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CALCE Consortium Research Agenda for 2000/2001

The following projects were presented to the CALCE Consortium Members on October 14, 2000 and have been approved for study during the 2001 research year by the Director of the CALCE Electronics Products and Systems Consortium. For general inquiries, please contact Ms. Joan Lee.

Member's View

C01-01 Constitutive Relationships of Lead-Free Solders Materials

Determine constitutive relationships of a lead-free solder from isothermal mechanical tests.
Provide guidelines for accelerated stress testing.

C01-02 Durability of Lead-Free Solders

Use the thermo-mechanical-microstructural (TMM) test apparatus to assess the durability of the leading candidate lead free solder alloy, Sn3.9Cu0.6Ag.

C01-03 Influence of Intermetallics on Durability of Lead-Free Solder Interconnects
To assess the potential for intermetallic growth between the Pb free solder attach and the metallization on the chip, lead, or substrate surface. To determine the effect of intermetallic growth on the adhesion strength at the attach/substrate interface, or lead/attach interface and relate it to time-to-failure in assemblies.

C01-04 Characterization of Conductive Adhesives

Use experimental techniques and PoF simulation to assess the constitutive and thermomechanical durability performance of a selected anisotropic conductive adhesive (ACA).

C01-05 Guidebook on the Use of PEMs at High Altitudes and in Space

To produce a guidebook for the use of PEMs in high altitude environments, especially ones including exposure to rapid altitude cycling.

C01-06 MEMS Sensors and Carrier-Level Reliability

TDevelop necessary metrology techniques and perform environmental testing to identify and document the dominant defects, failure mechanisms, failure modes, and failure sites in hermetic and non-hermetic MEMS-based systems consisting of sensors, actuators, chip-to-chip bonded parts, and electro-optical interfaces.

C01-07 Design for Reliability of Liquid Crystal Displays
To develop reliability assessment and design decision support software capability for liquid crystal displays.

C01-08 Reliability Issues with Microvias in HDI and Build-up Substrates (Continued)
Provide understanding of reliability issues associated with use of Microvia and other Build-up Technologies for advanced printed wire board construction.

C01-09 Development of Advanced Polymer Interface Adhesion Test

To develop a repeatable procedure for adhesion test specimens, and
To develop an advanced experimental technique to measure adhesion strength of polymer interfaces

C01-11 Integral and Integrated Passives Web Book Update
Complete an updated review of state-of-the-art integral and integrated passive technologies. Compare size, cost, and performance for systems constructed with and without integral or integrated passive components (resistors and capacitors). Develop guidelines for determining when and how it makes sense to include integral and/or integrated passives within a system (i.e., what system characteristics, if any, indicate the opportunity for cost savings through the use of integral or integrated passives).
Specific objectives of the modeling portion of this project are to: (1) establish a model to compare the potential cost-savings of using embedded passives and take into account the cost-adders of using more complex interconnects, and (2) validate this cost-model using a Boeing-Anaheim supplied design as well as other selected industry suppliers.

C01-12 Investigation of Electrical Parameter Aging due to Environmental Stresses

To determine if electrical parameter aging is a potential concern in the performance assessment of electronic parts.

C01-13 Development of an Uprating Web Book
To create a web book to aid members in the thermal uprating of electronic parts.

C01-14 Assessment of Electrical Test Laboratories as Component Source Facilities

To construct a set of criteria and an assessment procedure to evaluate electrical test laboratories which intend to provide services as "Component Source Facilities."

C01-15 Development and Validation of Electronic Distributor Assessment Methodology

To develop, validate, and document a methodology for electronic part distributor assessment.

C01-16 Electronics Technology Insertion into Low Volume Complex Electronics Systems (LVCES)
To create a guidebook for the low volume complex electronics systems (LVCES) industry in order to enable risk-informed technology insertion by providing a single source knowledge base of

risks in the LVCES business
technology trends that affect the development of LVCES
risk analysis of technology insertion with a case study on risk of using low voltage parts in LVCES
risk control guidelines

C01-17 Probabilistic Simulation in the Virtual Qualification Process

This project will incorporate and demonstrate probabilistic simulation within the virtual qualification process. Further, the process for examining multiple failure sites and the ability to generate iso-time-to-failure curves will be developed for individual failure mechanisms.

C01-18 Implementing the Failure Free Operating Period Process

To provide the mathematical background for failure free operating period (FFOP) implementation, including how to calculate the FFOP, how to obtain confidence limits, and how to prepare qualification testing (sample size, time to first failure etc.). FFOP and associated confidence limit prediction for systems subject to multiple failure mechanisms as well as both series and parallel systems will be addressed.

