALCE EPSC and City University of Hong Kong Establish Joint FA Lab -IEEE Guidebook 1413.1 Winter 2001 -Remaining Life Assessment for Critical Space Electronics Performed at CALCE -Lead-free Initiative at CALCE: An Update -calcePWA Virtual Qualification Used on Honeywell Engine Control Module -Ceramic Capacitor Failure on the Rise -Release of CADMP-II Version 2.6 -Embedded Passives Cost Analysis Software -Assessment of Plasma Display Panel (PDP) Technology at CALCE -Anechoic Chamber: Greater Electromagnetic Research and Testing Capabilities at CALCE Spring 2001 -New Equipment to Benefit Members -Electromagnetic Radiation: A Growing Concern in Electronic Products Design -Lead-free Initiatives at CALCE -CALCE Consortium Telecommunications Working Group Meets -NASA/CALCE Collaborative Partnership -CALCE Performs Chip-scale Package (CSP) Qualification for Raytheon -CALCE Embedded Passive Models Used in NEMI 2000 Roadmap -CALCE Develops Web-based Courseware for Electronic Products Cost Analysis -Avionics Roadmap 2000 Conference: a Success -CALCE Contract Assembly Website Completed -Addressing New Strategies for Ensuring Reliability of Printed Circuit Assemblies Summer/Fall 2000 -CALCE Center - First Academic Research Institution to be ISO 9001 Certified -CALCE Laboratory Services Summary -CALCE Consortium Addresses Lead-free Solder Durability Concerns -Research in Portable Electronics Gains Attention from Industry -CALCE Adds Advanced Photomechanics Capabilities -CALCE Leads Development of Power Electronics Technology -CALCE Center Contribute to IEC Standards Development -CALCE Center Spearheads IEEE Reliability Standards Development -ATMEL Uses CALCE Research Results as their SMT Assembly Guideline August 1999 -Legal Issues of Uprating -CALCE Conducts Virtual Qualification on AAAV -CALCE Awarded Contract to Study Embedded Passives -Optoelectronics Faculty Receive NSF Industry Matching Award for LED Reliability Project -Benchmarking Activities with Lucas Aerospace -CALCE Study on Plastic Packaged GaAs and AlGaAs LED's Enters Analysis Stage -Litton-AMECON Digital MCM Trade-off Analysis -Study on Variable Frequency Microwave Cure Process for Electronic Packages is Completed -Failure Analysis for the Next Millennium -Fiber Sensors Used in CALCE Studies on Fiber Connector Pistoning February 1999 -CALCE Members Demonstrate Accelerated Qualification on Production Hardware -CALCE Awarded Contract to Study RF MEMS Technology -CALCE Forms 3D Integration Alliance -CALCE Parts Selection and Management Benchmarking Activities -CALCE Selected for Air Force Contract Award -CALCE Awarded SRC Contract on Thermal Management -On-Line Solder Joint Failure Analysis Tools Address Industry Needs -IEEE 1413 Reliability Prediction Standard Approval and Subsequent Efforts -Electronic Components Alliance Grows as the Need for Virtual Qualification Grows September 1998 -CALCE Releases Web-based Handbook for Accelerated Testing -Parts Selection and Management Progress -CALCE Educational Initiative Wins National Award -CALCE and ISIS Initiate Collaboration -A Tool for Virtual Risk Assessment of Microelectronic Components -CalcePWA Models in IcePack February 1998 -CALCE Consortium Projects Summary June 1997 -Increased Synergism in CALCE Research -Commercial Insertion Success Story - RoughWriter 365 -CalcePWA Migrates to Sun Solaris 2.5 -Plasma Cleaning Added To Green Manufacturing Research Program -CALCE Studies Encapsulated And Underfill Assembly Using Variable   Frequency Microwave Source -CALCE Researchers Work To Develop Next Generation Automobiles -Laser Flash Thermal Measurement Capability Acquired By CALCE -Designing it Right the First Time with CADMP-II January 1997 -CALCE and Member Company Share Uprating Success -CALCE Graduates Sought After By Industry -CALCE Addresses Industry Concerns -Are Your Packages Popcorning? -A New Method for Real-Time Observation of Processing and Aging Sequences in Solder August 1996 -CALCE Efforts in High-Temperature Electronics -CALCE Receives NCMS Award to Study Lead-free Solders -CALCE Optoelectronics Group Now Focusing on Adhesive Epoxies for Fiber Optic Applications -Ruggedization of Laptop Computers for Mobile