| Objectives | Background | Approach |
Microelectronics devices have various polymer interfaces such as chip/underfill, solder mask/PCB, etc. Strong interface (or bond strength) is one of the most critical requirements for a reliable device. In addition, the interfaces are often degraded after exposing the devices to humid and/or corrosive environments. The most common tests for adhesion strength are pull test and shear test. The results from the typical pull or shear tests are extremely sensitive to the edge condition, resulting large scatters in the test data. This study proposes to develop an advanced test to cope with the problems associated with the existing methods. The interfacial fracture toughness concept will be incorporated in the method to produce a repeatable test data with minimum scatter.