C01-19 Life Consumption Monitoring

Obtain and implement a prototype device capable of monitoring real and accelerated environment and usage data of equipment in a form that can be made compatible with the input requirements of existing CALCE physics-of-failure (PoF) models.
Produce a strategy that supports the incorporation of groups of these devices in a process that enables the effective management of critical lifed items in a through life context.

C01-20 Design for Reliability of a High Temperature Automotive Electronic Module

To develop guidelines for the design and manufacture of electronic systems for use in automotive underhood applications, focusing on issues of materials compatibility and process compatibility at high temperatures.

C01-21 Reliability Models for Insertion Mount Interconnects in Printed Wiring Board Assemblies

This project will provide PoF software and guidelines for evaluating the durability of package interconnects for through hole insertion components when used in printed wiring assemblies.

C01-22 Vibration Fatigue Model for BGAs

Provide easy to use failure model to access the life of a BGA under vibration loading.

C01-23 Thermo-Mechanical Fatigue Model for Surface Mount Connectors

This project will provide software models for the rapid assessment of solder joint failures in components where the leaded length of the component is much larger than the other dimension, e.g. surface mount connectors.

C01-24 Advanced Cooling Concepts for 100 W/cm2 and Higher Heat Removal
To construct and evaluate compact, cost-effective high performance thermosyphons using various synthetic high thermal conductivity materials, with potential for easy integration into packaging for high heat flux applications.

C01-25 Thermal Management of Power Electronics Modules

C01-26 Electromagnetic Compatibility and Interference Testing Facility
Build an advanced EMI/EMC testing and measurements facility with the capability of measuring shielding-effectiveness and transfer-impedance changes with time to provide shielding degradation and shielding reliability assessment. Contribute to the establishment of appropriate methods and testing procedures.

C01-28 Drop Testing of Portable Consumer Electronic Devices

Identify the common weak link (interface/interconnection) in portable electronic products. This identification will guide the development of required modeling strategies to insure the design of rugged product.

C01-29 Test Tailoring Methodology for Impact Loading
A test methodology will be developed to simulate the fundamental aspects of impact loading encountered when a portable product is dropped. The accompanying PoF analysis needed to tailor the test and interpret the results will be defined. The principles will be demonstrated through a specific case study.

C01-30 Quantitative Damage Characterization of Portable Electronics Under Impact Loading

To develop a loading mechanism to simulate various impact loadings encountered in handling and operation
To develop an in-situ high sensitivity deformation measurement technique for the impact loading, and
To quantify the damage induced by the impact loading to evaluate the effect of impact loading on the fatigue damage.

C01-31 Optimization of Stress Profiles for Accelerated Testing

Demonstrate screening procedures developed in C98-40, C99-21 and C00-52, on functional assemblies at sponsor's site. This objective is a continuation of C00-52.
Demonstrate the effect of different temperature histories on thermal cycling damage in electronic assemblies and propose guidelines for maximum test-time compression in accelerated temperature cycling tests.

C01-33 Impact of Environmental Regulations on Electronics Manufacture, Use and Disposal

To track and compile forthcoming environmental legislation, directives, and consumer/environmentalist movement demands in the US, the European Union (EU), Japan and other countries, and to assess their effects on the electronics industry.

C01-34 Effect of Proof Testing on Optical Fiber Fusion Splices

We will perform a design of experiments study on fusion spliced optical fiber patch cords to determine the effect of proof testing coupled with temperature, humidity or bending stress on (1) optical return loss at the fusion splice and (2) ultimate pull strength of the fiber cord.

C01-35 CALCE Website Information Dissemination Effectiveness Study

This project will improve the effectiveness of CALCE web-based information dissemination systems. Specifically, this project will oversee the merger of CALCE and CADMP resources while implementing changes that speed up locating information and tools that facilitate product design and research activities. This includes the CALCE and CADMP resources.

C01-36 Effect of Lead Free Solder Reflow Profiles on the Component Integrity

Evaluate the impact of lead-free reflow soldering process on electronic components
Determine risk of increased thermomechanical mismatch and hygromechanical mismatch on various components

C01-37 Electrical Characterization of Lead-Free Solder Separable Contact Interface

Determine the contact resistance versus contact force characteristics of Sn3.9Ag0.6Cu, Sn0.7Cu and Sn3.5Ag solder separable contact interfaces.
Determine the contact resistance versus contact force characteristics as a function of aging for selectively aged selected lead-free solder alloys.
Determine the fretting corrosion behavior of the selected lead-free solder separable contact interfaces. (second year)

C01-38 Durability of Surface Mount Assemblies under Flexural Loads

To develop a methodology to assess the durability of surface mount interconnects due to PWB flexural deformations.