Applications -Electronics Products and Reliability (EPAR) Study Program for M.S. and Ph.D.s -Contact and Connector Studies -New Equipment Acquisitions -CALCE Electronic Packaging Manufacturing Lab -MEMs-Based Packaging -Solder Paste Process Control -CALCE Students' Summer Cooperative Projects -Directed Studies in Critical Technologies Award February 1996 -Laser Inspection System Donation -Ion Mobility in Molding Compounds -High Temperature Electronics TRP -Laser Diode Thermal Management Modeling -Optoelectronic Reliability Assessment August 1995 -Timely Product Development -Health Management of Electronic Systems -Long Term Storage Reliability of PEMs -CALCE Offers Services to Qualify PQFPs and PBGAs for Popcorning -Electronic Equipment Physics-of-Failure -Thermal Management of Portable Electronic Equipment -Parts Selection February 1995 - Electronics at Elevated Temperatures - Popcorn-free Manufacturing with PEMs - Conductive Filament Formation Workshop - Electronic Packaging E-SEM Applications - Characterization of Non-woven-fiber PCBs - Passive Cooling of Vented Enclosures September 1994 - Reliability of Uncooled Infrared Sensors - Knowledge Based Design Advisor - Material Characterization CRADA - Accelerated Testing of Surface Mount - CADMP-II Software v1.0 Released - System Level Thermal Control Simulation - Patran Interface February 1994 - Electronic Packaging of Power Supplies - In-plane Motion Under Vibration Loading - Derating Project Sponsored by SRC - Reliability of Electronics at the Box-level - Phase Change Materials - Phase Change Material Slurry - Connector Reliability - Surface Mount Capacitor Reliability - Through-hole Connectors - Accelerated Testing - Electro-optics Physics-of-Failure Project September 1993 - Combined Vibration and Thermal Loading - Highly Accelerated Stress Tests - Tensile Tests of Polyimide Films in E-SEM - Radiation Effects Facilities - A New Model for Solder Joint Fatigue - Physics of Failure for Microelectronics - Unix Software Released - Optoelectronic Research Center May 1993 - Defense Conversion and Dual Use - Plastic Package Reliability Study - Materials Database Available - Beta Version of POF Software Released - Statistical Distribution Software Available - Design for Environmental Compatibility - Vibration Assessment of Wedge Locks - Reliability of Electronic Boxes - Wear Testing of Connectors January 1993 - FEA Modeling For REL-TECH - Plastic Encapsulation of Microelectronics - Boeing-DoD Qualification Studies for SMA - Connector Reliability Modeling - Workshop on Temperature Effects August 1992 - Plastic Package Effort - Thermal-Mechanical Properties of Flex Circuits - PWB Failure Identification - FEA Modeling For REL-TECH - Texas Instruments Integrates CALCE Software for R&M Engineering Workstation January 1992 - Investigation of Potential Failure Mechanisms of HDI Packages - Physics of Failure Based Package Compiler Software for Design and Reliability Assessment - Connector Reliability Modeling - Manufacturing Qualification, Design and Reliability Testing of Analog Integrated Circuits on GaAs - Diamond Substrates for Low Cost Packaging September 1991 - Endurance Testing of Ceramic vs. Plastic IC in High Temperature and Humidity   Environment Yields Important Results - An Alternative Wire Bond Test - CALCE and Westinghouse Collaborate on AWACS Project - Litton - CALCE Plated-Through-Hole Study - Diamond Heat Sinks For Advanced Packaging - Investigations with LPS - Boeing Commercial Airplanes Group Funds Expanded Effort to Develop An Improved Design   Model for Electronic Packaging - Center Research on Reliability of MMICs - Collins Avionics and CALCE Study Cathodic-Anodic Filament - Investigations Into the Effects of Temperature Continue With Phase II Support - The Performs Vibration Test and Simulation of Advanced Circuit Boards for    General Dynamics - Characterization of Packaging Materials a Student Edition of CALCE Software January 1991 - New Thrust in Cost Effectiveness of Electronics Designs - Summaries of Recent Significant Technical Activities - CALCE Center Applies Concurrent Engineering Concepts to MIMICs - Study on the Influence of Temperature on IC Reliability