| Objectives | Background | Approach |
To create a web book to aid members in the thermal uprating of
electronic parts.
The CALCE research center is an internationally recognized leader in electronic parts uprating. Over the past five years, CALCE has developed and validated uprating methodologies, collaborated with members of the uprating community, participated in international standards development activities, organized conferences and industry workshops, and published several key articles. During our work in this field, it was found that a great deal of time is spent gathering and verifying information required for uprating. This process of information gathering is often repetitive in nature, and is not always value-added. An information infrastructure is therefore essential for successful and timely decision making regarding uprating. Questions that frequently arise include:
Currently this type of information is available only from fragmented sources. Many of the sources also have economic interests in the outcome of the uprating process, and therefore the information they provide may be biased. There is a need for a unified and dependable source of such information. The IECQ avionics working group guidebook on uprating will represent an industry consensus document of the methods of uprating, but because of its nature will not provide an associated database of information for use in the application of these methods.
The uprating guidebook under development by the Avionics Working Group of the IECQ brings together some of the information on uprating methods agreed upon by industry. However, the procedure for modifying and updating the IECQ guidebook does not allow for it to be updated quickly or frequently, and the guidebook document does not contain a database. The uprating web book being proposed will combine the contents of the guidebook with the experience of the CALCE center and its consortium members. The uprating web book will contain information on topics such as:
The information provided in this web book will be based on broad part groups (e.g., DRAM, digital logic), and not on specific part numbers.