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C01-01	Constitutive Relationships of Lead-Free Solders Materials Determine constitutive relationships of a lead-free solder from isothermal mechanical tests. Provide guidelines for accelerated stress testing.
C01-02	Durability of Lead-Free Solders Use the thermo-mechanical-microstructural (TMM) test apparatus to assess the durability of the leading candidate lead free solder alloy, Sn3.9Cu0.6Ag.
C01-03	Influence of Intermetallics on Durability of Lead-Free Solder Interconnects To assess the potential for intermetallic growth between the Pb free solder attach and the metallization on the chip, lead, or substrate surface. To determine the effect of intermetallic growth on the adhesion strength at the attach/substrate interface, or lead/attach interface and relate it to time-to-failure in assemblies.
C01-04	Characterization of Conductive Adhesives Use experimental techniques and PoF simulation to assess the constitutive and thermomechanical durability performance of a selected anisotropic conductive adhesive (ACA).
C01-05	Guidebook on the Use of PEMs at High Altitudes and in Space To produce a guidebook for the use of PEMs in high altitude environments, especially ones including exposure to rapid altitude cycling.
C01-06	MEMS Sensors and Carrier-Level Reliability TDevelop necessary metrology techniques and perform environmental testing to identify and document the dominant defects, failure mechanisms, failure modes, and failure sites in hermetic and non-hermetic MEMS-based systems consisting of sensors, actuators, chip-to-chip bonded parts, and electro-optical interfaces.
C01-07	Design for Reliability of Liquid Crystal Displays To develop reliability assessment and design decision support software capability for liquid crystal displays.
C01-08	Reliability Issues with Microvias in HDI and Build-up Substrates (Continued) Provide understanding of reliability issues associated with use of Microvia and other Build-up Technologies for advanced printed wire board construction.
C01-09	Development of Advanced Polymer Interface Adhesion Test To develop a repeatable procedure for adhesion test specimens, and To develop an advanced experimental technique to measure adhesion strength of polymer interfaces
C01-11	Integral and Integrated Passives Web Book Update Complete an updated review of state-of-the-art integral and integrated passive technologies. Compare size, cost, and performance for systems constructed with and without integral or integrated passive components (resistors and capacitors). Develop guidelines for determining when and how it makes sense to include integral and/or integrated passives within a system (i.e., what system characteristics, if any, indicate the opportunity for cost savings through the use of integral or integrated passives). Specific objectives of the modeling portion of this project are to: (1) establish a model to compare the potential cost-savings of using embedded passives and take into account the cost-adders of using more complex interconnects, and (2) validate this cost-model using a Boeing-Anaheim supplied design as well as other selected industry suppliers.
C01-12	Investigation of Electrical Parameter Aging due to Environmental Stresses To determine if electrical parameter aging is a potential concern in the performance assessment of electronic parts.
C01-13	Development of an Uprating Web Book To create a web book to aid members in the thermal uprating of electronic parts.
C01-14	Assessment of Electrical Test Laboratories as Component Source Facilities To construct a set of criteria and an assessment procedure to evaluate electrical test laboratories which intend to provide services as "Component Source Facilities."
C01-15	Development and Validation of Electronic Distributor Assessment Methodology To develop, validate, and document a methodology for electronic part distributor assessment.
C01-16	Electronics Technology Insertion into Low Volume Complex Electronics Systems (LVCES) To create a guidebook for the low volume complex electronics systems (LVCES) industry in order to enable risk-informed technology insertion by providing a single source knowledge base of risks in the LVCES business technology trends that affect the development of LVCES risk analysis of technology insertion with a case study on risk of using low voltage parts in LVCES risk control guidelines
C01-17	Probabilistic Simulation in the Virtual Qualification Process This project will incorporate and demonstrate probabilistic simulation within the virtual qualification process. Further, the process for examining multiple failure sites and the ability to generate iso-time-to-failure curves will be developed for individual failure mechanisms.
C01-18	Implementing the Failure Free Operating Period Process To provide the mathematical background for failure free operating period (FFOP) implementation, including how to calculate the FFOP, how to obtain confidence limits, and how to prepare qualification testing (sample size, time to first failure etc.). FFOP and associated confidence limit prediction for systems subject to multiple failure mechanisms as well as both series and parallel systems will be addressed.
C01-19	Life Consumption Monitoring Obtain and implement a prototype device capable of monitoring real and accelerated environment and usage data of equipment in a form that can be made compatible with the input requirements of existing CALCE physics-of-failure (PoF) models. Produce a strategy that supports the incorporation of groups of these devices in a process that enables the effective management of critical lifed items in a through life context.
C01-20	Design for Reliability of a High Temperature Automotive Electronic Module To develop guidelines for the design and manufacture of electronic systems for use in automotive underhood applications, focusing on issues of materials compatibility and process compatibility at high temperatures.
C01-21	Reliability Models for Insertion Mount Interconnects in Printed Wiring Board Assemblies This project will provide PoF software and guidelines for evaluating the durability of package interconnects for through hole insertion components when used in printed wiring assemblies.
C01-22	Vibration Fatigue Model for BGAs Provide easy to use failure model to access the life of a BGA under vibration loading.
C01-23	Thermo-Mechanical Fatigue Model for Surface Mount Connectors This project will provide software models for the rapid assessment of solder joint failures in components where the leaded length of the component is much larger than the other dimension, e.g. surface mount connectors.
C01-24	Advanced Cooling Concepts for 100 W/cm2 and Higher Heat Removal To construct and evaluate compact, cost-effective high performance thermosyphons using various synthetic high thermal conductivity materials, with potential for easy integration into packaging for high heat flux applications.
C01-25	Thermal Management of Power Electronics Modules
C01-26	Electromagnetic Compatibility and Interference Testing Facility Build an advanced EMI/EMC testing and measurements facility with the capability of measuring shielding-effectiveness and transfer-impedance changes with time to provide shielding degradation and shielding reliability assessment. Contribute to the establishment of appropriate methods and testing procedures.
C01-28	Drop Testing of Portable Consumer Electronic Devices Identify the common weak link (interface/interconnection) in portable electronic products. This identification will guide the development of required modeling strategies to insure the design of rugged product.
C01-29	Test Tailoring Methodology for Impact Loading A test methodology will be developed to simulate the fundamental aspects of impact loading encountered when a portable product is dropped. The accompanying PoF analysis needed to tailor the test and interpret the results will be defined. The principles will be demonstrated through a specific case study.
C01-30	Quantitative Damage Characterization of Portable Electronics Under Impact Loading To develop a loading mechanism to simulate various impact loadings encountered in handling and operation To develop an in-situ high sensitivity deformation measurement technique for the impact loading, and To quantify the damage induced by the impact loading to evaluate the effect of impact loading on the fatigue damage.
C01-31	Optimization of Stress Profiles for Accelerated Testing Demonstrate screening procedures developed in C98-40, C99-21 and C00-52, on functional assemblies at sponsor's site. This objective is a continuation of C00-52. Demonstrate the effect of different temperature histories on thermal cycling damage in electronic assemblies and propose guidelines for maximum test-time compression in accelerated temperature cycling tests.
C01-33	Impact of Environmental Regulations on Electronics Manufacture, Use and Disposal To track and compile forthcoming environmental legislation, directives, and consumer/environmentalist movement demands in the US, the European Union (EU), Japan and other countries, and to assess their effects on the electronics industry.
C01-34	Effect of Proof Testing on Optical Fiber Fusion Splices We will perform a design of experiments study on fusion spliced optical fiber patch cords to determine the effect of proof testing coupled with temperature, humidity or bending stress on (1) optical return loss at the fusion splice and (2) ultimate pull strength of the fiber cord.
C01-35	CALCE Website Information Dissemination Effectiveness Study This project will improve the effectiveness of CALCE web-based information dissemination systems. Specifically, this project will oversee the merger of CALCE and CADMP resources while implementing changes that speed up locating information and tools that facilitate product design and research activities. This includes the CALCE and CADMP resources.
C01-36	Effect of Lead Free Solder Reflow Profiles on the Component Integrity Evaluate the impact of lead-free reflow soldering process on electronic components Determine risk of increased thermomechanical mismatch and hygromechanical mismatch on various components
C01-37	Electrical Characterization of Lead-Free Solder Separable Contact Interface Determine the contact resistance versus contact force characteristics of Sn3.9Ag0.6Cu, Sn0.7Cu and Sn3.5Ag solder separable contact interfaces. Determine the contact resistance versus contact force characteristics as a function of aging for selectively aged selected lead-free solder alloys. Determine the fretting corrosion behavior of the selected lead-free solder separable contact interfaces. (second year)
C01-38	Durability of Surface Mount Assemblies under Flexural Loads To develop a methodology to assess the durability of surface mount interconnects due to PWB flexural deformations.